Working surface cleaning system and method

    公开(公告)号:US10406568B2

    公开(公告)日:2019-09-10

    申请号:US16290789

    申请日:2019-03-01

    IPC分类号: B08B7/00 B08B1/00 G01R3/00

    摘要: A cleaning film designed to remove foreign matter and particulates from working surfaces of cleaning wafers used in semiconductor processes. These processes include wafer sort test for cleaning of probe card pins and FEOL tooling for cleaning during wafer handling equipment and wafer chucks. The debris collected on the cleaning wafer working surfaces is removed by the particle removal film allowing the debris and foreign matter to be discarded. The use of the cleaning film allows the operator to refresh the cleaning wafer without use of an outside vendor and eliminates wet washing and the use of solvents in the cleaning process.

    NOVEL MATERIAL AND HARDWARE TO AUTOMATICALLY CLEAN FLEXIBLE ELECTRONIC WEB ROLLS

    公开(公告)号:US20190263613A1

    公开(公告)日:2019-08-29

    申请号:US16283592

    申请日:2019-02-22

    摘要: Novel materials and devices can remove small defects from long rolls of flexible electronics material while they are in continuous motion. The cleaning materials are designed to remove small particles without transferring defects or damaging the flexible electronics. The device generally consists of variable speed, motor-driven cylinders mounted on moveable brackets. The cylinders are capable of matching the speed of the cleaning material such that the cleaning material is always in contact with the web roll to be cleaned. The brackets are capable of rotating so the same material can be used more than once. Another material is used to remove debris from the cleaning material. A similar device consisting of motor-driven cylinders and moveable is used to apply the debris removal film to the cleaning film, allowing the cleaning film to be used multiple times.

    WAFER MANUFACTURING CLEANING APPARATUS, PROCESS AND METHOD OF USE
    6.
    发明申请
    WAFER MANUFACTURING CLEANING APPARATUS, PROCESS AND METHOD OF USE 审中-公开
    滤波器制造清洁装置,使用方法和方法

    公开(公告)号:US20130333128A1

    公开(公告)日:2013-12-19

    申请号:US13971619

    申请日:2013-08-20

    IPC分类号: H01L21/67

    摘要: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.

    摘要翻译: 用于清洁或与例如集成芯片制造装置的组件组合的清洁晶片或基板。 清洁基板可以包括具有变化的预定表面特征的基板,例如一个或多个预定粘合剂,非粘性,静电,投影,凹陷或其它物理部分。 预定特征可以提供更有效地清洁它们所使用的部件,例如集成芯片制造装置来代替集成芯片晶片。 可以通过真空,机械,静电或其他力将清洁基板推动到清洁或其它位置。 清洁基板可以适于实现各种功能,包括研磨或抛光。 清洁基板可以通过新的制造方法制成,然后可以用于与芯片制造装置结合使用的新颖方法。