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公开(公告)号:US11841776B2
公开(公告)日:2023-12-12
申请号:US16439407
申请日:2019-06-12
Applicant: Intel Corporation
Inventor: Nabajit Deka , Riccardo Mariani , Asad Azam , Roger May , Prashanth Gadila
CPC classification number: G06F11/1641 , G05B9/02 , G06F11/0796 , G06F11/3055 , G06F13/122
Abstract: Methods, systems and apparatuses may provide for technology that includes a chip having a first die including a first processing logic to execute a first application instance and generate a first output of the first application instance, and a second processing logic to execute a second application instance and generate a second output of the second application instance. The chip may also include a second die coupled to the first die, wherein the second die includes a safety monitor detect a condition associated with one or more of an error in the first output, an error in the second output, or a discrepancy between the first output and the second output. The safety monitor may also initiate a transition of the chip into a safe state in response to the condition.
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2.
公开(公告)号:US20190294125A1
公开(公告)日:2019-09-26
申请号:US16439407
申请日:2019-06-12
Applicant: Intel Corporation
Inventor: Nabajit Deka , Riccardo Mariani , Asad Azam , Roger May , Prashanth Gadila
Abstract: Methods, systems and apparatuses may provide for technology that includes a chip having a first die including a first processing logic to execute a first application instance and generate a first output of the first application instance, and a second processing logic to execute a second application instance and generate a second output of the second application instance. The chip may also include a second die coupled to the first die, wherein the second die includes a safety monitor detect a condition associated with one or more of an error in the first output, an error in the second output, or a discrepancy between the first output and the second output. The safety monitor may also initiate a transition of the chip into a safe state in response to the condition.
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