-
1.发明申请公开(公告)号：US20130194745A1
公开(公告)日：2013-08-01
申请号：US13360328
申请日：2012-01-27
IPC分类号： G06F1/20
CPC分类号： G06F1/20 , G06F2200/201
摘要： Each pair of memory modules in a memory system are cooled using a shared cooling pipe, such as a heat pipe or liquid flow pipe. An example embodiment includes one pair of memory module sockets on opposite sides of the respective cooling pipe. An inner heat spreader plate is thermally coupled to the cooling pipe and in thermal engagement with a first face of the memory module adjacent to the included cooling pipe. Heat is conducted from the second face of the memory module to the cooling pipe, such as from an outer plate in thermal engagement with an opposing second face of the memory modules and with the inner plate.
摘要翻译： 存储器系统中的每对存储器模块使用诸如热管或液体流管的共用冷却管来冷却。 示例实施例包括在相应冷却管的相对侧上的一对存储器模块插槽。 内部散热板热耦合到冷却管并且与存储器模块的与附带的冷却管相邻的第一面热接合。 热量从存储器模块的第二面传导到冷却管，例如从与存储器模块的相对的第二面和内板热接合的外板。
-
公开(公告)号：US20120011700A1
公开(公告)日：2012-01-19
申请号：US12835683
申请日：2010-07-13
CPC分类号： H05K13/0447 , G06F1/185 , G06F1/186 , H01R12/7005 , H01R13/62 , H01R43/26 , H05K7/1415 , H05K7/1461 , H05K13/0015 , H05K13/046 , Y10T29/49895 , Y10T29/5313 , Y10T29/53261
摘要： According to one embodiment, a tool includes a carrier for supporting an adapter card, a lower retaining member extending from a lower portion of the carrier for securing the adapter card to the carrier, and an upper retaining member extending from an upper portion of the carrier for securing the adapter card to the carrier. In another embodiment, a system includes a tool and a computer system chassis having a feature for aligning the tool with a system board of the computer system. The tool includes a carrier for supporting an adapter card, at least one lower retaining member extending from a lower portion of the carrier for securing the adapter card to the carrier, at least one upper retaining member extending from an upper portion of the carrier for securing the adapter card to the carrier, and a positioning member extending from the carrier for aligning the tool.
摘要翻译： 根据一个实施例，工具包括用于支撑适配器卡的托架，从托架的下部延伸的下保持构件，用于将适配器卡固定到托架上;以及上保持构件，其从托架的上部延伸 用于将适配器卡固定到托架上。 在另一个实施例中，系统包括工具和具有将工具与计算机系统的系统板对准的特征的计算机系统底盘。 该工具包括用于支撑适配器卡的载体，至少一个下部保持构件，其从托架的下部延伸，用于将适配器卡固定到托架上;至少一个上部保持构件，其从托架的上部延伸以固定 适配器卡到载体，以及定位构件，其从载体延伸以对准工具。
-
公开(公告)号：US07438571B1
公开(公告)日：2008-10-21
申请号：US12021662
申请日：2008-01-29
IPC分类号： H01R13/62
CPC分类号： H05K7/1489 , G06F1/183
摘要： A latch mechanism for securing a module in an electronic component chassis includes at least one lever arm attached to the module and rotable between a latched and unlatched position, at least a portion of the lever arm having an interference fit with the chassis when the lever arm is in the latched position. The latch mechanism further includes at least one pawl rotably attached to the module such that when the lever arm is moved to the latched position, the lever arm rotates the pawl into a latched position wherein the pawl has an interference fit with the chassis.
-
公开(公告)号：US07344394B1
公开(公告)日：2008-03-18
申请号：US11872987
申请日：2007-10-16
IPC分类号： H01R13/62
CPC分类号： H05K7/1489 , G06F1/183
摘要： A latch mechanism for securing a module in an electronic component chassis includes at least one lever arm attached to the module and rotable between a latched and unlatched position, at least a portion of the lever arm having an interference fit with the chassis when the lever arm is in the latched position. The latch mechanism further includes at least one pawl rotably attached to the module such that when the lever arm is moved to the latched position, the lever arm rotates the pawl into a latched position wherein the pawl has an interference fit with the chassis.
