公开(公告)号：US20250112162A1

公开(公告)日：2025-04-03

申请号：US18375469

申请日：2023-09-30

Applicant: Intel Corporation

Inventor： Zheng Kang ,  Tchefor Ndukum ,  Yosuke Kanaoka ,  Jeremy Ecton ,  Gang Duan ,  Jefferson Kaplan ,  Yonggang Yong Li ,  Minglu Liu ,  Brandon C. Marin ,  Bai Nie ,  Srinivas Pietambaram ,  Shriya Seshadri ,  Bohan Shan ,  Deniz Turan ,  Vishal Bhimrao Zade

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

Abstract: An electronic package comprises a substrate core; one or more dielectric material layers over the substrate core and having a lower dielectric material layer, and a plurality of metallization layers comprising an upper-most metallization layer; an integrated circuit (IC) die embedded within the dielectric material and below the upper-most metallization layer; and at least one conductive feature below and coupled to the IC die. A downwardly facing surface of the conductive feature is located on the lower dielectric material layer and defines a horizontal plane at a junction between the conductive feature and the lower dielectric material layer. The lower dielectric material layer has an upper facing surface facing in a direction of the IC die adjacent the conductive feature that is vertically offset from the horizontal plane.

公开(公告)号：US20250096052A1

公开(公告)日：2025-03-20

申请号：US18469674

申请日：2023-09-19

Applicant: Intel Corporation

Inventor： Mohamed R. Saber ,  Hanyu Song ,  Fanyi Zhu ,  Bai Nie ,  Srinivas V. Pietambaram ,  Deniz Turan ,  Yonggang Li ,  Naiya Soetan-Dodd ,  Shuren Qu

IPC: H01L23/15 ,  H01L21/48 ,  H01L23/00 ,  H01L23/48 ,  H01L25/065

Abstract: Microelectronic assemblies with glass cores that have undergone localized thermal healing and/or localized doping in regions adjacent to glass surface are disclosed. In one example, a microelectronic assembly includes a glass core having a first face, an opposing second face, a sidewall extending between the first face and the second face, a surface region, and a bulk region, where the surface region is a portion of the glass core that starts at a surface of the first face, the second face, or the sidewall and extends from the surface into the glass core by a total depth of up to about 50 micron, the bulk region is a portion of the glass core further away from the surface than the surface region, and a density of the surface region is higher than a density of the bulk region, e.g., at least about 5% higher or at least about 7.5% higher.