公开(公告)号：US09666543B2

公开(公告)日：2017-05-30

申请号：US14690025

申请日：2015-04-17

Applicant: Infineon Technologies AG

Inventor： Saverio Trotta ,  Jagjit Singh Bal ,  Ulrich Moeller ,  Andrzej Samulak ,  Werner Simbuerger

IPC: H01L23/66 ,  H01L23/367 ,  H01L23/40

CPC classification number: H01L23/66 ,  H01L23/3675 ,  H01L23/40 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2223/6627 ,  H01L2223/6683 ,  H01L2224/16225

Abstract: An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an integrated RF circuit, and a cooling element including a backshort. The semiconductor chip is mounted to the carrier such that the first surface faces the carrier. The integrated RF circuit is connected to the at least one waveguide feeding. The cooling element is mounted to the carrier such that the backshort is adjacent one end of the at least one waveguide feeding, and the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element.

公开(公告)号：US20150305190A1

公开(公告)日：2015-10-22

申请号：US14690025

申请日：2015-04-17

Applicant: Infineon Technologies AG ,  Conti Temic microelectronic GmbH

Inventor： Saverio Trotta ,  Jagjit Singh Bal ,  Ulrich Moeller ,  Andrzej Samulak ,  Werner Simbuerger

IPC: H05K7/20 ,  H01L23/66 ,  H01L23/40 ,  H01L23/498 ,  H01L23/367 ,  H01L23/373

CPC classification number: H01L23/66 ,  H01L23/3675 ,  H01L23/40 ,  H01L23/4006 ,  H01L2023/4087 ,  H01L2223/6627 ,  H01L2223/6683 ,  H01L2224/16225

Abstract: An electronic system includes a carrier including at least one waveguide feeding, a semiconductor chip including a first surface and a second surface, and an integrated RF circuit, and a cooling element including a backshort. The semiconductor chip is mounted to the carrier such that the first surface faces the carrier. The integrated RF circuit is connected to the at least one waveguide feeding. The cooling element is mounted to the carrier such that the backshort is adjacent one end of the at least one waveguide feeding, and the cooling element at least partially covers the semiconductor chip such that the second surface of the semiconductor chip faces the cooling element.

Abstract translation: 电子系统包括载体，该载体包括至少一个波导馈送，包括第一表面和第二表面的半导体芯片，以及集成RF电路，以及包括后向阻滞的冷却元件。 将半导体芯片安装到载体上使得第一表面面向载体。 集成RF电路连接到至少一个波导馈送。 冷却元件安装到载体上，使得后端与所述至少一个波导馈送的一端相邻，并且所述冷却元件至少部分地覆盖半导体芯片，使得半导体芯片的第二表面面向冷却元件。