公开(公告)号：US20240186280A1

公开(公告)日：2024-06-06

申请号：US18060596

申请日：2022-12-01

Applicant: Intel Corporation

Inventor： Minglu LIU ,  Andrey GUNAWAN ,  Gang DUAN ,  Edvin CETEGEN ,  Yuting WANG ,  Mine KAYA ,  Kartik SRINIVASAN ,  Mihir OKA ,  Anurag TRIPATHI

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/7598 ,  H01L2224/75985 ,  H01L2224/81093 ,  H01L2224/81097 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/95093 ,  H01L2224/97 ,  H01L2924/3511 ,  H01L2924/37001 ,  H01L2924/3841

Abstract: The present disclosure is directed to an apparatus having a bond head configured to heat and compress a semiconductor package assembly, and a bonding stage configured to hold the semiconductor package assembly, wherein the bonding stage comprises a ceramic material including silicon and either magnesium or indium.