-
Patent Agency Ranking
公开(公告)号：US20220083109A1
公开(公告)日：2022-03-17
申请号：US17384971
申请日：2021-07-26
Applicant: Intel Corporation
Inventor： Raanan Sover , Eytan Mann , Rafi Ben-Tal , Richard S. Perry
Abstract: An electronic device may include a substrate having a substrate body. The electronic device may include a first interconnect region, for example located proximate to a first end of the substrate. The first interconnect region may extend from the substrate body. The first interconnect region may include a first set of interconnects, and the first set of interconnects may be located proximate to the substrate body. The first interconnect region may include a second set of interconnects, and the second set of interconnects may be located remote from the substrate body. The second set of interconnects may be physically separated from the first set of interconnects, for example by an inactive region. The first set of interconnects may be located between the inactive region and the substrate body.
-
公开(公告)号：US12095189B2
公开(公告)日：2024-09-17
申请号：US17134099
申请日：2020-12-24
Applicant: Intel Corporation
Inventor： Richard S. Perry , Robert Schum
CPC classification number: H01R12/727 , G06F1/185 , H01R12/523 , H01R12/7047 , H01R12/732 , G06F1/1635
Abstract: A board-to-board connector includes electrical leads to bridge from one board to another board, to interconnect pads on one surface of the boards. The boards can interconnect while one board is vertically offset from the other board with a top mount connector. The connector includes a lead frame having the electrical leads and the connector includes an alignment frame to hold the lead frame. The lead frame includes leads that have contact arms that are vertically offset from each other. The connector includes a conductive case to secure over the alignment frame. The connector includes screw holes to allow screws to secure the connector in place against the boards and ensure electrical connection between the pads on the two boards through the electrical leads of the connector. The alignment frame includes posts to mate with alignment holes in the boards.
-
公开(公告)号：US12184001B2
公开(公告)日：2024-12-31
申请号：US17134098
申请日：2020-12-24
Applicant: Intel Corporation
Inventor： Richard S. Perry , Robert Schum
IPC: H01R12/00 , H01R12/70 , H01R12/71 , H01R13/6581 , H01R13/6595
Abstract: A board-to-board connector includes electrical leads to bridge from one board to another board, to interconnect pads on one surface of the boards. The boards can interconnect while aligned in substantially the same plane with an inline connector. The connector includes a lead frame having the electrical leads and the connector includes an alignment frame to hold the lead frame. The connector includes a conductive case to secure over the alignment frame. The connector includes screw holes to allow screws to secure the connector in place against the boards and ensure electrical connection between the pads on the two boards through the electrical leads of the connector. The alignment frame includes posts to mate with alignment holes in the boards.
-
公开(公告)号：US11374322B2
公开(公告)日：2022-06-28
申请号：US16643722
申请日：2017-09-30
Applicant: INTEL CORPORATION
Inventor： Omer Asaf , Sidharth Dalmia , Trang Thai , Josef Hagn , Richard S. Perry , Jonathan C. Jensen , Raanan Sover
Abstract: Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.
-
公开(公告)号：US12300918B2
公开(公告)日：2025-05-13
申请号：US17479596
申请日：2021-09-20
Applicant: Intel Corporation
Inventor： Navneet Kumar Singh , Aiswarya M. Pious , Richard S. Perry , Amarjeet Kumar , Siva Prasad Jangili Ganga , Gaurav Hada , Sushil Padmanabhan , Konika Ganguly
Abstract: A connector to connect an electronic module to an edge of a first electronic circuit board is described. The module has a second electronic circuit board. The connector has a top part that houses a first row of I/Os. The top part is to be placed on a surface of the first electronic circuit board. The connector has a bottom part that houses a second row of I/Os. The bottom part is to be placed on an opposite surface of the first electronic circuit board, wherein, the top and bottom parts form inner and outer stand-offs when mater together. The inner stand-off is to reside within a through hole of the first electronic circuit board. The outer stand-off is to reside within free space off the edge of the first electronic circuit board. The second electronic circuit board is to be pressed in between the first row of I/Os and the second row of I/Os when the module is connected to the connector.
-
-
-
-
Search Results
5
records
(took 0.012 seconds)
