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公开(公告)号:US20250096052A1
公开(公告)日:2025-03-20
申请号:US18469674
申请日:2023-09-19
Applicant: Intel Corporation
Inventor: Mohamed R. Saber , Hanyu Song , Fanyi Zhu , Bai Nie , Srinivas V. Pietambaram , Deniz Turan , Yonggang Li , Naiya Soetan-Dodd , Shuren Qu
IPC: H01L23/15 , H01L21/48 , H01L23/00 , H01L23/48 , H01L25/065
Abstract: Microelectronic assemblies with glass cores that have undergone localized thermal healing and/or localized doping in regions adjacent to glass surface are disclosed. In one example, a microelectronic assembly includes a glass core having a first face, an opposing second face, a sidewall extending between the first face and the second face, a surface region, and a bulk region, where the surface region is a portion of the glass core that starts at a surface of the first face, the second face, or the sidewall and extends from the surface into the glass core by a total depth of up to about 50 micron, the bulk region is a portion of the glass core further away from the surface than the surface region, and a density of the surface region is higher than a density of the bulk region, e.g., at least about 5% higher or at least about 7.5% higher.
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公开(公告)号:US20250112175A1
公开(公告)日:2025-04-03
申请号:US18477638
申请日:2023-09-29
Applicant: Intel Corporation
Inventor: Brandon C. Marin , Jesse C. Jones , Yosef Kornbluth , Mitchell Page , Soham Agarwal , Fanyi Zhu , Shuren Qu , Hanyu Song , Srinivas V. Pietambaram , Yonggang Li , Bai Nie , Nicholas Haehn , Astitva Tripathi , Mohamed R. Saber , Sheng Li , Pratyush Mishra , Benjamin T. Duong , Kari Hernandez , Praveen Sreeramagiri , Yi Li , Ibrahim El Khatib , Whitney Bryks , Mahdi Mohammadighaleni , Joshua Stacey , Travis Palmer , Gang Duan , Jeremy Ecton , Suddhasattwa Nad , Haobo Chen , Robin Shea McRee , Mohammad Mamunur Rahman
IPC: H01L23/00 , H01L23/13 , H01L23/15 , H01L25/065
Abstract: Various techniques for edge stress reduction in glass cores and related devices and methods are disclosed. In one example, a microelectronic assembly includes a glass core having a bottom surface, a top surface opposite the bottom surface, and one or more sidewalls extending between the bottom surface and the top surface, and further includes a panel of an organic material, wherein the glass core is embedded within the panel. In another example, a microelectronic assembly includes a glass core as in the first example, where an angle between a portion of an individual sidewall and one of the bottom surface or the top surface is greater than 90 degrees. In yet another example, a microelectronic assembly includes a glass core as in the first example, and further includes a pattern of a material on one of the one or more sidewalls.
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