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公开(公告)号：US20190019694A1
公开(公告)日：2019-01-17
申请号：US16136965
申请日：2018-09-20
发明人： Alan E. Humphrey , James H. Duvall , Jerry Broz
摘要： A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
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公开(公告)号：US10406568B2
公开(公告)日：2019-09-10
申请号：US16290789
申请日：2019-03-01
发明人： Alan Humphrey , Jerry Broz , James H. Duvall
摘要： A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.
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公开(公告)号：US20130333128A1
公开(公告)日：2013-12-19
申请号：US13971619
申请日：2013-08-20
发明人： Alan E. Humphrey , James H. Duvall , Jerry Broz
IPC分类号： H01L21/67
CPC分类号： H01L21/67011 , B08B1/001 , B08B1/04 , B24B37/34 , C23C16/0227 , G03F7/70925 , H01L21/67028 , Y10T29/49826
摘要： A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
摘要翻译： 用于清洁或与例如集成芯片制造装置的组件组合的清洁晶片或基板。 清洁基板可以包括具有变化的预定表面特征的基板，例如一个或多个预定粘合剂，非粘性，静电，投影，凹陷或其它物理部分。 预定特征可以提供更有效地清洁它们所使用的部件，例如集成芯片制造装置来代替集成芯片晶片。 可以通过真空，机械，静电或其他力将清洁基板推动到清洁或其它位置。 清洁基板可以适于实现各种功能，包括研磨或抛光。 清洁基板可以通过新的制造方法制成，然后可以用于与芯片制造装置结合使用的新颖方法。
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公开(公告)号：US10109504B2
公开(公告)日：2018-10-23
申请号：US15419840
申请日：2017-01-30
发明人： Alan E. Humphrey , James H. Duvall , Jerry Broz
摘要： A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
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公开(公告)号：US09595456B2
公开(公告)日：2017-03-14
申请号：US13971619
申请日：2013-08-20
发明人： Alan E. Humphrey , James H. Duvall , Jerry Broz
CPC分类号： H01L21/67011 , B08B1/001 , B08B1/04 , B24B37/34 , C23C16/0227 , G03F7/70925 , H01L21/67028 , Y10T29/49826
摘要： A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
摘要翻译： 用于清洁或与例如集成芯片制造装置的组件组合的清洁晶片或基板。 清洁基板可以包括具有变化的预定表面特征的基板，例如一个或多个预定粘合剂，非粘性，静电，投影，凹陷或其它物理部分。 预定特征可以提供更有效地清洁它们所使用的部件，例如集成芯片制造装置来代替集成芯片晶片。 可以通过真空，机械，静电或其他力将清洁基板推动到清洁或其它位置。 清洁基板可以适于实现各种功能，包括研磨或抛光。 清洁基板可以通过新的制造方法制成，然后可以用于与芯片制造装置结合使用的新颖方法。
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公开(公告)号：US20200303217A1
公开(公告)日：2020-09-24
申请号：US16895106
申请日：2020-06-08
发明人： Alan E. Humphrey , James H. Duvall , Jerry Broz
摘要： A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
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公开(公告)号：US20170136500A1
公开(公告)日：2017-05-18
申请号：US15419840
申请日：2017-01-30
发明人： Alan E. Humphrey , James H. Duvall , Jerry Broz
CPC分类号： H01L21/67011 , B08B1/001 , B08B1/04 , B24B37/34 , C23C16/0227 , G03F7/70925 , H01L21/67028 , Y10T29/49826
摘要： A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
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公开(公告)号：US20130198982A1
公开(公告)日：2013-08-08
申请号：US13725827
申请日：2012-12-21
发明人： Alan E. Humphrey , James H. Duvall , Jerry Broz
IPC分类号： B08B1/00
CPC分类号： H01L21/67011 , B08B1/001 , B08B1/04 , B24B37/34 , C23C16/0227 , G03F7/70925 , H01L21/67028 , Y10T29/49826
摘要： A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one ore more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
摘要翻译： 用于清洁或与例如集成芯片制造装置的组件组合的清洁晶片或基板。 清洁基板可以包括具有变化的预定表面特征的基底，例如一个或多个预定粘合剂，非粘性，静电，突出，凹陷或其它物理部分。 预定特征可以提供更有效地清洁它们所使用的部件，例如集成芯片制造装置来代替集成芯片晶片。 可以通过真空，机械，静电或其他力将清洁基板推动到清洁或其它位置。 清洁基板可以适于实现各种功能，包括研磨或抛光。 清洁基板可以通过新的制造方法制成，然后可以用于与芯片制造装置结合使用的新颖方法。
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公开(公告)号：US10896828B2
公开(公告)日：2021-01-19
申请号：US16895106
申请日：2020-06-08
发明人： Alan E. Humphrey , James H. Duvall , Jerry Broz
摘要： A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
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公开(公告)号：US10741420B2
公开(公告)日：2020-08-11
申请号：US16136965
申请日：2018-09-20
发明人： Alan E. Humphrey , James H. Duvall , Jerry Broz
摘要： A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
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