公开(公告)号：US11422144B2

公开(公告)日：2022-08-23

申请号：US16841870

申请日：2020-04-07

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Horst Theuss ,  Michael Weber

IPC: G01P3/44 ,  H01L25/16 ,  H01L23/62 ,  H01L49/02 ,  H01L23/31 ,  G01D5/14 ,  G01D5/16 ,  H01L23/00

Abstract: A magnetic field sensor package comprises a chip carrier, a magnetic field sensor which is arranged on the chip carrier and designed to detect a magnetic field, an integrated circuit which is arranged on the chip carrier and designed to logically process sensor signals provided by the magnetic field sensor, and at least one integrated passive component which is electrically coupled to at least one of the magnetic field sensor or the integrated circuit.

公开(公告)号：US11815414B2

公开(公告)日：2023-11-14

申请号：US17348940

申请日：2021-06-16

Applicant: Infineon Technologies AG

Inventor： Emanuel Stoicescu ,  Matthias Boehm ,  Stefan Jahn ,  Erhard Landgraf ,  Michael Weber ,  Janis Weidenauer

IPC: G01L19/14 ,  H01L23/053 ,  G01L19/00 ,  H01L21/56 ,  H01L23/24 ,  H01L23/495 ,  H01L23/60 ,  H01L23/00

CPC classification number: G01L19/147 ,  G01L19/0061 ,  H01L21/56 ,  H01L23/053 ,  H01L23/24 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/60 ,  H01L24/45 ,  H01L2224/4813 ,  H01L2224/4848 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2924/00014 ,  H01L2224/48465 ,  H01L2224/48247 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: A pressure sensor device includes a semiconductor die having a die surface that includes a pressure sensitive area; and a bond wire bonded to a first peripheral region of the die surface and extends over the die surface to a second peripheral region of the die surface, wherein the pressure sensitive area is interposed between the second peripheral region and the first peripheral region, wherein the bond wire comprises a crossing portion that overlaps an area of the die surface, and wherein the crossing portion extends over the pressure sensitive area that is interposed between the first and the second peripheral regions.

公开(公告)号：US11067466B2

公开(公告)日：2021-07-20

申请号：US16159918

申请日：2018-10-15

Applicant: Infineon Technologies AG

Inventor： Emanuel Stoicescu ,  Matthias Boehm ,  Stefan Jahn ,  Erhard Landgraf ,  Michael Weber ,  Janis Weidenauer

IPC: G01L19/14 ,  H01L23/053 ,  G01L19/00 ,  H01L21/56 ,  H01L23/24 ,  H01L23/495 ,  H01L23/60 ,  H01L23/00

Abstract: A pressure sensor device includes a semiconductor die of the pressure sensor device and a bond wire of the pressure sensor device. A maximal vertical distance between a part of the bond wire and the semiconductor die is larger than a minimal vertical distance between the semiconductor die and a surface of a gel covering the semiconductor die.

公开(公告)号：US10515879B2

公开(公告)日：2019-12-24

申请号：US15992958

申请日：2018-05-30

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Klaus Elian ,  Volker Strutz ,  Horst Theuss ,  Michael Weber

IPC: H01L23/495 ,  H01L23/31

Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.

公开(公告)号：US20180350727A1

公开(公告)日：2018-12-06

申请号：US15992958

申请日：2018-05-30

Applicant: Infineon Technologies AG

Inventor： Manfred Schindler ,  Klaus Elian ,  Volker Strutz ,  Horst Theuss ,  Michael Weber

IPC: H01L23/495 ,  H01L23/31

Abstract: A package and method of manufacturing a package is disclosed. In one example, the package includes a carrier having an accommodation through hole. A component is arranged at least partially within the accommodation through hole. A connection structure connects the carrier with the component.