公开(公告)号：US20160247739A1

公开(公告)日：2016-08-25

申请号：US15047098

申请日：2016-02-18

Applicant: Infineon Technologies AG

Inventor： Claus Von Waechter ,  Christian Altschaeffl ,  Holger Doepke ,  Uwe Hoeckele ,  Franz Xaver Muehlbauer ,  Daniel Porwol ,  Tobias Schmidt ,  Christian Schweiger ,  Carsten Von Koblinski

IPC: H01L23/26 ,  H01L23/00 ,  H01L21/02 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L23/26 ,  H01L23/3135 ,  H01L23/564 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/3025

Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.

Abstract translation: 粘合系统包括包括吸湿材料的重构晶片。 防潮层设置在重构晶片的表面上。 粘合剂层布置在与重构的晶片相对的防潮层的表面上。 载体布置在与防潮层相对的粘合剂层的表面上。 粘合剂层将重构的晶片和载体粘合地结合在一起。

公开(公告)号：US09355881B2

公开(公告)日：2016-05-31

申请号：US14182689

申请日：2014-02-18

Applicant: Infineon Technologies AG

Inventor： Bernhard Goller ,  Eva-Maria Hess ,  Edward Fuergut ,  Christian Schweiger

IPC: H01L21/683 ,  H01L21/268 ,  H01L21/304 ,  H01L21/762 ,  H01L21/78 ,  H01L23/00 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L21/6835 ,  H01L21/268 ,  H01L21/304 ,  H01L21/561 ,  H01L21/568 ,  H01L21/76251 ,  H01L21/78 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/0231 ,  H01L2224/04105 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/82106 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/06 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/201 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/00 ,  H01L2224/82 ,  H05K3/467 ,  H01L2224/03 ,  H01L2924/01029

Abstract: A method for manufacturing a semiconductor device includes providing a carrier and a semiconductor wafer having a first side and a second side opposite to the first side. The method includes applying a dielectric material to the carrier or the semiconductor wafer and bonding the semiconductor wafer to the carrier via the dielectric material. The method includes processing the semiconductor wafer and removing the carrier from the semiconductor wafer such that the dielectric material remains on the semiconductor wafer to provide a semiconductor device comprising the dielectric material.

Abstract translation: 一种制造半导体器件的方法包括提供具有第一侧和与第一侧相对的第二侧的载流子和半导体晶片。 该方法包括将介电材料施加到载体或半导体晶片，并通过电介质材料将半导体晶片接合到载体上。 该方法包括处理半导体晶片并从半导体晶片去除载体，使得介电材料保留在半导体晶片上，以提供包括电介质材料的半导体器件。

公开(公告)号：US10332814B2

公开(公告)日：2019-06-25

申请号：US15047098

申请日：2016-02-18

Applicant: Infineon Technologies AG

Inventor： Claus Von Waechter ,  Christian Altschaeffl ,  Holger Doepke ,  Uwe Hoeckele ,  Franz Xaver Muehlbauer ,  Daniel Porwol ,  Tobias Schmidt ,  Christian Schweiger ,  Carsten Von Koblinski

IPC: H01L23/26 ,  H01L23/00 ,  H01L23/31

Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.

公开(公告)号：US20150235890A1

公开(公告)日：2015-08-20

申请号：US14182689

申请日：2014-02-18

Applicant: Infineon Technologies AG

Inventor： Bernhard Goller ,  Eva-Maria Hess ,  Edward Fuergut ,  Christian Schweiger

IPC: H01L21/683 ,  H01L21/268 ,  H01L21/762 ,  H01L23/00 ,  H01L21/78 ,  H01L21/304

CPC classification number: H01L21/6835 ,  H01L21/268 ,  H01L21/304 ,  H01L21/561 ,  H01L21/568 ,  H01L21/76251 ,  H01L21/78 ,  H01L23/3114 ,  H01L24/02 ,  H01L24/24 ,  H01L24/82 ,  H01L24/97 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2224/0231 ,  H01L2224/04105 ,  H01L2224/24011 ,  H01L2224/24105 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/82106 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2924/06 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/201 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/20111 ,  H01L2924/2064 ,  H01L2924/20641 ,  H01L2924/20642 ,  H01L2924/00 ,  H01L2224/82 ,  H05K3/467 ,  H01L2224/03 ,  H01L2924/01029

Abstract: A method for manufacturing a semiconductor device includes providing a carrier and a semiconductor wafer having a first side and a second side opposite to the first side. The method includes applying a dielectric material to the carrier or the semiconductor wafer and bonding the semiconductor wafer to the carrier via the dielectric material. The method includes processing the semiconductor wafer and removing the carrier from the semiconductor wafer such that the dielectric material remains on the semiconductor wafer to provide a semiconductor device comprising the dielectric material.

Abstract translation: 一种制造半导体器件的方法包括提供具有第一侧和与第一侧相对的第二侧的载流子和半导体晶片。 该方法包括将介电材料施加到载体或半导体晶片，并通过电介质材料将半导体晶片接合到载体上。 该方法包括处理半导体晶片并从半导体晶片去除载体，使得介电材料保留在半导体晶片上，以提供包括电介质材料的半导体器件。