公开(公告)号：US10908206B2

公开(公告)日：2021-02-02

申请号：US16302555

申请日：2016-05-17

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Chengqing Hu ,  Jong-Ru Guo ,  Zuoguo Wu ,  Deepak Goyal

IPC: G01R31/28 ,  G01R31/11 ,  H04B10/071

Abstract: Disclosed herein are systems and methods for the characterization of transmission media, among other embodiments. For example, a system for characterizing a transmission medium may include: a waveform generator to generate an initial input waveform; waveform pre-processing circuitry to process the initial waveform to generate a processed input waveform for provision to the transmission medium, wherein the processed input waveform has a maximum amplitude greater than a maximum amplitude of the initial input waveform; and waveform output circuitry to display or store data representative of an initial output waveform, wherein the initial output waveform is output from the transmission medium as a reflection or transmission of the processed input waveform.

公开(公告)号：US20190293708A1

公开(公告)日：2019-09-26

申请号：US16302555

申请日：2016-05-17

Applicant: Intel Corporation

Inventor： Mayue Xie ,  Chengqing Hu ,  Jong-Ru Guo ,  Zuoguo Wu ,  Deepak Goyal

IPC: G01R31/28 ,  G01R31/11

Abstract: Disclosed herein are systems and methods for the characterization of transmission media, among other embodiments. For example, a system for characterizing a transmission medium may include: a waveform generator to generate an initial input waveform; waveform pre-processing circuitry to process the initial waveform to generate a processed input waveform for provision to the transmission medium, wherein the processed input waveform has a maximum amplitude greater than a maximum amplitude of the initial input waveform; and waveform output circuitry to display or store data representative of an initial output waveform, wherein the initial output waveform is output from the transmission medium as a reflection or transmission of the processed input waveform.

公开(公告)号：US11226353B2

公开(公告)日：2022-01-18

申请号：US16493503

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Chengqing Hu ,  Mayue Xie ,  Simranjit S. Khalsa ,  Deepak Goyal

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R31/11 ,  G01R31/28

Abstract: An electrical characterization and fault isolation probe can include a cable, a connector, and a coating over a portion of the cable. The cable can have a first conductor having a first impedance, a second conductor having a second impedance, and a dielectric surrounding the first conductor and electrically isolating the first conductor from the second conductor. The connector can physically couple to, and be in electrical communication with, the cable. The connector can include a first electrical communication pathway and a second electrical communication pathway. The first electrical communication pathway can be electrically isolated from the second electrical communication pathway. The first electrical communication pathway can be in electrical communication with the first conductor. The second electrical communication pathway can be in electrical communication with the second conductor. The connector can have a fifth impedance.

公开(公告)号：US20210132113A1

公开(公告)日：2021-05-06

申请号：US16493503

申请日：2017-03-31

Applicant: Intel Corporation

Inventor： Chengqing Hu ,  Mayue Xie ,  Simranjit S. Khalsa ,  Deepak Goyal

IPC: G01R1/067 ,  G01R31/28

Abstract: An electrical characterization and fault isolation probe can include a cable, a connector, and a coating over a portion of the cable. The cable can have a first conductor having a first impedance, a second conductor having a second impedance, and a dielectric surrounding the first conductor and electrically isolating the first conductor from the second conductor. The connector can physically couple to, and be in electrical communication with, the cable. The connector can include a first electrical communication pathway and a second electrical communication pathway. The first electrical communication pathway can be electrically isolated from the second electrical communication pathway. The first electrical communication pathway can be in electrical communication with the first conductor. The second electrical communication pathway can be in electrical communication with the second conductor. The connector can have a fifth impedance.