摘要翻译： 用于将模块固定在电子部件底盘中的闩锁机构包括至少一个杠杆臂，该杠杆臂附接到模块并可在锁定和解锁位置之间旋转，当杠杆臂 处于锁定位置。 闩锁机构还包括可旋转地附接到模块的至少一个棘爪，使得当杠杆臂移动到闩锁位置时，杠杆臂将棘爪旋转到闩锁位置，其中棘爪与底盘具有过盈配合。
-
公开(公告)号：US08638559B2
公开(公告)日：2014-01-28
申请号：US13293174
申请日：2011-11-10
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
IPC分类号： H05K7/20
CPC分类号： F28D15/0275 , G06F1/185 , G06F1/20 , H01L23/4093 , H01L23/427 , H01L23/473 , H01L2924/0002 , H05K7/20509 , H05K7/20772 , H05K7/20809 , H01L2924/00
摘要： A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.
摘要翻译： 用于存储器模块的冷却系统包括用于将热量从存储器模块传导到液冷的安装块的热传导组件。 在一个实施例中，每个热传导组件包括具有相对的第一和第二支撑件的框架，每个从第一支撑件延伸到第二支撑件的第一和第二散热板，以及一对扁平化的热管， 散热板从第一支撑到第二支撑。 液体冷却的安装块通过存储器模块插座可释放地支撑热传导组件，存储器模块位于散热板之间。
-
6.发明授权Liquid-cooling memory modules with liquid flow pipes between memory module sockets 有权内存模块插槽之间具有液体流管的液冷存储器模块公开(公告)号：US08587943B2
公开(公告)日：2013-11-19
申请号：US13305092
申请日：2011-11-28
申请人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
发明人： Richard M. Barina , Vinod Kamath , Chunjian Ni , Derek I. Schmidt , Mark E. Steinke , James S. Womble
CPC分类号： H01L23/473 , G06F1/20 , G06F2200/201 , H01L23/4093 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A liquid-cooled computer memory system includes first and second blocks in fluid communication with a chilled liquid source. A plurality of spaced-apart heat transfer pipes extend along a system board between memory module sockets from the first manifold block to the second manifold block. The heat transfer pipes may be liquid flow pipes circulating the chilled liquid between the memory module sockets. Alternatively, the heat transfer pipes may be closed heat pipes that conduct heat from the memory modules to the liquid-cooled blocks. A separate heat spreader is provided to thermally bridge each memory module to the adjacent heat transfer pipes.
摘要翻译： 液冷计算机存储器系统包括与冷却液体源流体连通的第一和第二块。 多个间隔开的传热管沿着系统板在从第一歧管块到第二歧管块的存储器模块插槽之间延伸。 传热管可以是将冷却液体循环在存储器模块插槽之间的液体流管。 或者，传热管可以是将热量从存储器模块传导到液冷块的封闭热管。 提供单独的散热器以将每个存储器模块热桥接到相邻的传热管。
-
公开(公告)号：US08336199B2
公开(公告)日：2012-12-25
申请号：US12728096
申请日：2010-03-19
申请人： Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
发明人： Richard M. Barina , James R. Drake , Daniel P. Kelaher , George M. Moorefield, II , Derek I. Schmidt , James S. Womble
IPC分类号： B23P19/00
CPC分类号： H05K13/0491 , Y10T29/4913 , Y10T29/53183 , Y10T29/53257 , Y10T29/53274 , Y10T29/53283
摘要： A tool according to one embodiment includes an actuating mechanism including a cam plate; at least one gripper member operatively coupled to the cam plate; and a carriage for supporting the at least one gripper member, wherein the at least one gripper member is actuatable by the cam plate, wherein rotation of the cam plate causes the at least one gripper member to move between a first position and a second position, wherein when the at least one gripper member is in the first position, the tool is able to accept a processor for holding thereof, and wherein when the at least one gripper member is in the second position, the tool securely holds the processor therein. Additional systems and methods are also presented.
