公开(公告)号：US11374322B2

公开(公告)日：2022-06-28

申请号：US16643722

申请日：2017-09-30

Applicant: INTEL CORPORATION

Inventor： Omer Asaf ,  Sidharth Dalmia ,  Trang Thai ,  Josef Hagn ,  Richard S. Perry ,  Jonathan C. Jensen ,  Raanan Sover

IPC: H01Q1/24 ,  H01Q9/04 ,  H01Q13/06

Abstract: Techniques for fabricating end-fire antennas are described. An example of an electronic device with an end-fire antenna includes a housing of the electronic device, and a circuit board comprising electronic components of the mobile electronic device. The circuit board is parallel with the major plane of the housing. The electronic device includes an antenna coupled to the circuit board. At least a portion of the antenna is oriented perpendicular to the first circuit board to generate a radiation pattern with an amplitude that is greater in the end-fire direction compared to the broadside direction.

公开(公告)号：US11211688B2

公开(公告)日：2021-12-28

申请号：US16638567

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Omer Asaf ,  Nir Weisman ,  Naftali Landsberg ,  Eyal Goldberger ,  Pablo Herrero ,  Harry G. Skinner

IPC: H01Q1/22 ,  H01Q21/06 ,  H01Q1/24 ,  H01Q1/52 ,  H01Q9/04

Abstract: Apparatuses and systems for millimeter-wave antennas are described. An apparatus comprises a board assembly, and a first and second antenna disposed within the board assembly. A third antenna can comprise a semiconductor antenna attached to the board assembly. A parasitic layer can be gap-coupled to the first and second antenna. The first and second antenna can include a rectangular patch antenna and an annular ring antenna. Other aspects are described.

公开(公告)号：US20200091608A1

公开(公告)日：2020-03-19

申请号：US16472830

申请日：2017-12-20

Applicant: Intel Corporation

Inventor： Erkan Alpman ,  Arnaud Lucres Amadjikpe ,  Omer Asaf ,  Kameran Azadet ,  Rotem Banin ,  Miroslav Baryakh ,  Anat Bazov ,  Stefano Brenna ,  Bryan K. Casper ,  Anandaroop Chakrabarti ,  Gregory Chance ,  Debabani Choudhury ,  Emanuel Cohen ,  Claudio Da Silva ,  Sidharth Dalmia ,  Saeid Daneshgar Asl ,  Kaushik Dasgupta ,  Kunal Datta ,  Brandon Davis ,  Ofir Degani ,  Amr M. Fahim ,  Amit Freiman ,  Michael Genossar ,  Eran Gerson ,  Eyal Goldberger ,  Eshel Gordon ,  Meir Gordon ,  Josef Hagn ,  Shinwon Kang ,  Te Yu Kao ,  Noam Kogan ,  Mikko S. Komulainen ,  Igal Yehuda Kushnir ,  Saku Lahti ,  Mikko M. Lampinen ,  Naftali Landsberg ,  Wook Bong Lee ,  Run Levinger ,  Albert Molina ,  Resti Montoya Moreno ,  Tawfiq Musah ,  Nathan G. Narevsky ,  Hosein Nikopour ,  Oner Orhan ,  Georgios Palaskas ,  Stefano Pellerano ,  Ron Pongratz ,  Ashoke Ravi ,  Shmuel Ravid ,  Peter Andrew Sagazio ,  Eren Sasoglu ,  Lior Shakedd ,  Gadi Shor ,  Baljit Singh ,  Menashe Soffer ,  Ra'anan Sover ,  Shilpa Talwar ,  Nebil Tanzi ,  Moshe Teplitsky ,  Chintan S. Thakkar ,  Jayprakash Thakur ,  Avi Tsarfati ,  Yossi Tsfati ,  Marian Verhelst ,  Nir Weisman ,  Shuhei Yamada ,  Ana M. Yepes ,  Duncan Kitchin

IPC: H01Q9/04 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q1/24 ,  H01Q5/47 ,  H01Q3/24 ,  H01Q21/24 ,  H04B1/3827 ,  H04B15/04 ,  H04B7/0456 ,  H04B7/06 ,  H03L7/14

Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

公开(公告)号：US11955732B2

公开(公告)日：2024-04-09

申请号：US18089220

申请日：2022-12-27

Applicant: Intel Corporation

Inventor： Erkan Alpman ,  Arnaud Lucres Amadjikpe ,  Omer Asaf ,  Kameran Azadet ,  Rotem Banin ,  Miroslav Baryakh ,  Anat Bazov ,  Stefano Brenna ,  Bryan K. Casper ,  Anandaroop Chakrabarti ,  Gregory Chance ,  Debabani Choudhury ,  Emanuel Cohen ,  Claudio Da Silva ,  Sidharth Dalmia ,  Saeid Daneshgar Asl ,  Kaushik Dasgupta ,  Kunal Datta ,  Brandon Davis ,  Ofir Degani ,  Amr M. Fahim ,  Amit Freiman ,  Michael Genossar ,  Eran Gerson ,  Eyal Goldberger ,  Eshel Gordon ,  Meir Gordon ,  Josef Hagn ,  Shinwon Kang ,  Te Yu Kao ,  Noam Kogan ,  Mikko S. Komulainen ,  Igal Yehuda Kushnir ,  Saku Lahti ,  Mikko M. Lampinen ,  Naftali Landsberg ,  Wook Bong Lee ,  Run Levinger ,  Albert Molina ,  Resti Montoya Moreno ,  Tawfiq Musah ,  Nathan G. Narevsky ,  Hosein Nikopour ,  Oner Orhan ,  Georgios Palaskas ,  Stefano Pellerano ,  Ron Pongratz ,  Ashoke Ravi ,  Shmuel Ravid ,  Peter Andrew Sagazio ,  Eren Sasoglu ,  Lior Shakedd ,  Gadi Shor ,  Baljit Singh ,  Menashe Soffer ,  Ra'anan Sover ,  Shilpa Talwar ,  Nebil Tanzi ,  Moshe Teplitsky ,  Chintan S. Thakkar ,  Jayprakash Thakur ,  Avi Tsarfati ,  Yossi Tsfati ,  Marian Verhelst ,  Nir Weisman ,  Shuhei Yamada ,  Ana M. Yepes ,  Duncan Kitchin

IPC: H01Q9/04 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q5/47 ,  H01Q21/24 ,  H03L7/14 ,  H04B1/3827 ,  H04B7/0456 ,  H04B7/06 ,  H04B15/04

CPC classification number: H01Q9/0414 ,  H01Q1/243 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q5/47 ,  H01Q21/24 ,  H03L7/145 ,  H04B1/3827 ,  H04B7/0482 ,  H04B7/0639 ,  H04B15/04

Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

公开(公告)号：US20200220249A1

公开(公告)日：2020-07-09

申请号：US16638567

申请日：2018-09-28

Applicant: Intel Corporation

Inventor： Omer Asaf ,  Nir Weisman ,  Naftali Landsberg ,  Eyal Goldberger ,  Pablo Herrero ,  Harry G. Skinner

IPC: H01Q1/22 ,  H01Q21/06 ,  H01Q9/04 ,  H01Q1/24 ,  H01Q1/52

Abstract: Apparatuses and systems for millimeter-wave antennas are described. An apparatus comprises a board assembly, and a first and second antenna disposed within the board assembly. A third antenna can comprise a semiconductor antenna attached to the board assembly. A parasitic layer can be gap-coupled to the first and second antenna. The first and second antenna can include a rectangular patch antenna and an annular ring antenna. Other aspects are described.

公开(公告)号：US10566298B2

公开(公告)日：2020-02-18

申请号：US16072262

申请日：2016-04-01

Applicant: INTEL CORPORATION

Inventor： Sidharth Dalmia ,  Ana M. Yepes ,  Pouya Talebbeydokhti ,  Miroslav Baryakh ,  Omer Asaf

IPC: H01L23/34 ,  H01L23/66 ,  H01Q1/22 ,  H01L23/552 ,  H01L21/56 ,  H01L21/768 ,  H01L23/31 ,  H01L23/522 ,  H01L23/00 ,  H01Q21/06

Abstract: Wireless modules having a semiconductor package attached to an antenna package is disclosed. The semiconductor package may house one or more electronic components as a single die package and/or a system in a package (SiP) implementation. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The antenna package and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.

公开(公告)号：US12218408B2

公开(公告)日：2025-02-04

申请号：US17231051

申请日：2021-04-15

Applicant: Intel Corporation

Inventor： Trang Thai ,  Sidharth Dalmia ,  Raanan Sover ,  Josef Hagn ,  Omer Asaf ,  Simon Svendsen

IPC: H01Q1/24 ,  H01L23/64 ,  H01L23/66 ,  H01Q9/04 ,  H01Q21/06

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include: an antenna feed substrate including an antenna feed structure, wherein the antenna feed substrate includes a ground plane, the antenna feed structure includes a first portion perpendicular to the ground plane and a second portion parallel to the ground plane, and the first portion is electrically coupled between the second portion and the first portion; and a millimeter wave antenna patch.

公开(公告)号：US12066517B2

公开(公告)日：2024-08-20

申请号：US17326133

申请日：2021-05-20

Applicant: Intel Corporation

Inventor： Naftali Landsberg ,  Woorim Shin ,  Dan Ohev Zion ,  Meir Gordon ,  Omer Asaf ,  Danniel Nahmanny ,  Mustafijur Rahman ,  Stefano Pellerano

IPC: G01S13/34 ,  G01S13/88 ,  H03F3/21 ,  H04B1/04 ,  G01S13/931

CPC classification number: G01S13/342 ,  G01S13/881 ,  H04B1/0483 ,  G01S13/931 ,  G01S2013/93271 ,  H04B2001/0408

Abstract: Some demonstrative aspects include radar apparatuses, devices, systems and methods. In one example, an apparatus may include a plurality of Transmit (Tx) chains to transmit radar Tx signals, and a plurality of Receive (Rx) chains to process radar Rx signals. For example, the radar Rx signals may be based on the radar Tx signals. The apparatus may be implemented, for example, as part of a radar device, for example, as part of a vehicle including the radar device. In other aspects, the apparatus may include any other additional or alternative elements and/or may be implemented as part of any other device.

