SINGLE CHIP MULTI-DIE ARCHITECTURE HAVING SAFETY-COMPLIANT CROSS-MONITORING CAPABILITY

    公开(公告)号:US20190294125A1

    公开(公告)日:2019-09-26

    申请号:US16439407

    申请日:2019-06-12

    Abstract: Methods, systems and apparatuses may provide for technology that includes a chip having a first die including a first processing logic to execute a first application instance and generate a first output of the first application instance, and a second processing logic to execute a second application instance and generate a second output of the second application instance. The chip may also include a second die coupled to the first die, wherein the second die includes a safety monitor detect a condition associated with one or more of an error in the first output, an error in the second output, or a discrepancy between the first output and the second output. The safety monitor may also initiate a transition of the chip into a safe state in response to the condition.

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