公开(公告)号：US20160351526A1

公开(公告)日：2016-12-01

申请号：US15117500

申请日：2014-03-29

Applicant: Intel Corporation

Inventor： Thomas Alan Boyd ,  Daniel Edward Shier ,  Viktor Vogman ,  Jonathan William Thibado ,  Joshua David Heppner

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L23/345 ,  H01L23/4006 ,  H01L24/81 ,  H01L2224/75253 ,  H01L2224/75901 ,  H01L2224/81815 ,  H01L2224/81908 ,  H01L2924/0002 ,  H01L2924/13091 ,  H05K7/1061 ,  H05K7/20 ,  H01L2924/00

Abstract: Integrated circuit chip attachment is described using a local heat source. In one example an interposer has a top side to connect to a silicon component and a bottom side to connect to a circuit board, the top side having a plurality of contact pads to electrically connect to the silicon component using solder. The interposer a plurality of heater traces having connection terminals. A removable control module attaches over the interposer and silicon component to conduct a current to the heater connection terminals to heat the heater traces, to melt a solder on the contact pads of the interposer and to form a solder joint between the component and the interposer.

Abstract translation: 使用局部热源描述集成电路芯片附件。 在一个示例中，插入器具有连接到硅部件和底侧以连接到电路板的顶侧，顶侧具有多个接触焊盘，以使用焊料电连接到硅部件。 插入器具有多个具有连接端子的加热器迹线。 可拆卸的控制模块连接在插入件和硅部件上，以将电流传导到加热器连接端子以加热加热器迹线，熔化插入件的接触焊盘上的焊料并且在部件和插入件之间形成焊接点。

公开(公告)号：US09991211B2

公开(公告)日：2018-06-05

申请号：US15607270

申请日：2017-05-26

Applicant: Intel Corporation

Inventor： Anna M. Prakash ,  Reynaldo Alberto Olmedo ,  Venmathy McMahan ,  Rajendra C. Dias ,  Joshua David Heppner ,  Ann Jinyan Xu ,  Sriya Sanyal ,  Eric Jin Li

IPC: H01L23/552 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/29

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/56 ,  H01L23/293 ,  H01L23/295 ,  H01L23/49838 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.

公开(公告)号：US20170287851A1

公开(公告)日：2017-10-05

申请号：US15607270

申请日：2017-05-26

Applicant: Intel Corporation

Inventor： Anna M. Prakash ,  Reynaldo Alberto Olmedo ,  Venmathy McMahan ,  Rajendra C. Dias ,  Joshua David Heppner ,  Ann Jinyan Xu ,  Sriya Sanyal ,  Eric Jin Li

IPC: H01L23/552 ,  H01L21/56 ,  H01L23/29

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/56 ,  H01L23/293 ,  H01L23/295 ,  H01L23/49838 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.

公开(公告)号：US09685413B1

公开(公告)日：2017-06-20

申请号：US15089328

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Anna M. Prakash ,  Reynaldo Alberto Olmedo ,  Venmathy McMahan ,  Rajendra C. Dias ,  Joshua David Heppner ,  Ann Jinyan Xu ,  Sriya Sanyal ,  Eric Jin Li

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/552 ,  H01L21/485 ,  H01L21/56 ,  H01L23/293 ,  H01L23/295 ,  H01L23/49838 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Semiconductor packages and methods of forming semiconductor packages are described. In an example, a semiconductor package includes a shielding layer containing metal particles, e.g., conductive particles or magnetic particles, in a resin matrix to attenuate electromagnetic interference. In an example, the shielding layer is transferred from a molding chase to the semiconductor package during a polymer molding operation.