公开(公告)号：US09929511B2

公开(公告)日：2018-03-27

申请号：US15074094

申请日：2016-03-18

Applicant: Intel Corporation

Inventor： John M. Lynch ,  Chong Richard Zhao ,  Xiang Li ,  Donald T. Tran

IPC: H01R12/72 ,  H01R13/6461 ,  H01R12/73 ,  H01R12/75 ,  H01R13/658 ,  H01R13/6586 ,  H01R12/50 ,  H01R13/6585

CPC classification number: H01R13/6461 ,  H01R12/72 ,  H01R12/721 ,  H01R12/73 ,  H01R12/737 ,  H01R12/75 ,  H01R13/658 ,  H01R13/6585 ,  H01R13/6586 ,  H01R23/6873

Abstract: An example electronic assembly for securing an electronic card. In some forms, the electronic assembly further includes a printed circuit board. The electronic assembly includes a housing having a first set of electrical contacts and a second set of electrical contacts. The housing is configured to receive the electronic card between the first and second set of electrical contacts. The housing further includes a third set of electrical contacts and a fourth set of electrical contacts. The housing is configured to receive the electronic card between the third and fourth set of electrical contacts. A ground shield is positioned between at least one of the first and third set of electrical contacts and the second and fourth set of electrical contacts. In some forms, the ground shield may be positioned between both the first and third set of electrical contacts and the second and fourth set of electrical contacts.

公开(公告)号：US20170271818A1

公开(公告)日：2017-09-21

申请号：US15074094

申请日：2016-03-18

Applicant: Intel Corporation

Inventor： John M. Lynch ,  Chong Richard Zhao ,  Xiang Li ,  Donald T. Tran

IPC: H01R13/6461 ,  H01R12/75 ,  H01R12/73

CPC classification number: H01R13/6461 ,  H01R12/72 ,  H01R12/721 ,  H01R12/73 ,  H01R12/737 ,  H01R12/75 ,  H01R13/658 ,  H01R13/6585 ,  H01R13/6586 ,  H01R23/6873

Abstract: An example electronic assembly for securing an electronic card. In some forms, the electronic assembly further includes a printed circuit board. The electronic assembly includes a housing having a first set of electrical contacts and a second set of electrical contacts. The housing is configured to receive the electronic card between the first and second set of electrical contacts. The housing further includes a third set of electrical contacts and a fourth set of electrical contacts. The housing is configured to receive the electronic card between the third and fourth set of electrical contacts. A ground shield is positioned between at least one of the first and third set of electrical contacts and the second and fourth set of electrical contacts. In some forms, the ground shield may be positioned between both the first and third set of electrical contacts and the second and fourth set of electrical contacts.

公开(公告)号：US09554454B2

公开(公告)日：2017-01-24

申请号：US14573434

申请日：2014-12-17

Applicant: Intel Corporation

Inventor： Chong Richard Zhao ,  Xiaoning Ye

IPC: H05K1/11 ,  H01P3/02 ,  H05K1/02

CPC classification number: H05K1/0216 ,  H01P3/026 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/111 ,  H05K1/115 ,  H05K1/116

Abstract: Generally discussed herein are systems, apparatuses, and methods that relate to reducing crosstalk in a differential signal pair. According to an example, a device may include a first pair of differential signal lines comprising a first signal line and a second signal line proximate the first signal line, the first signal line and the second signal line separated from each other along a first line, and a second pair of differential signal lines comprising a third signal line proximate a fourth signal, the third signal line and the fourth signal separated from each other along a second line generally perpendicular to the first line.

Abstract translation: 这里通常讨论的是减少差分信号对中的串扰的系统，装置和方法。 根据示例，设备可以包括第一对差分信号线，包括第一信号线和靠近第一信号线的第二信号线，第一信号线和第二信号线沿着第一线彼此分离， 以及第二对差分信号线，包括靠近第四信号的第三信号线，所述第三信号线和所述第四信号沿着大致垂直于所述第一线的第二线彼此分离。