公开(公告)号：US20170005453A1

公开(公告)日：2017-01-05

申请号：US15100265

申请日：2013-12-27

Applicant: Intel Corporation

Inventor： Myung Jin YIM ,  Ansheng LIU ,  Valentin YEPANECHNIKOV

IPC: H01S5/022 ,  H01L31/0232

CPC classification number: H01S5/02236 ,  H01L21/563 ,  H01L31/0232 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01S5/0226 ,  H01S5/02476 ,  H01S5/18 ,  H01L2924/00

Abstract: Optoelectronic packaging assemblies are provided that are useful for optical data, transfer In high performance computing applications, board to board in data centers, memory to CPU, switch/FPGA (field programmable gate array) for chip to chip interconnects, and memory extension. The packaging assemblies provide fine pitch flip chip interconnects and chip stacking assemblies with good thermo-mechanical reliability. Underfill dams and optical overhang regions and are provided for optical interconnection.

Abstract translation: 提供光电包装组件，可用于光学数据，传输在高性能计算应用中，数据中心的板对板，CPU的存储器，用于芯片到芯片互连的开关/ FPGA（现场可编程门阵列）和存储器扩展。 封装组件提供精细的间距倒装芯片互连和芯片堆叠组件，具有良好的热机械可靠性。 底部填充坝和光学悬垂区域，并提供用于光学互连。