公开(公告)号：US09659869B2

公开(公告)日：2017-05-23

申请号：US13630724

申请日：2012-09-28

Applicant: Intel Corporation

Inventor： Christopher J Jezewski ,  Alan M Meyers ,  Kanwal Jit Singh ,  Tejaswi K Indukuri ,  James S Clarke ,  Florian Gstrein

IPC: H01L23/532 ,  H01L21/768

CPC classification number: H01L23/53238 ,  H01L21/76808 ,  H01L21/76843 ,  H01L21/76847 ,  H01L21/76849 ,  H01L21/76883 ,  H01L21/76886 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Described herein are techniques structures related to forming barrier walls, capping, or alloys/compounds such as treating copper so that an alloy or compound is formed, to reduce electromigration (EM) and strengthen metal reliability which degrades as the length of the lines increases in integrated circuits.

公开(公告)号：US09258114B2

公开(公告)日：2016-02-09

申请号：US13705720

申请日：2012-12-05

Applicant: Intel Corporation

Inventor： Christopher J Jezewski ,  Kelin J Kuhn ,  Marko Radosavljevic

IPC: H04L9/08

CPC classification number: H04L9/0852

Abstract: Described herein are techniques related to implementation of a quantum key distribution (QKD) scheme by a photonic integrated circuit (PIC). For example, the PIC is a component in a wireless device that is used for quantum communications in a quantum communications system.

Abstract translation: 这里描述的是与通过光子集成电路（PIC）实现量子密钥分配（QKD）方案有关的技术。 例如，PIC是用于量子通信系统中的量子通信的无线设备中的组件。