公开(公告)号：US11521940B2

公开(公告)日：2022-12-06

申请号：US17088666

申请日：2020-11-04

Applicant: Intel Corporation

Inventor： Eng Kwong Lee ,  Chew Ching Lim

IPC: H01L23/00 ,  H01L23/16 ,  H01L23/367 ,  H01L23/427 ,  H01L21/48

Abstract: The present disclosure relates to a semiconductor package that may include a substrate, at least one die coupled to the substrate, and a stiffener coupled to the substrate, wherein the stiffener may include a stiffener frame, wherein the stiffener frame at least partially surrounds the at least one die. The stiffener may include at least one resilient member extending from the stiffener frame towards the at least one die, and the at least one resilient member may include a distal end that extends at a height above the substrate.

公开(公告)号：US11495514B2

公开(公告)日：2022-11-08

申请号：US17025899

申请日：2020-09-18

Applicant: Intel Corporation

Inventor： Chew Ching Lim ,  Chun Howe Sim

IPC: H01L23/367 ,  H01L23/40

Abstract: Disclosed embodiments include multiple thermal-interface material at the interface between an integrated heat spreader and a heat sink. A primary thermal-interface material has flow qualities and a secondary thermal-interface material has containment and adhesive qualities. The integrated heat spreader has a basin form factor that contains the primary thermal-interface material.

公开(公告)号：US20240332127A1

公开(公告)日：2024-10-03

申请号：US18191242

申请日：2023-03-28

Applicant: Intel Corporation

Inventor： Eng Kwong Lee ,  Tin Poay Chuah ,  Chew Ching Lim

IPC: H01L23/38

CPC classification number: H01L23/38 ,  H10N10/17 ,  H10N10/8556

Abstract: In one embodiment, an integrated circuit package includes an integrated heat spreader (IHS) that incorporates a Peltier element. The IHS may include one or more Peltier elements, which may be in a top portion of the IHS. The Peltier element(s) may be electrically connected to the package substrate through a trace on a sidewall of the IHS.

公开(公告)号：US20210183727A1

公开(公告)日：2021-06-17

申请号：US17025899

申请日：2020-09-18

Applicant: Intel Corporation

Inventor： Chew Ching Lim ,  Chun Howe Sim

IPC: H01L23/367 ,  H01L23/40

Abstract: Disclosed embodiments include multiple thermal-interface material at the interface between an integrated heat spreader and a heat sink. A primary thermal-interface material has flow qualities and a secondary thermal-interface material has containment and adhesive qualities. The integrated heat spreader has a basin form factor that contains the primary thermal-interface material.