公开(公告)号：US11676873B2

公开(公告)日：2023-06-13

申请号：US16614765

申请日：2017-06-30

Applicant: Intel Corporation

Inventor： Dinesh Padmanabhan Ramalekshmi Thanu ,  Hemanth K. Dhavaleswarapu ,  Venkata Suresh Guthikonda ,  John J. Beatty ,  Yonghao An ,  Marco Aurelio Cartas Ayala ,  Luke J. Garner ,  Peng Li

IPC: H01L23/16 ,  H01L21/52 ,  H01L23/367 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/16 ,  H01L23/00 ,  H01L25/18

CPC classification number: H01L23/16 ,  H01L21/52 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/5383 ,  H01L25/0655 ,  H01L25/165 ,  H01L24/32 ,  H01L24/48 ,  H01L25/18 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2924/19041 ,  H01L2924/19105

Abstract: Semiconductor packages having a sealant bridge between an integrated heat spreader and a package substrate are described. In an embodiment, a semiconductor package includes a sealant bridge anchoring the integrated heat spreader to the package substrate at locations within an overhang gap laterally between a semiconductor die and a sidewall of the integrated heat spreader. The sealant bridge extends between a top wall of the integrated heat spreader and a die side component, such as a functional electronic component or a non-functional component, or a satellite chip on the package substrate. The sealant bridge modulates warpage or stress in thermal interface material joints to reduce thermal degradation of the semiconductor package.