摘要:
A method for restoration of building structure using infinity homographies calculated based on parallelograms includes: calculating, using two or more parallelograms, an infinity homography between those cameras which refer to an arbitrary camera; restoring cameras and the building structure on an affine space using the computed infinity homography and homologous points between images; and transforming the restored result onto the metric space using constraints on orthogonality of vectors joining the restored three-dimensional points, the ratio of lengths of the vectors and intrinsic camera parameters. As a result, intrinsic camera parameters, camera positions on the metric space and the structure of the building are restored. All the restoration is possible even when intrinsic camera parameters corresponding to all the images are not constant.
摘要:
A method for restoration of building structure using infinity homographies calculated based on parallelograms includes: calculating, using two or more parallelograms, an infinity homography between those cameras which refer to an arbitrary camera; restoring cameras and the building structure on an affine space using the computed infinity homography and homologous points between images; and transforming the restored result onto the metric space using constraints on orthogonality of vectors joining the restored three-dimensional points, the ratio of lengths of the vectors and intrinsic camera parameters. As a result, intrinsic camera parameters, camera positions on the metric space and the structure of the building are restored. All the restoration is possible even when intrinsic camera parameters corresponding to all the images are not constant.
摘要:
A camera tracking apparatus for calculating in real time feature information and camera motion information based on an input image includes a global camera tracking unit for computing a global feature map having feature information on entire feature points; a local camera tracking unit for computing in real time a local feature map having feature information on a part of the entire feature points; a global feature map update unit for receiving the computed feature information from the global and local camera tracking units to update the global feature map; and a local feature selection unit for receiving the updated feature information from the global feature map update unit to select in real time the feature points contained in the local feature map. The local camera tracking unit computes the local feature map for each frame, while the global camera tracking unit computes the global feature map over frames.
摘要:
A camera tracking apparatus for calculating in real time feature information and camera motion information based on an input image includes a global camera tracking unit for computing a global feature map having feature information on entire feature points; a local camera tracking unit for computing in real time a local feature map having feature information on a part of the entire feature points; a global feature map update unit for receiving the computed feature information from the global and local camera tracking units to update the global feature map; and a local feature selection unit for receiving the updated feature information from the global feature map update unit to select in real time the feature points contained in the local feature map. The local camera tracking unit computes the local feature map for each frame, while the global camera tracking unit computes the global feature map over frames.
摘要:
An apparatus for calibrating images between cameras, includes: a detector for detecting dynamic markers from images taken by a motion capture camera and a video camera; a 3D position recovery unit for recovering 3D position data of the dynamic markers obtained by the motion capture camera; a 2D position tracking unit for tracking 2D position data of the dynamic markers obtained by the video camera; a matching unit for matching the 3D position data and the 2D position data of the dynamic markers; and a calibrating unit for converting the 3D position of the dynamic markers on a spatial coordinate system into image coordinates on an image coordinate system of the video camera to calculate intrinsic parameters and extrinsic parameters of the video camera to minimize a difference between coordinates of the 2D position data and the image coordinates.
摘要:
An apparatus for calibrating images between cameras, includes: a detector for detecting dynamic markers from images taken by a motion capture camera and a video camera; a 3D position recovery unit for recovering 3D position data of the dynamic markers obtained by the motion capture camera; a 2D position tracking unit for tracking 2D position data of the dynamic markers obtained by the video camera; a matching unit for matching the 3D position data and the 2D position data of the dynamic markers; and a calibrating unit for converting the 3D position of the dynamic markers on a spatial coordinate system into image coordinates on an image coordinate system of the video camera to calculate intrinsic parameters and extrinsic parameters of the video camera to minimize a difference between coordinates of the 2D position data and the image coordinates.
摘要:
Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device using a DMOS device includes: a semiconductor substrate, in which a first conductive type well is formed; a first conductive type gate electrode formed on the semiconductor substrate with a gate insulating layer intervening between the gate electrode and the semiconductor substrate; a second conductive type body electrode formed on the semiconductor substrate and separated from the gate electrode; a first conductive type drain electrode formed on the semiconductor substrate and separated from the gate electrode and the body electrode; a second conductive type first body region formed in the well under the body electrode; a second conductive type second body region extending from the first body region to the gate insulating layer and formed in the well; a first conductive type source region formed in the second body region and extending from the first body region to the gate insulating layer; and a first conductive type source electrode extending from the source region to surround the gate electrode on the semiconductor substrate with an insulating layer intervening between the source electrode and gate electrode.
摘要:
Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device using a DMOS device includes: a semiconductor substrate, in which a first conductive type well is formed; a first conductive type gate electrode formed on the semiconductor substrate with a gate insulating layer intervening between the gate electrode and the semiconductor substrate; a second conductive type body electrode formed on the semiconductor substrate and separated from the gate electrode; a first conductive type drain electrode formed on the semiconductor substrate and separated from the gate electrode and the body electrode; a second conductive type first body region formed in the well under the body electrode; a second conductive type second body region extending from the first body region to the gate insulating layer and formed in the well; a first conductive type source region formed in the second body region and extending from the first body region to the gate insulating layer; and a first conductive type source electrode extending from the source region to surround the gate electrode on the semiconductor substrate with an insulating layer intervening between the source electrode and gate electrode.
摘要:
Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device using a DMOS device includes: a semiconductor substrate, in which a first conductive type well is formed; a first conductive type gate electrode formed on the semiconductor substrate with a gate insulating layer intervening between the gate electrode and the semiconductor substrate; a second conductive type body electrode formed on the semiconductor substrate and separated from the gate electrode; a first conductive type drain electrode formed on the semiconductor substrate and separated from the gate electrode and the body electrode; a second conductive type first body region formed in the well under the body electrode; a second conductive type second body region extending from the first body region to the gate insulating layer and formed in the well; a first conductive type source region formed in the second body region and extending from the first body region to the gate insulating layer; and a first conductive type source electrode extending from the source region to surround the gate electrode on the semiconductor substrate with an insulating layer intervening between the source electrode and gate electrode.
摘要:
Provided are a semiconductor device and a method of fabricating the semiconductor device. The semiconductor device using a DMOS device includes: a semiconductor substrate, in which a first conductive type well is formed; a first conductive type gate electrode formed on the semiconductor substrate with a gate insulating layer intervening between the gate electrode and the semiconductor substrate; a second conductive type body electrode formed on the semiconductor substrate and separated from the gate electrode; a first conductive type drain electrode formed on the semiconductor substrate and separated from the gate electrode and the body electrode; a second conductive type first body region formed in the well under the body electrode; a second conductive type second body region extending from the first body region to the gate insulating layer and formed in the well; a first conductive type source region formed in the second body region and extending from the first body region to the gate insulating layer; and a first conductive type source electrode extending from the source region to surround the gate electrode on the semiconductor substrate with an insulating layer intervening between the source electrode and gate electrode.