公开(公告)号：US20210235603A1

公开(公告)日：2021-07-29

申请号：US17186092

申请日：2021-02-26

Applicant: Intel Corporation

Inventor： Justin HUTTULA ,  Bala SUBRAMANYA ,  Juha PAAVOLA ,  Mark CARBONE ,  Todd SMITH ,  Kari MANSUKOSKI ,  Samarth ALVA ,  Satyajit Siddharay KAMAT ,  Nagaraj K

IPC: H05K9/00 ,  H05K7/20

Abstract: A circuit board and vapor chamber are disclosed. Connectors couple the vapor chamber to a circuit board. The connectors extend from the bottom of the vapor chamber. The connectors fix the vapor chamber to the circuit board such that the bottom of the vapor chamber thermally couples to a heat source on the circuit board. The circuit board has a connector assembly that couples to the vapor chamber.

公开(公告)号：US20250008711A1

公开(公告)日：2025-01-02

申请号：US18344934

申请日：2023-06-30

Applicant: Intel Corporation

Inventor： Juha PAAVOLA ,  Curtis KOEPSELL ,  Sami HEINISUO ,  Kari MANSUKOSKI ,  Jeff KU

IPC: H05K9/00 ,  H05K1/02

Abstract: An electronic device and method for assembling an electronic device. The device includes a shielding structure at least partially, laterally surrounding an electrical component on a circuit board. The device further includes a lid affixed to the top of the shielding structure and covering the electrical component, a spring directly or indirectly applying a load force to the electronic component, and a fastener affixing the lid and the spring to the circuit board.