公开(公告)号：US20130194745A1

公开(公告)日：2013-08-01

申请号：US13360328

申请日：2012-01-27

申请人： Ingmar G. Meijer ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

发明人： Ingmar G. Meijer ,  Derek I. Schmidt ,  Mark E. Steinke ,  James S. Womble

IPC分类号： G06F1/20

CPC分类号： G06F1/20 ,  G06F2200/201

摘要： Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.

摘要翻译： 存储器系统中的每对存储器模块使用诸如热管或液体流管的共用冷却管来冷却。 示例实施例包括在相应冷却管的相对侧上的一对存储器模块插槽。 内部散热板热耦合到冷却管并且与存储器模块的与附带的冷却管相邻的第一面热接合。 热量从存储器模块的第二面传导到冷却管，例如从与存储器模块的相对的第二面和内板热接合的外板。

公开(公告)号：US08937810B2

公开(公告)日：2015-01-20

申请号：US13616337

申请日：2012-09-14

申请人： Thomas J. Brunschwiler ,  Evan G. Colgan ,  Michael J. Ellsworth, Jr. ,  Werner Escher ,  Ingmar G. Meijer ,  Stephan Paredes ,  Gerd Schlottig ,  Martin Witzig ,  Jeffrey A. Zitz

发明人： Thomas J. Brunschwiler ,  Evan G. Colgan ,  Michael J. Ellsworth, Jr. ,  Werner Escher ,  Ingmar G. Meijer ,  Stephan Paredes ,  Gerd Schlottig ,  Martin Witzig ,  Jeffrey A. Zitz

IPC分类号： H05K7/20 ,  H01L23/46

CPC分类号： H05K7/20772 ,  Y10T29/49002

摘要： Cooled electronic assemblies, and a method of decoupling a cooled electronic assembly, are provided. In one embodiment, the assembly includes a coolant-cooled electronic module with one or more electronic components and one or more coolant-carrying channels integrated within the module and configured to facilitate flow of coolant through the module for cooling the electronic component(s). In addition, the assembly includes a coolant manifold structure detachably coupled to the electronic module. The manifold structure, which includes a coolant inlet and outlet in fluid communication with the coolant-carrying channel(s) of the electronic module, facilitates flow of coolant through the coolant-carrying channel, and thus cooling of the electronic component(s). Coolant-absorbent material is positioned at the interface between the electronic module and the manifold structure to facilitate absorbing any excess coolant during a stepwise detaching of the manifold structure from the electronic module.

摘要翻译： 提供了冷却的电子组件，以及一种解耦冷却的电子组件的方法。 在一个实施例中，组件包括冷却剂冷却的电子模块，其具有一个或多个电子部件和一个或多个集成在模块内的冷却剂传送通道并且被配置为便于冷却剂流过模块以冷却电子部件。 此外，组件包括可拆卸地联接到电子模块的冷却剂歧管结构。 歧管结构包括与电子模块的冷却剂输送通道流体连通的冷却剂入口和出口，有利于冷却剂流过冷却剂输送通道，从而冷却电子部件。 冷却剂吸收材料位于电子模块和歧管结构之间的界面处，以便于在将歧管结构从电子模块逐步拆卸时吸收任何多余的冷却剂。