公开(公告)号：US10332814B2

公开(公告)日：2019-06-25

申请号：US15047098

申请日：2016-02-18

Applicant: Infineon Technologies AG

Inventor： Claus Von Waechter ,  Christian Altschaeffl ,  Holger Doepke ,  Uwe Hoeckele ,  Franz Xaver Muehlbauer ,  Daniel Porwol ,  Tobias Schmidt ,  Christian Schweiger ,  Carsten Von Koblinski

IPC: H01L23/26 ,  H01L23/00 ,  H01L23/31

Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.

公开(公告)号：US20160247739A1

公开(公告)日：2016-08-25

申请号：US15047098

申请日：2016-02-18

Applicant: Infineon Technologies AG

Inventor： Claus Von Waechter ,  Christian Altschaeffl ,  Holger Doepke ,  Uwe Hoeckele ,  Franz Xaver Muehlbauer ,  Daniel Porwol ,  Tobias Schmidt ,  Christian Schweiger ,  Carsten Von Koblinski

IPC: H01L23/26 ,  H01L23/00 ,  H01L21/02 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L23/26 ,  H01L23/3135 ,  H01L23/564 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/3025

Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.

Abstract translation: 粘合系统包括包括吸湿材料的重构晶片。 防潮层设置在重构晶片的表面上。 粘合剂层布置在与重构的晶片相对的防潮层的表面上。 载体布置在与防潮层相对的粘合剂层的表面上。 粘合剂层将重构的晶片和载体粘合地结合在一起。