公开(公告)号：US20210410317A1

公开(公告)日：2021-12-30

申请号：US17474974

申请日：2021-09-14

Applicant: Intel Corporation

Inventor： Phil GENG ,  Ralph V. MIELE ,  David SHIA ,  Jeffory L. SMALLEY ,  Eric W. BUDDRIUS ,  Sean T. SIVAPALAN ,  Olaotan ELENITOBA-JOHNSON ,  Mengqi LIU

IPC: H05K7/14 ,  H01L23/053 ,  H01L23/40 ,  H01L23/32

Abstract: An apparatus is described. The apparatus includes a back plate, where, an electronic circuit board is to be placed between the back plate and a thermal cooling mass for a semiconductor chip package. The back plate includes a first material and a second material. The first material has greater stiffness than the second material. The back plate further includes at least one of: a third material having greater stiffness than the second material; re-enforcement wires composed of the first material; a plug composed of the second material that is inserted into a first cavity in the first material, a stud inserted into a second cavity in the plug. An improved bolster plate having inner support arms has also been described.