公开(公告)号：US20220384956A1

公开(公告)日：2022-12-01

申请号：US17734529

申请日：2022-05-02

Applicant: Intel Corporation

Inventor： Erkan Alpman ,  Arnaud Lucres Amadjikpe ,  Omer Asaf ,  Kameran Azadet ,  Rotem Banin ,  Miroslav Baryakh ,  Anat Bazov ,  Stefano Brenna ,  Bryan K. Casper ,  Anandaroop Chakrabarti ,  Gregory Chance ,  Debabani Choudhury ,  Emanuel Cohen ,  Claudio Da Silva ,  Sidharth Dalmia ,  Saeid Daneshgar Asi ,  Kaushik Dasgupta ,  Kunal Datta ,  Brandon Davis ,  Ofir Degani ,  Amr M. Fahim ,  Amit Freiman ,  Michael Genossar ,  Eran Gerson ,  Eyal Goldberger ,  Eshel Gordon ,  Meir Gordon ,  Josef Hagn ,  Shinwon Kang ,  Te Yu Kao ,  Noam Kogan ,  Mikko S. Komulainen ,  Igal Yehuda Kushnir ,  Saku Lahti ,  Mikko M. Lampinen ,  Naftali Landsberg ,  Wook Bong Lee ,  Run Levinger ,  Albert Molina ,  Resti Montoya Moreno ,  Tawfiq Musah ,  Nathan G. Narevsky ,  Hosein Nikopour ,  Oner Orhan ,  Georgios Palaskas ,  Stefano Pellerano ,  Ron Pongratz ,  Ashoke Ravi ,  Shmuel Ravid ,  Peter Andrew Sagazio ,  Eren Sasoglu ,  Lior Shakedd ,  Gadi Shor ,  Baljit Singh ,  Menashe Soffer ,  Ra'anan Sover ,  Shilpa Talwar ,  Nebil Tanzi ,  Moshe Teplitsky ,  Chintan S. Thakkar ,  Jayprakash Thakur ,  Avi Tsarfati ,  Yossi Tsfati ,  Marian Verhelst ,  Nir Weisman ,  Shuhei Yamada ,  Ana M. Yepes ,  Duncan Kitchin

IPC: H01Q9/04 ,  H01Q5/47 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q21/24 ,  H03L7/14 ,  H04B1/3827 ,  H04B7/0456 ,  H04B7/06 ,  H04B15/04

Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

公开(公告)号：US11424539B2

公开(公告)日：2022-08-23

申请号：US16472830

申请日：2017-12-20

Applicant: Intel Corporation

Inventor： Erkan Alpman ,  Arnaud Lucres Amadjikpe ,  Omer Asaf ,  Kameran Azadet ,  Rotem Banin ,  Miroslav Baryakh ,  Anat Bazov ,  Stefano Brenna ,  Bryan K. Casper ,  Anandaroop Chakrabarti ,  Gregory Chance ,  Debabani Choudhury ,  Emanuel Cohen ,  Claudio Da Silva ,  Sidharth Dalmia ,  Saeid Daneshgar Asl ,  Kaushik Dasgupta ,  Kunal Datta ,  Brandon Davis ,  Ofir Degani ,  Amr M. Fahim ,  Amit Freiman ,  Michael Genossar ,  Eran Gerson ,  Eyal Goldberger ,  Eshel Gordon ,  Meir Gordon ,  Josef Hagn ,  Shinwon Kang ,  Te Yu Kao ,  Noam Kogan ,  Mikko S. Komulainen ,  Igal Yehuda Kushnir ,  Saku Lahti ,  Mikko M. Lampinen ,  Naftali Landsberg ,  Wook Bong Lee ,  Run Levinger ,  Albert Molina ,  Resti Montoya Moreno ,  Tawfiq Musah ,  Nathan G. Narevsky ,  Hosein Nikopour ,  Oner Orhan ,  Georgios Palaskas ,  Stefano Pellerano ,  Ron Pongratz ,  Ashoke Ravi ,  Shmuel Ravid ,  Peter Andrew Sagazio ,  Eren Sasoglu ,  Lior Shakedd ,  Gadi Shor ,  Baljit Singh ,  Menashe Soffer ,  Ra'anan Sover ,  Shilpa Talwar ,  Nebil Tanzi ,  Moshe Teplitsky ,  Chintan S. Thakkar ,  Jayprakash Thakur ,  Avi Tsarfati ,  Yossi Tsfati ,  Marian Verhelst ,  Nir Weisman ,  Shuhei Yamada ,  Ana M. Yepes ,  Duncan Kitchin

IPC: H01Q5/47 ,  H01Q9/04 ,  H01Q1/24 ,  H01Q1/38 ,  H01Q1/48 ,  H01Q3/24 ,  H01Q21/24 ,  H03L7/14 ,  H04B1/3827 ,  H04B7/0456 ,  H04B7/06 ,  H04B15/04

Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.