公开(公告)号：US20250125242A1

公开(公告)日：2025-04-17

申请号：US18988169

申请日：2024-12-19

Applicant: Intel Corporation

Inventor： Santosh Gangal ,  Tin Poay Chuah

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H05K1/11 ,  H05K1/16 ,  H05K3/42 ,  H10D1/47 ,  H10D1/68

Abstract: Disclosed herein are via plug resistors for incorporation into electronic substrates, and related methods and devices. Exemplary via plug resistor structures include a resistive element within and on a surface of a via extending at least partially through an electronic substrate and first and second electrodes coupled to the resistive element.

公开(公告)号：US12278659B2

公开(公告)日：2025-04-15

申请号：US17348803

申请日：2021-06-16

Applicant: Intel Corporation

Inventor： Smit Kapila ,  Jayprakash Thakur ,  Santosh Gangal

IPC: H04B1/44 ,  H04B1/401

Abstract: A wireless computing device may include an internal antenna, a radio frequency (RF) transmission path that is switchably connectable to the internal antenna, a Universal Serial Bus (USB) connector configured to connect to an external antenna, a detector configured to detect if an external antenna is connected to the USB connector, and an antenna selector configured to (1) connect the internal antenna into the RF transmission path if the detector detects that no external antenna is connected to the USB connector and (2) disconnect the internal antenna from the RF transmission path and connect the external antenna into the RF transmission path if the detector detects that the external antenna is connected to the USB connector, thereby improving the wireless transmission/reception performance of the internal wireless module of the wireless computing device.

公开(公告)号：US20220302007A1

公开(公告)日：2022-09-22

申请号：US17204592

申请日：2021-03-17

Applicant: Intel Corporation

Inventor： Santosh Gangal ,  Tin Poay Chuah

IPC: H01L23/498 ,  H01L49/02 ,  H01L21/48 ,  H01L23/00 ,  H05K1/11 ,  H05K1/16

Abstract: Disclosed herein are via plug capacitors for incorporation into electronic substrates, and related methods and devices. Exemplary via plug capacitor structures include a capacitive element within a via extending at least partially through an electronic substrate and first and second electrodes coupled to the capacitive element.

公开(公告)号：US12218042B2

公开(公告)日：2025-02-04

申请号：US17204587

申请日：2021-03-17

Applicant: Intel Corporation

Inventor： Santosh Gangal ,  Tin Poay Chuah

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00 ,  H01L49/02 ,  H05K1/11 ,  H05K1/16 ,  H05K3/42

Abstract: Disclosed herein are via plug resistors for incorporation into electronic substrates, and related methods and devices. Exemplary via plug resistor structures include a resistive element within and on a surface of a via extending at least partially through an electronic substrate and first and second electrodes coupled to the resistive element.

公开(公告)号：US20240175640A1

公开(公告)日：2024-05-30

申请号：US18395919

申请日：2023-12-26

Applicant: Intel Corporation

Inventor： Santosh Gangal ,  Akarsha Kadadevaramath ,  Raghavendra S. Kanivihalli ,  Prakash Kurma Raju ,  Navneet Singh ,  Sarma Vmk Vedhanabhatla

IPC: F28D15/04

CPC classification number: F28D15/04

Abstract: A heat pipe, including: a variable dimension heat pipe exoskeleton formed of a heat-conductive material by blow molding or additive manufacturing, wherein the variable dimension heat pipe exoskeleton including: a first heat pipe exoskeleton portion with a dimension having a first value; and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value. Further, a method of manufacturing a heat pipe, including: providing a heat-conductive material; and performing blow molding or additive manufacturing to form a variable dimension heat pipe exoskeleton of the heat-conductive material, wherein the heat pipe exoskeleton has a first heat pipe exoskeleton portion with a dimension having a first value, and a second heat pipe exoskeleton portion with the dimension having a second value different from the first value.

公开(公告)号：US20220302006A1

公开(公告)日：2022-09-22

申请号：US17204587

申请日：2021-03-17

Applicant: Intel Corporation

Inventor： Santosh Gangal ,  Tin Poay Chuah

IPC: H01L23/498 ,  H01L49/02 ,  H01L23/00 ,  H05K1/11 ,  H05K1/16 ,  H01L21/48 ,  H05K3/42

Abstract: Disclosed herein are via plug resistors for incorporation into electronic substrates, and related methods and devices. Exemplary via plug resistor structures include a resistive element within and on a surface of a via extending at least partially through an electronic substrate and first and second electrodes coupled to the resistive element.