ARRAY SUBSTRATE
    1.
    发明申请

    公开(公告)号:US20240429320A1

    公开(公告)日:2024-12-26

    申请号:US18824934

    申请日:2024-09-05

    Abstract: A semiconductor device includes an oxide semiconductor layer including indium, a gate electrode facing the oxide semiconductor layer, a gate insulating layer between the oxide semiconductor layer and the gate electrode, and a first electrode arranged above the oxide semiconductor layer and being in contact with the oxide semiconductor layer from above the oxide semiconductor layer. The indium is unevenly distributed in an unevenly distributed region among the oxide semiconductor layer. The unevenly distributed region overlaps with the first conductive layer in a planar view.

    SEMICONDUCTOR DEVICE
    2.
    发明申请

    公开(公告)号:US20220013668A1

    公开(公告)日:2022-01-13

    申请号:US17483836

    申请日:2021-09-24

    Abstract: A semiconductor device includes an oxide semiconductor layer including indium, a gate electrode facing the oxide semiconductor layer, a gate insulating layer between the oxide semiconductor layer and the gate electrode, and a first electrode arranged above the oxide semiconductor layer and being in contact with the oxide semiconductor layer from above the oxide semiconductor layer. The indium is unevenly distributed in an unevenly distributed region among the oxide semiconductor layer. The unevenly distributed region overlaps with the first conductive layer in a planar view.

    DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE

    公开(公告)号:US20220004039A1

    公开(公告)日:2022-01-06

    申请号:US17447740

    申请日:2021-09-15

    Abstract: A display device comprising a transistor and a display element over the transistor, wherein the transistor includes a gate electrode on an insulating surface, a gate insulating layer on the gate electrode, and source/drain electrodes on the oxide semiconductor layer and the gate insulating layer, each including a first conductive layer containing nitrogen and a second conductive layer on the first conductive layer, and an insulating layer contains oxygen on the oxide semiconductor layer and the source/drain electrodes.

    THIN FILM TRANSISTOR AND MANUFACTURING METHOD FOR THIN FILM TRANSISTOR

    公开(公告)号:US20210210524A1

    公开(公告)日:2021-07-08

    申请号:US17209376

    申请日:2021-03-23

    Abstract: To reduce degradation of characteristics and reliability of a transistor including an oxide semiconductor as an active layer. A thin film transistor comprising: an active layer formed of an oxide semiconductor including at least indium and gallium; an electrode layer including an aluminum layer and partially formed on the active layer; and an interlayer insulating layer formed on the active layer, wherein a peak value of chlorine concentration at an interface between the interlayer insulating layer and the active layer is equal to or less than 2.0×1019 [atoms/cm3], and a peak value of aluminum concentration at an interface between the interlayer insulating layer and the active layer is equal to or less than 1.0×1020 [atoms/cm3].

    SEMICONDUCTOR DEVICE AND DISPLAY DEVICE

    公开(公告)号:US20210013235A1

    公开(公告)日:2021-01-14

    申请号:US17031999

    申请日:2020-09-25

    Abstract: A semiconductor device including: a first gate electrode; a first gate insulating layer on the first gate electrode; a first oxide semiconductor layer on the first insulating layer; source and drain electrodes connected to the first oxide semiconductor layer; a second gate insulating layer on the first oxide semiconductor layer; a second oxide semiconductor layer on the second gate insulating layer; a second gate electrode on the second oxide semiconductor layer, the second gate electrode being in contact with the second oxide semiconductor layer; a first insulating layer on the second gate electrode, the first insulating layer having a part of a first aperture overlapping with the second oxide semiconductor layer in a planar view; and a first connecting electrode electrically connecting the first gate electrode and the second gate electrode via the first aperture.

    THIN FILM TRANSISTOR AND DISPLAY DEVICE

    公开(公告)号:US20210202639A1

    公开(公告)日:2021-07-01

    申请号:US17199991

    申请日:2021-03-12

    Abstract: To sufficiently reduce an off-leakage current of a transistor including an oxide semiconductor as an active layer, provide a transistor having uniform characteristics when forming a large number of transistors on a large substrate, and reduce a load on a manufacturing process. A thin film transistor comprising: an active layer formed of an oxide semiconductor including at least indium and gallium; a gate electrode; a first gate insulating layer disposed between the active layer and the gate electrode on the gate electrode side; and a second gate insulating layer, which is a hydrogen block layer, disposed between the active layer and the gate electrode on the active layer side.

    SEMICONDUCTOR DEVICE
    8.
    发明申请

    公开(公告)号:US20210091226A1

    公开(公告)日:2021-03-25

    申请号:US17111810

    申请日:2020-12-04

    Abstract: A semiconductor device includes a gate electrode on a substrate, a gate insulating film on the gate electrode, an oxide semiconductor film via the gate insulating film on the gate electrode, a source electrode and a drain electrode on the oxide semiconductor film, a protective film provided on the source electrode and the drain electrode; and a conductive layer provided on the protective film and overlapped on the oxide semiconductor layer. The protective film includes a first silicon oxide film and a first silicon nitride film. The first oxide film is in contact with the oxide semiconductor layer. The gate insulating film includes a second silicon nitride film and a second silicon oxide film. The second silicon oxide film is in contact with the oxide semiconductor layer. The oxide semiconductor layer has a first region located between the source electrode and the drain electrode in a plan view.

    SEMICONDUCTOR DEVICE
    9.
    发明申请

    公开(公告)号:US20250098321A1

    公开(公告)日:2025-03-20

    申请号:US18969433

    申请日:2024-12-05

    Abstract: A semiconductor device including: a first gate electrode; a first gate insulating layer on the first gate electrode; a first oxide semiconductor layer on the first insulating layer; source and drain electrodes connected to the first oxide semiconductor layer; a second gate insulating layer on the first oxide semiconductor layer; a second oxide semiconductor layer on the second gate insulating layer; a second gate electrode on the second oxide semiconductor layer, the second gate electrode being in contact with the second oxide semiconductor layer; a first insulating layer on the second gate electrode, the first insulating layer having a part of a first aperture overlapping with the second oxide semiconductor layer in a planar view; and a first connecting electrode electrically connecting the first gate electrode and the second gate electrode via the first aperture.

    SEMICONDUCTOR DEVICE
    10.
    发明申请

    公开(公告)号:US20240429321A1

    公开(公告)日:2024-12-26

    申请号:US18826548

    申请日:2024-09-06

    Abstract: A semiconductor device includes a gate electrode on a substrate, a gate insulating film on the gate electrode, an oxide semiconductor film via the gate insulating film on the gate electrode, a source electrode and a drain electrode on the oxide semiconductor film, a protective film provided on the source electrode and the drain electrode; and a conductive layer provided on the protective film and overlapped on the oxide semiconductor layer. The protective film includes a first silicon oxide film and a first silicon nitride film. The first oxide film is in contact with the oxide semiconductor layer. The gate insulating film includes a second silicon nitride film and a second silicon oxide film. The second silicon oxide film is in contact with the oxide semiconductor layer. The oxide semiconductor layer has a first region located between the source electrode and the drain electrode in a plan view.

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