公开(公告)号：US20250096052A1

公开(公告)日：2025-03-20

申请号：US18469674

申请日：2023-09-19

Applicant: Intel Corporation

Inventor： Mohamed R. Saber ,  Hanyu Song ,  Fanyi Zhu ,  Bai Nie ,  Srinivas V. Pietambaram ,  Deniz Turan ,  Yonggang Li ,  Naiya Soetan-Dodd ,  Shuren Qu

IPC: H01L23/15 ,  H01L21/48 ,  H01L23/00 ,  H01L23/48 ,  H01L25/065

Abstract: Microelectronic assemblies with glass cores that have undergone localized thermal healing and/or localized doping in regions adjacent to glass surface are disclosed. In one example, a microelectronic assembly includes a glass core having a first face, an opposing second face, a sidewall extending between the first face and the second face, a surface region, and a bulk region, where the surface region is a portion of the glass core that starts at a surface of the first face, the second face, or the sidewall and extends from the surface into the glass core by a total depth of up to about 50 micron, the bulk region is a portion of the glass core further away from the surface than the surface region, and a density of the surface region is higher than a density of the bulk region, e.g., at least about 5% higher or at least about 7.5% higher.

公开(公告)号：US20250112175A1

公开(公告)日：2025-04-03

申请号：US18477638

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Brandon C. Marin ,  Jesse C. Jones ,  Yosef Kornbluth ,  Mitchell Page ,  Soham Agarwal ,  Fanyi Zhu ,  Shuren Qu ,  Hanyu Song ,  Srinivas V. Pietambaram ,  Yonggang Li ,  Bai Nie ,  Nicholas Haehn ,  Astitva Tripathi ,  Mohamed R. Saber ,  Sheng Li ,  Pratyush Mishra ,  Benjamin T. Duong ,  Kari Hernandez ,  Praveen Sreeramagiri ,  Yi Li ,  Ibrahim El Khatib ,  Whitney Bryks ,  Mahdi Mohammadighaleni ,  Joshua Stacey ,  Travis Palmer ,  Gang Duan ,  Jeremy Ecton ,  Suddhasattwa Nad ,  Haobo Chen ,  Robin Shea McRee ,  Mohammad Mamunur Rahman

IPC: H01L23/00 ,  H01L23/13 ,  H01L23/15 ,  H01L25/065

Abstract: Various techniques for edge stress reduction in glass cores and related devices and methods are disclosed. In one example, a microelectronic assembly includes a glass core having a bottom surface, a top surface opposite the bottom surface, and one or more sidewalls extending between the bottom surface and the top surface, and further includes a panel of an organic material, wherein the glass core is embedded within the panel. In another example, a microelectronic assembly includes a glass core as in the first example, where an angle between a portion of an individual sidewall and one of the bottom surface or the top surface is greater than 90 degrees. In yet another example, a microelectronic assembly includes a glass core as in the first example, and further includes a pattern of a material on one of the one or more sidewalls.

公开(公告)号：US12296360B2

公开(公告)日：2025-05-13

申请号：US17898503

申请日：2022-08-30

Applicant: Intel Corporation

Inventor： Fanyi Zhu ,  Hanyu Song

IPC: B05D3/06 ,  B05D1/12 ,  H05K3/02

Abstract: There may be provided a material deposition method and a material deposition apparatus. The method may include providing a substrate. The method may further include providing a layer of a material in a solid form onto the substrate. The material in the solid form may be loosely interfacing with the substrate. The method may further include irradiating the material in a solid form with a light to melt the material in the solid form to the material in a liquid form at one or more specific areas of the substrate. The method may further include cooling the material in the liquid form to a solidified material on the substrate. The solidified material may form a pattern, at the one or more specific areas of the substrate, that adheres to the substrate.