公开(公告)号：US09635764B2

公开(公告)日：2017-04-25

申请号：US14866648

申请日：2015-09-25

Applicant: Intel Corporation

Inventor： Shipeng Qiu ,  Shawna Liff ,  Kayleen L Helms ,  Joshua D Heppner ,  Adel Elsherbini ,  Johanna Swan ,  Gary M. Barnes

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/32 ,  H05K1/14 ,  H05K3/36 ,  H05K3/22 ,  H05K3/30 ,  H05K3/00

CPC classification number: H05K1/189 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/036 ,  H05K1/144 ,  H05K3/0014 ,  H05K3/22 ,  H05K3/303 ,  H05K3/326 ,  H05K3/361 ,  H05K2201/0133 ,  H05K2201/0308 ,  H05K2201/041 ,  H05K2201/047 ,  H05K2201/057 ,  H05K2201/10007 ,  H05K2201/10128 ,  H05K2203/10 ,  H05K2203/104 ,  H05K2203/105 ,  H05K2203/1105 ,  H05K2203/1194

Abstract: An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.