公开(公告)号：US10112861B2

公开(公告)日：2018-10-30

申请号：US14813677

申请日：2015-07-30

Applicant: Infineon Technologies AG

Inventor： Andre Brockmeier ,  Alexander Breymesser ,  Carsten Von Koblinski ,  Francisco Javier Santos Rodriguez ,  Peter Zorn

IPC: C03B23/03 ,  C03B11/08

Abstract: A method of manufacturing a plurality of glass members comprises bringing a first main surface of a glass substrate in contact with a first working surface of a first mold substrate, the first working surface being provided with a plurality of first protruding portions, and bringing a second main surface of the glass substrate in contact with a second working surface of a second mold substrate, the second working surface being provided with a plurality of second protruding portions. The method further comprises controlling a temperature of the glass substrate to a temperature above a glass-transition temperature to form the plurality of glass members, removing the first and the second mold substrates from the glass substrate, and separating adjacent ones of the plurality of glass members.

公开(公告)号：US20170029311A1

公开(公告)日：2017-02-02

申请号：US14813677

申请日：2015-07-30

Applicant: Infineon Technologies AG

Inventor： Andre Brockmeier ,  Alexander Breymesser ,  Carsten Von Koblinski ,  Francisco Javier Santos Rodriguez ,  Peter Zorn

IPC: C03B11/08

CPC classification number: C03B11/08 ,  C03B11/082 ,  C03B11/084 ,  C03B2215/06 ,  C03B2215/07 ,  C03B2215/414

Abstract: A method of manufacturing a plurality of glass members comprises bringing a first main surface of a glass substrate in contact with a first working surface of a first mold substrate, the first working surface being provided with a plurality of first protruding portions, and bringing a second main surface of the glass substrate in contact with a second working surface of a second mold substrate, the second working surface being provided with a plurality of second protruding portions. The method further comprises controlling a temperature of the glass substrate to a temperature above a glass-transition temperature to form the plurality of glass members, removing the first and the second mold substrates from the glass substrate, and separating adjacent ones of the plurality of glass members.

Abstract translation: 一种制造多个玻璃构件的方法包括使玻璃基板的第一主表面与第一模具基板的第一工作表面接触，所述第一工作表面设置有多个第一突出部分，并且使第二主表面 所述玻璃基板的主表面与第二模具基板的第二工作表面接触，所述第二工作表面设置有多个第二突出部分。 该方法还包括将玻璃基板的温度控制在高于玻璃化转变温度的温度以形成多个玻璃部件，从玻璃基板移除第一和第二模具基板，并分离出多个玻璃中的相邻玻璃基板 会员

公开(公告)号：US10431471B2

公开(公告)日：2019-10-01

申请号：US15137012

申请日：2016-04-25

Applicant: Infineon Technologies AG

Inventor： Carsten Von Koblinski ,  Markus Ottowitz ,  Andreas Riegler

IPC: H01L21/308 ,  H01L21/304 ,  H01L21/302 ,  H01L21/306 ,  H01L21/3065

Abstract: Various embodiments provide a method of planarizing a semiconductor wafer, wherein the method comprises providing a semiconductor wafer comprising a surface; and forming a mask layer on the surface of the semiconductor wafer, wherein a thickness of the mask layer is smaller in thinning areas, which are to be thinned for planarizing, than in areas which are not to be thinned for planarizing.

公开(公告)号：US10332814B2

公开(公告)日：2019-06-25

申请号：US15047098

申请日：2016-02-18

Applicant: Infineon Technologies AG

Inventor： Claus Von Waechter ,  Christian Altschaeffl ,  Holger Doepke ,  Uwe Hoeckele ,  Franz Xaver Muehlbauer ,  Daniel Porwol ,  Tobias Schmidt ,  Christian Schweiger ,  Carsten Von Koblinski

IPC: H01L23/26 ,  H01L23/00 ,  H01L23/31

Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.

公开(公告)号：US20190023600A1

公开(公告)日：2019-01-24

申请号：US16144492

申请日：2018-09-27

Applicant: Infineon Technologies AG

Inventor： Andre Brockmeier ,  Alexander Breymesser ,  Carsten Von Koblinski ,  Francisco Javier Santos Rodriguez ,  Peter Zorn

IPC: C03B11/08

Abstract: An array of glass members is arranged in a glass substrate includes a plurality of depressions formed in a first main surface of the glass substrate, and a plurality of openings formed in a second main surface of the glass substrate.

公开(公告)号：US20160247739A1

公开(公告)日：2016-08-25

申请号：US15047098

申请日：2016-02-18

Applicant: Infineon Technologies AG

Inventor： Claus Von Waechter ,  Christian Altschaeffl ,  Holger Doepke ,  Uwe Hoeckele ,  Franz Xaver Muehlbauer ,  Daniel Porwol ,  Tobias Schmidt ,  Christian Schweiger ,  Carsten Von Koblinski

IPC: H01L23/26 ,  H01L23/00 ,  H01L21/02 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L23/26 ,  H01L23/3135 ,  H01L23/564 ,  H01L24/96 ,  H01L24/97 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/3025

Abstract: A bonded system includes a reconstituted wafer including a hygroscopic material. A moisture barrier layer is arranged over a surface of the reconstituted wafer. An adhesive layer is arranged over a surface of the moisture barrier opposite the reconstituted wafer. A carrier is arranged over a surface of the adhesive layer opposite the moisture barrier. The adhesive layer adhesively bonds the reconstituted wafer and the carrier together.

Abstract translation: 粘合系统包括包括吸湿材料的重构晶片。 防潮层设置在重构晶片的表面上。 粘合剂层布置在与重构的晶片相对的防潮层的表面上。 载体布置在与防潮层相对的粘合剂层的表面上。 粘合剂层将重构的晶片和载体粘合地结合在一起。