PREFORMED ADHESIVE BODIES USEFUL FOR JOINING SUBSTRATES
    1.
    发明申请
    PREFORMED ADHESIVE BODIES USEFUL FOR JOINING SUBSTRATES 审中-公开
    预先使用的粘合体可用于接合基材

    公开(公告)号:US20090104448A1

    公开(公告)日:2009-04-23

    申请号:US12186748

    申请日:2008-08-06

    IPC分类号: B32B37/02 B32B27/38

    摘要: A first substrate may be joined to a second substrate using an adhesive body. The adhesive body is formed from an adhesive composition containing at least one epoxy resin, at least one heat-activatable curing agent, and at least one radiation-curable compound. A first surface of the adhesive body is exposed to an amount of radiation effective to cure at least a portion of the at least one radiation-curable compound present in proximity to such first surface, thereby rendering said first surface less tacky and/or more resistant to deformation. A second surface of the adhesive body is then applied to a surface of said first substrate. A surface of the second substrate is thereafter positioned proximate to or in contact with the first surface of the adhesive body and the adhesive body heated to a temperature effective to activate the heat-activated curing agent and induce curing of the at least one epoxy resin.

    摘要翻译: 第一基底可以使用粘合体连接到第二基底。 粘合体由含有至少一种环氧树脂,至少一种可热活化的固化剂和至少一种可辐射固化的化合物的粘合剂组合物形成。 粘合体的第一表面暴露于有效量的固化至少一部分在该第一表面附近存在的至少一种可辐射固化的化合物的辐射,从而使所述第一表面较不粘和/或更耐性 变形。 然后将粘合体的第二表面施加到所述第一基底的表面。 此后,第二基板的表面接近或接触粘合体的第一表面,并且粘合体被加热到有效激活热活化固化剂并引起至少一种环氧树脂的固化的温度。