公开(公告)号：US11676876B2

公开(公告)日：2023-06-13

申请号：US16557891

申请日：2019-08-30

Applicant: Intel Corporation

Inventor： Ziyin Lin ,  Elizabeth Nofen ,  Vipul Mehta ,  Taylor Gaines

IPC: H01L23/31 ,  H01L21/56 ,  H01L23/367 ,  H01L23/373 ,  H01L21/67

CPC classification number: H01L23/3178 ,  H01L21/565 ,  H01L21/67288 ,  H01L23/367 ,  H01L23/373

Abstract: A device is disclosed. The device includes a first die, a plurality of chiplets above the first die, a first underfill material beneath the chiplets, and a gap fill material between the chiplets. The gap fill material is different from the first underfill material. An interface region is formed between the first underfill material and the gap fill material.

公开(公告)号：US11562940B2

公开(公告)日：2023-01-24

申请号：US16296898

申请日：2019-03-08

Applicant: Intel Corporation

Inventor： Elizabeth Nofen ,  James C. Matayabas, Jr. ,  Yawei Liang ,  Yiqun Bai

IPC: H01L23/00 ,  H01L23/373 ,  H01L23/367 ,  F28F21/08 ,  H01L21/48

Abstract: An apparatus is provided which comprises: a die comprising an integrated circuit, a first material layer comprising a first metal, the first material layer on a surface of the die, and extending at least between opposite lateral sides of the die, a second material layer comprising a second metal over the first material layer, and a third material layer comprising silver particles and having a porosity greater than that of the second material layer, the third material layer between the first material layer and the second material layer. Other embodiments are also disclosed and claimed.

公开(公告)号：US20190099777A1

公开(公告)日：2019-04-04

申请号：US15720655

申请日：2017-09-29

Applicant: Intel Corporation

Inventor： Ken P. Hackenberg ,  Nachiket R. Raravikar ,  James C. Matayabas, JR. ,  Elizabeth Nofen ,  Seth B. Reynolds ,  Amram Eitan ,  Nisha Ananthakrishnan

IPC: B05C5/02 ,  B05C11/10

Abstract: A fluid applicator configured to apply a fluid to at least one substrate feature includes a manifold plate having an inflow orifice and a manifold reservoir. A distributor plate is coupled with the manifold plate. The distributor plate includes a distributor surface extending across the manifold reservoir, and a distributor port array spread across the distributor surface and in communication with the manifold reservoir. A compressible reticulated media is configured for applying the fluid to the at least one substrate feature. The compressible reticulated media includes an input interface coupled along the distributor surface, and a substrate interface having an applicator profile corresponding to a feature profile of the at least one substrate feature. Reticulations extend from the input interface to the substrate interface, and the reticulations are distributed across the substrate interface.

公开(公告)号：US20200286806A1

公开(公告)日：2020-09-10

申请号：US16296898

申请日：2019-03-08

Applicant: Intel Corporation

Inventor： Elizabeth Nofen ,  James C. Matayabas, JR. ,  Yawei Liang ,  Yiqun Bai

IPC: H01L23/373 ,  H01L23/367 ,  H01L23/00 ,  H01L21/48 ,  F28F21/08

Abstract: An apparatus is provided which comprises: a die comprising an integrated circuit, a first material layer comprising a first metal, the first material layer on a surface of the die, and extending at least between opposite lateral sides of the die, a second material layer comprising a second metal over the first material layer, and a third material layer comprising silver particles and having a porosity greater than that of the second material layer, the third material layer between the first material layer and the second material layer. Other embodiments are also disclosed and claimed.