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公开(公告)号:US20240312819A1
公开(公告)日:2024-09-19
申请号:US18185427
申请日:2023-03-17
Applicant: Intel Corporation
Inventor: Hong Seung YEON , Mariano PHIELIPP , Yi LI , Minglu LIU , Robin McREE , Yosuke KANAOKA , Gang DUAN
CPC classification number: H01L21/68 , H01L21/67259
Abstract: A method for real-time offset adjustment of a semiconductor die placement comprising: obtaining or receiving operational parameters of a die mounting tool in real-time, wherein the die mounting tool is configured for placing the semiconductor die on a panel; predicting an offset adjustment of the semiconductor die placement based on the operational parameters; and determining semiconductor die placement coordinates based on an original die placement and the offset adjustment.
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公开(公告)号:US20240078702A1
公开(公告)日:2024-03-07
申请号:US17902907
申请日:2022-09-05
Applicant: Intel Corporation
Inventor: Yi LI , Hong Seung YEON , Nicholas HAEHN , Wei LI , Raquel DE SOUZA BORGES FERREIRA , Minglu LIU , Robin McREE , Yosuke KANAOKA , Gang DUAN , Arnab ROY
IPC: G06T7/73 , H01L21/68 , H01L23/544
CPC classification number: G06T7/74 , H01L21/681 , H01L23/544 , G06T2207/20081 , G06T2207/30204 , H01L2223/54426
Abstract: A method for recognizing a reference point associated with a fiducial marker including the steps of: obtaining or receiving image data of the fiducial marker; determining the degree of which the image data of the fiducial marker is aligned with one or more reference images; of which if the degree of alignment is determined to be less than an acceptable threshold predicting a set of coordinates of the reference point associated with the fiducial marker; incorporating the set of coordinates with the image data to form a modified image data; and determining the degree of which the modified image data of the fiducial marker is aligned with one or more reference images.
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