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    ELECTRONIC COMMUNICATION DEVICE
    1.
    发明申请
    ELECTRONIC COMMUNICATION DEVICE 有权

    公开(公告)号：US20230073619A1

    公开(公告)日：2023-03-09

    申请号：US17823542

    申请日：2022-08-31

    Applicant: Infineon Technologies AG

    Inventor： Walther Pachler ,  Josef Gruber ,  Andreas Woerle ,  Juergen Hoelzl

    IPC: H04B5/00 ,  H02J50/12

    Abstract: An electronic communication device having a coil antenna with a first end connection, a second end connection, and a mid-connection, a communication device which is connected between the first end connection and the mid-connection and is configured to communicate with another communication device via the coil antenna, and an energy generation circuit which is connected between the first end connection and the second end connection and is configured to receive energy via the coil antenna and to supply at least one component of the electronic communication device with the received energy.

    WEARABLE DEVICE, SMART CARD AND SYSTEM
    3.
    发明申请
    WEARABLE DEVICE, SMART CARD AND SYSTEM 有权

    公开(公告)号：US20230006477A1

    公开(公告)日：2023-01-05

    申请号：US17852590

    申请日：2022-06-29

    Applicant: Infineon Technologies AG

    Inventor： Josef Gruber ,  Walther Pachler ,  Andreas Woerle

    IPC: H02J50/12 ,  H02J50/60 ,  H02J50/27

    Abstract: A wearable device including an antenna structure, a chip having a receiver which is electrically coupled to the antenna structure and is configured to receive radio signals by means of the antenna structure, and a trigger device which is arranged in or on the wearable device, which device comprises electrically conductive material and which is configured to trigger foreign object detection in a wireless energy charger in accordance with a wireless charging standard for wirelessly charging an electronic device by means of taking up load from radio waves emitted by the wireless energy charger.

    Chip card contact array arrangement
    6.
    发明授权
    Chip card contact array arrangement 有权
    芯片卡接触阵列布置

    公开(公告)号：US08833668B2

    公开(公告)日：2014-09-16

    申请号：US13711707

    申请日：2012-12-12

    Applicant: Infineon Technologies AG

    Inventor： Thomas Grieshofer ,  Peter Raggam ,  Andreas Woerle

    IPC: G06K19/07 ,  G06K19/077 ,  H05K1/02

    CPC classification number: H05K1/0296 ,  G06K19/0723 ,  G06K19/07769 ,  G06K19/07783

    Abstract: In various embodiments, a chip card contact array arrangement is provided, having a carrier, a plurality of contact arrays which are arranged on a first side of the carrier, an electrically conductive structure which is arranged on a second side of the carrier, which is arranged opposite the first side of the carrier, a first plated-through hole and a second plated-through hole, wherein the first plated-through hole is coupled to the electrically conductive structure, a connecting structure which is arranged on the first side of the carrier, wherein the connecting structure connects the first plated-through hole to the second plated-through hole, the connecting structure having a longitudinal extent which runs parallel to a direction in which a contact-connection device on a reading device is moved relative to the plurality of contacts.

    Abstract translation: 在各种实施例中，提供了芯片卡接触阵列布置，其具有载体，布置在载体的第一侧上的多个接触阵列，布置在载体的第二侧上的导电结构， 与所述载体的第一侧相对布置有第一电镀通孔和第二电镀通孔，其中所述第一电镀通孔与所述导电结构耦合，连接结构布置在所述导电结构的第一侧上 载体，其中所述连接结构将所述第一电镀通孔连接到所述第二电镀通孔，所述连接结构具有纵向延伸，所述纵向延伸平行于读取装置上的接触连接装置相对于所述第二电镀通孔移动的方向延伸; 多个联系人

    BOOSTER ANTENNA STRUCTURE
    7.
    发明申请
    BOOSTER ANTENNA STRUCTURE 审中-公开
    升压天线结构

    公开(公告)号：US20150097040A1

    公开(公告)日：2015-04-09

    申请号：US14049331

    申请日：2013-10-09

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： Stephan Rampetzreiter ,  Andreas Woerle

    IPC: G06K19/077 ,  H01Q7/00

    CPC classification number: G06K19/07794 ,  G06K19/07779 ,  H01Q1/2225 ,  H01Q7/00

    Abstract: In various embodiments, a booster antenna structure is provided, comprising a chip coupling region; a coil having a conductor forming multiple windings, wherein the coil encloses the chip coupling region substantially completely, wherein the conductor is arranged around the chip coupling region in a crossover-free manner.

    Abstract translation: 在各种实施例中，提供了一种增强天线结构，包括芯片耦合区域; 具有形成多个绕组的导体的线圈，其中所述线圈基本上完全包围所述芯片耦合区域，其中所述导体以无交叉的方式布置在所述芯片耦合区域周围。

    CHIP CARD CONTACT ARRAY ARRANGEMENT
    8.
    发明申请
    CHIP CARD CONTACT ARRAY ARRANGEMENT 有权
    CHIP卡联系阵列安排

    公开(公告)号：US20130146670A1

    公开(公告)日：2013-06-13

    申请号：US13711707

    申请日：2012-12-12

    Applicant: Infineon Technologies AG

    Inventor： Thomas Grieshofer ,  Peter Raggam ,  Andreas Woerle

    IPC: H05K1/02 ,  G06K19/07

    CPC classification number: H05K1/0296 ,  G06K19/0723 ,  G06K19/07769 ,  G06K19/07783

    Abstract: In various embodiments, a chip card contact array arrangement is provided, having a carrier, a plurality of contact arrays which are arranged on a first side of the carrier, an electrically conductive structure which is arranged on a second side of the carrier, which is arranged opposite the first side of the carrier, a first plated-through hole and a second plated-through hole, wherein the first plated-through hole is coupled to the electrically conductive structure, a connecting structure which is arranged on the first side of the carrier, wherein the connecting structure connects the first plated-through hole to the second plated-through hole, the connecting structure having a longitudinal extent which runs parallel to a direction in which a contact-connection device on a reading device is moved relative to the plurality of contacts.

    Abstract translation: 在各种实施例中，提供了芯片卡接触阵列布置，其具有载体，布置在载体的第一侧上的多个接触阵列，布置在载体的第二侧上的导电结构， 与所述载体的第一侧相对布置有第一电镀通孔和第二电镀通孔，其中所述第一电镀通孔与所述导电结构耦合，连接结构布置在所述导电结构的第一侧上 载体，其中所述连接结构将所述第一电镀通孔连接到所述第二电镀通孔，所述连接结构具有纵向延伸，所述纵向延伸平行于读取装置上的接触连接装置相对于所述第二电镀通孔移动的方向延伸; 多个联系人

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