摘要翻译： 根据一个实施例的工具包括具有凸轮板的致动机构; 至少一个可操作地联接到所述凸轮板的夹持器构件; 以及用于支撑所述至少一个夹持构件的滑架，其中所述至少一个夹持构件可由所述凸轮板致动，其中所述凸轮板的旋转使所述至少一个夹持构件在第一位置和第二位置之间移动， 其中，当所述至少一个夹持构件处于所述第一位置时，所述工具能够接受用于保持其的处理器，并且其中当所述至少一个夹持构件处于所述第二位置时，所述工具将所述处理器牢固地保持在其中。 还介绍了其他系统和方法。
-
公开(公告)号：US20110157833A1
公开(公告)日：2011-06-30
申请号：US12647351
申请日：2009-12-24
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L23/4093 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably installed within the bracket in a toolless manner, such that the heat sink comes into contact with the integrated circuit. The heat sink and the bracket join together to become a single entity that is permitted to float along an axis perpendicular to a surface of the circuit board. The coil springs are tuned to define a predetermined force at which the heat sink is pushed against the integrated circuit. The module can include a latch having tabs bent at different angles relative to one another to balance forces applied by the tabs against the heat sink while the latter is being installed within the bracket.
摘要翻译： 集成电路设置在电路板上。 散热器保持模块包括支架，构件和螺旋弹簧。 构件延伸通过螺旋弹簧和支架内的相应的孔以附接到板。 散热器以无工具的方式可拆卸地安装在支架内，使得散热器与集成电路接触。 散热器和支架连接在一起成为允许沿垂直于电路板表面的轴线浮动的单个实体。 调节螺旋弹簧以限定预定的力，在该预定力处散热器被压靠在集成电路上。 模块可以包括具有相对于彼此以不同角度弯曲的突出部的闩锁，以平衡由突片抵靠散热器施加的力，同时其被安装在支架内。
-
公开(公告)号：US07961473B1
公开(公告)日：2011-06-14
申请号：US12647351
申请日：2009-12-24
IPC分类号： H05K7/20
CPC分类号： H01L23/4006 , H01L23/4093 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit is disposed on a circuit board. A heat sink retention module includes a bracket, members, and coil springs. The members extend through the coil springs and corresponding holes within the bracket to attach to the board. A heat sink is removably installed within the bracket in a toolless manner, such that the heat sink comes into contact with the integrated circuit. The heat sink and the bracket join together to become a single entity that is permitted to float along an axis perpendicular to a surface of the circuit board. The coil springs are tuned to define a predetermined force at which the heat sink is pushed against the integrated circuit. The module can include a latch having tabs bent at different angles relative to one another to balance forces applied by the tabs against the heat sink while the latter is being installed within the bracket.
摘要翻译： 集成电路设置在电路板上。 散热器保持模块包括支架，构件和螺旋弹簧。 构件延伸通过螺旋弹簧和支架内的相应的孔以附接到板。 散热器以无工具的方式可拆卸地安装在支架内，使得散热器与集成电路接触。 散热器和支架连接在一起成为允许沿垂直于电路板表面的轴线浮动的单个实体。 调节螺旋弹簧以限定预定的力，在该预定力处散热器被压靠在集成电路上。 模块可以包括具有相对于彼此以不同角度弯曲的突出部的闩锁，以平衡由突片抵靠散热器施加的力，同时其被安装在支架内。
-
公开(公告)号：US20130147503A1
公开(公告)日：2013-06-13
申请号：US13323330
申请日：2011-12-12
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20772
摘要： A liquid cooled planer including: one or more computing components mounted on the planer, wherein at least one or more of the computing components is liquid cooled; one or more conductive cooling components mounted on the planer; and one or more convective cooling components mounted on the planer, wherein the convective cooling components are removable from the planer without removing the conductive cooling components from the planer.
摘要翻译： 一种液体冷却刨床，包括：一个或多个安装在所述刨床上的计算部件，其中至少一个或多个所述计算部件是液体冷却的; 安装在刨床上的一个或多个导电冷却组件; 以及安装在刨床上的一个或多个对流冷却部件，其中所述对流冷却部件可从所述刨床移除，而不从所述刨床移除所述导电冷却部件。
-
-
-
-
-
-
-
-
-
搜索结果
15 条记录 (耗时 0.018 秒)
