公开(公告)号：US20170287851A1

公开(公告)日：2017-10-05

申请号：US15607270

申请日：2017-05-26

Applicant: Intel Corporation

Inventor： Anna M. Prakash ,  Reynaldo Alberto Olmedo ,  Venmathy McMahan ,  Rajendra C. Dias ,  Joshua David Heppner ,  Ann Jinyan Xu ,  Sriya Sanyal ,  Eric Jin Li

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/29

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/56 ,  H01L23/293 ,  H01L23/295 ,  H01L23/49838 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.

公开(公告)号：US09685413B1

公开(公告)日：2017-06-20

申请号：US15089328

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Anna M. Prakash ,  Reynaldo Alberto Olmedo ,  Venmathy McMahan ,  Rajendra C. Dias ,  Joshua David Heppner ,  Ann Jinyan Xu ,  Sriya Sanyal ,  Eric Jin Li

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/56 ,  H01L23/293 ,  H01L23/295 ,  H01L23/49838 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.

公开(公告)号：US09991211B2

公开(公告)日：2018-06-05

申请号：US15607270

申请日：2017-05-26

Applicant: Intel Corporation

Inventor： Anna M. Prakash ,  Reynaldo Alberto Olmedo ,  Venmathy McMahan ,  Rajendra C. Dias ,  Joshua David Heppner ,  Ann Jinyan Xu ,  Sriya Sanyal ,  Eric Jin Li

IPC: H01L23/552 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/56 ,  H01L23/293 ,  H01L23/295 ,  H01L23/49838 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.