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公开(公告)号:US11155428B2
公开(公告)日:2021-10-26
申请号:US16283603
申请日:2019-02-22
发明人: Mark M. Stark , Alan E. Humphrey
IPC分类号: B65H18/10 , B08B1/02 , B65H20/06 , B65H20/02 , B32B27/08 , B32B27/28 , B32B27/32 , B32B27/36 , C11D7/22 , C11D7/24 , C11D7/26 , C11D7/32 , C11D11/00 , C11D17/04 , B08B7/00 , G03G21/00 , B41F23/00 , B08B1/04
摘要: Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on moveable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and moveable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.
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公开(公告)号:US20210001378A1
公开(公告)日:2021-01-07
申请号:US16460918
申请日:2019-07-02
摘要: A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
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公开(公告)号:US10717618B2
公开(公告)日:2020-07-21
申请号:US16283607
申请日:2019-02-22
发明人: Mark M. Stark , Alan E. Humphrey
IPC分类号: B08B1/02 , B08B1/04 , B65H20/00 , B65H18/10 , B65H20/06 , B65H20/02 , B32B27/08 , B32B27/28 , B32B27/32 , B32B27/36 , C11D7/22 , C11D7/24 , C11D7/26 , C11D7/32 , C11D11/00 , C11D17/04 , B08B7/00 , G03G21/00 , B41F23/00
摘要: Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on movable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and movable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.
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公开(公告)号:US10406568B2
公开(公告)日:2019-09-10
申请号:US16290789
申请日:2019-03-01
发明人: Alan Humphrey , Jerry Broz , James H. Duvall
摘要: A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.
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公开(公告)号:US20190263613A1
公开(公告)日:2019-08-29
申请号:US16283592
申请日:2019-02-22
发明人: Mark M. Stark , Alan E. Humphrey
摘要: Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on moveable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and moveable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.
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6.
公开(公告)号:US20130333128A1
公开(公告)日:2013-12-19
申请号:US13971619
申请日:2013-08-20
发明人: Alan E. Humphrey , James H. Duvall , Jerry Broz
IPC分类号: H01L21/67
CPC分类号: H01L21/67011 , B08B1/001 , B08B1/04 , B24B37/34 , C23C16/0227 , G03F7/70925 , H01L21/67028 , Y10T29/49826
摘要: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.
摘要翻译: 用于清洁或与例如集成芯片制造装置的组件组合的清洁晶片或基板。 清洁基板可以包括具有变化的预定表面特征的基板,例如一个或多个预定粘合剂,非粘性,静电,投影,凹陷或其它物理部分。 预定特征可以提供更有效地清洁它们所使用的部件,例如集成芯片制造装置来代替集成芯片晶片。 可以通过真空,机械,静电或其他力将清洁基板推动到清洁或其它位置。 清洁基板可以适于实现各种功能,包括研磨或抛光。 清洁基板可以通过新的制造方法制成,然后可以用于与芯片制造装置结合使用的新颖方法。
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公开(公告)号:US11434095B2
公开(公告)日:2022-09-06
申请号:US16283613
申请日:2019-02-22
发明人: Mark M. Stark , Alan E. Humphrey
IPC分类号: B65H18/10 , B08B1/02 , B65H20/06 , B65H20/02 , B32B27/08 , B32B27/28 , B32B27/32 , B32B27/36 , C11D7/22 , C11D7/24 , C11D7/26 , C11D7/32 , C11D11/00 , C11D17/04 , B08B7/00 , B08B1/04 , G03G21/00 , B41F23/00
摘要: Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on moveable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and moveable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.
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8.
公开(公告)号:US20210146464A1
公开(公告)日:2021-05-20
申请号:US16855841
申请日:2020-04-22
发明人: Alan E. Humphrey , Jerry J. Broz , Bret A. Humphrey , Alex S. Poles , Wayne C. Smith , Janakraj Shivlal
摘要: A cleaning material, device, and method for predictably cleaning the capillary tube for a wire bonding machine in which the cleaning pad has a predetermined configuration appropriate for the particular wire bonding machine and a substrate having a defined functionalized surface topology and geometry which can be introduced into the wire bonding machine during the normal wire bonding operations. The cleaning material has a predetermined topography with a plurality of functional 3-dimensional (3D) microstructures that provide performance characteristics which are not possible with a non-functionalized and flat surface.
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公开(公告)号:US20210005499A1
公开(公告)日:2021-01-07
申请号:US16460877
申请日:2019-07-02
IPC分类号: H01L21/683 , B08B1/02
摘要: A device, mechanism, and methodology for regular and consistent cleaning of the vacuum aperture, nozzle, and contacting surfaces of a pick-and-place apparatus and the pick-up tools of automated or manual semiconductor device and die handling machines are disclosed. The cleaning material may include a cleaning pad layer with one or more intermediate layers that have predetermined characteristics, regular geometrical features, and/or an irregular surface morphology.
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公开(公告)号:US10361169B2
公开(公告)日:2019-07-23
申请号:US15723151
申请日:2017-10-02
摘要: A methodology and medium for regular and predictable cleaning the support hardware such as capillary tube in semiconductor assembly equipment components, while it is still in manual, semi-automated, and automated assembly are disclosed. The cleaning material may include a cleaning pad layer and one or more intermediate layers that have predetermined characteristics.
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