Abstract:
Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.
Abstract:
Disclosed herein are antenna boards, antenna modules, antenna board fixtures, and communication devices. For example, in some embodiments, a communication device may include an integrated circuit (IC) package, an antenna patch support, and one or more antenna patches coupled to the antenna patch support by solder or an adhesive.
Abstract:
Some demonstrative embodiments include devices, systems and/or methods of wireless communication via a dual directional antenna. For example, a device may include a hinge to connect between first and second elements to allow rotating the first element between first and second rotational states with respect to the second element, and a rotatable dual directional wireless communication antenna coupled to the hinge. The dual directional wireless communication antenna may be configured to communicate wireless communication signals in a first direction, when the first element is at the first rotational state, and to communicate the wireless communication signals in a second direction, different from the first direction, when the first element is at the second rotational state.
Abstract:
A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.
Abstract:
Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.
Abstract:
A two-phase immersion cooling system for an integrated circuit assembly may be formed utilizing boiling enhancement structures formed on or directly attached to heat dissipation devices within the integrated circuit assembly, formed on or directly attached to integrated circuit devices within the integrated circuit assembly, and/or conformally formed over support devices and at least a portion of an electronic board within the integrated circuit assembly. In still a further embodiment, the two-phase immersion cooling system may include a low boiling point liquid including at least two liquids that are substantially immiscible with one another.
Abstract:
Some demonstrative embodiments include devices, systems and/or methods of wireless communication via a dual directional antenna. For example, a device may include a hinge to connect between first and second elements to allow rotating the first element between first and second rotational states with respect to the second element, and a rotatable dual directional wireless communication antenna coupled to the hinge. The dual directional wireless communication antenna may be configured to communicate wireless communication signals in a first direction, when the first element is at the first rotational state, and to communicate the wireless communication signals in a second direction, different from the first direction, when the first element is at the second rotational state.
Abstract:
An electronic device may include a substrate having a substrate body. The electronic device may include a first interconnect region, for example located proximate to a first end of the substrate. The first interconnect region may extend from the substrate body. The first interconnect region may include a first set of interconnects, and the first set of interconnects may be located proximate to the substrate body. The first interconnect region may include a second set of interconnects, and the second set of interconnects may be located remote from the substrate body. The second set of interconnects may be physically separated from the first set of interconnects, for example by an inactive region. The first set of interconnects may be located between the inactive region and the substrate body.
Abstract:
A computing device includes a body, the body having a first and second portion. The computing device further includes a directional antenna, the directional antenna transmitting a signal having a preferred direction, the directional antenna located in the first portion of the body. The computing device further includes a reflector for reflecting the signal, the reflector located in the second portion of the body, the body having a first configuration where the first portion is aligned with the second portion such that the preferred direction is not aligned to intersect the reflector, the body having a second configuration where the first portion is aligned with the second portion such that the preferred direction is aligned to intersect the reflector.
Abstract:
An electronic device may include a substrate having a substrate body. The electronic device may include a first interconnect region, for example located proximate to a first end of the substrate. The first interconnect region may extend from the substrate body. The first interconnect region may include a first set of interconnects, and the first set of interconnects may be located proximate to the substrate body. The first interconnect region may include a second set of interconnects, and the second set of interconnects may be located remote from the substrate body. The second set of interconnects may be physically separated from the first set of interconnects, for example by an inactive region. The first set of interconnects may be located between the inactive region and the substrate body.