Molded lead frame sensor package
    1.
    发明授权

    公开(公告)号:US10781095B2

    公开(公告)日:2020-09-22

    申请号:US16222589

    申请日:2018-12-17

    Abstract: Examples provided herein are associated with a molded lead frame of a sensor package. An example sensor package may include a molded lead frame that includes an opening in the molded lead frame, wherein the opening extends from a mount-side of the molded lead frame to a chip-side of the molded lead frame, wherein the chip-side of the molded lead frame is opposite the mount-side; and a sensor mounted to the chip-side of the molded lead frame.

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