中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

18 records (took 0.015 seconds)

    Chip card
    1.
    发明授权
    Chip card 有权

    公开(公告)号：US11030513B2

    公开(公告)日：2021-06-08

    申请号：US16691623

    申请日：2019-11-22

    Applicant: Infineon Technologies AG

    Inventor： Walther Pachler ,  Josef Gruber ,  Juergen Hoelzl ,  Francois Poensgen ,  Stephan Rampetzreiter

    IPC: G06K19/077 ,  G06K19/18 ,  G06K19/12 ,  G06K19/02

    Abstract: A chip card is provided. The chip card can have a metal layer in which an opening is formed and a slot that extends from one edge of the opening to the outer edge of the metal layer, a booster antenna structure, arranged in the opening, having an antenna section for electromagnetically coupling to the metal layer and having a coupling region for electromagnetically coupling to an antenna structure of a chip module, and the chip module, which is arranged in the coupling region, having the antenna structure arranged on the chip module.

    BOOSTER ANTENNA STRUCTURE FOR A CHIP CARD
    2.
    发明申请
    BOOSTER ANTENNA STRUCTURE FOR A CHIP CARD 审中-公开
    用于芯片卡的BOOSTER天线结构

    公开(公告)号：US20160188926A1

    公开(公告)日：2016-06-30

    申请号：US14983684

    申请日：2015-12-30

    Applicant: Infineon Technologies AG

    Inventor： Walther Pachler ,  Stephan Rampetzreiter ,  Harald Witschnig

    IPC: G06K7/10

    CPC classification number: G06K7/10336 ,  G06K19/07794 ,  H01Q1/2225 ,  H01Q7/00

    Abstract: A booster antenna structure for a chip card. The booster antenna structure includes a first electrical circuit, which forms a first resonant circuit, a second electrical circuit which forms a second resonant circuit, and a parallel coupling between the first electrical circuit and the second electrical circuit. The booster antenna structure is formed of a single wire.

    Abstract translation: 一种用于芯片卡的增强天线结构。 增强天线结构包括形成第一谐振电路的第一电路，形成第二谐振电路的第二电路和第一电路与第二电路之间的并联耦合。 增强天线结构由单根导线构成。

    ANTENNA ARRANGEMENT, COMMUNICATION APPLIANCE AND ANTENNA STRUCTURE
    4.
    发明申请
    ANTENNA ARRANGEMENT, COMMUNICATION APPLIANCE AND ANTENNA STRUCTURE 审中-公开
    天线布置，通信设备和天线结构

    公开(公告)号：US20140313092A1

    公开(公告)日：2014-10-23

    申请号：US14258032

    申请日：2014-04-22

    Applicant: Infineon Technologies AG

    Inventor： Peter Raggam ,  Oliver Kronschlaeger ,  Stephan Rampetzreiter ,  Josef Gruber

    IPC: H01Q7/08

    CPC classification number: H01Q7/08 ,  H01Q1/2216

    Abstract: In various embodiments, an antenna arrangement is provided. The antenna arrangement may include at least one integrated circuit; at least one loop antenna that is coupled to the integrated circuit and that forms a loop antenna region; at least one antenna that is coupled to the integrated circuit and that has a magnet core; wherein at least one portion of the magnet core is arranged above a portion of the loop antenna region; wherein the portion of the magnet core overlaps the portion of the loop antenna region; or wherein the portion of the magnet core does not overlap the portion of the loop antenna region.

    Abstract translation: 在各种实施例中，提供天线装置。 天线装置可以包括至少一个集成电路; 至少一个环形天线，其耦合到所述集成电路并且形成环形天线区域; 耦合到所述集成电路并且具有磁芯的至少一个天线; 其中所述磁芯的至少一部分布置在所述环形天线区域的一部分上方; 其中所述磁芯的所述部分与所述环形天线区域的所述部分重叠; 或者其中磁芯的部分不与环形天线区域的部分重叠。

    Chip card module, chip card and method of forming a chip card module
    5.
    发明授权
    Chip card module, chip card and method of forming a chip card module 有权

    公开(公告)号：US10043126B2

    公开(公告)日：2018-08-07

    申请号：US15477128

    申请日：2017-04-03

    Applicant: Infineon Technologies AG

    Inventor： Walther Pachler ,  Stephan Rampetzreiter

    IPC: G06K19/06 ,  G06K19/077 ,  H01L23/66 ,  H01L23/00 ,  H01L25/04 ,  H01L49/02

    Abstract: In various embodiments, a chip card module for a chip card is provided. The chip card module may include a carrier with a first side and an opposite second side, a chip arranged over the first side of the carrier, an antenna arranged over the carrier. The antenna may be electrically conductively coupled to the chip and configured to inductively couple to a second antenna formed on a chip card body of the chip card. The chip card module may further include a capacitor electrically conductively coupled to the chip, the capacitor including a first electrode arranged over the first side of the carrier, and a second electrode arranged over the second side of the carrier.

    ANNULAR DEVICE FORMATION
    7.
    发明公开
    ANNULAR DEVICE FORMATION 审中-公开

    公开(公告)号：US20240097316A1

    公开(公告)日：2024-03-21

    申请号：US18463458

    申请日：2023-09-08

    Applicant: Infineon Technologies AG

    Inventor： Jens Pohl ,  Michael Huber ,  Walther Pachler ,  Stephan Rampetzreiter

    IPC: H01Q1/27 ,  H01Q1/38 ,  H01Q1/50

    CPC classification number: H01Q1/273 ,  H01Q1/38 ,  H01Q1/50

    Abstract: An antenna structure for a contactless wearable structure having a plurality of antenna tracks on the substrate, the opposite ends of which are connectable to form an antenna when the substrate is bent, a plurality of capacitor elements on the substrate that are couplable to the antenna for adjusting the resonance frequency of the antenna, and at least one predefined separation region, by means of which it is possible to adjust which of the plurality of capacitor elements are electrically conductively connectable to the antenna when the substrate is bent, in order to form at least one capacitor with a predetermined total capacitance that is electrically conductively coupled to the antenna.

Patent Agency Ranking