公开(公告)号：US5274911A

公开(公告)日：1994-01-04

申请号：US780111

申请日：1991-10-21

Applicant: Joseph A. Toro

Inventor： Joseph A. Toro

IPC: H01L21/48 ,  H01L23/495 ,  H01R4/02 ,  H01R43/02 ,  H05K3/34 ,  H01R43/00

CPC classification number: H01L21/4821 ,  H01L23/49582 ,  H01R4/028 ,  H01R43/0235 ,  H05K3/3447 ,  B23K2201/36 ,  H01L2924/0002 ,  H05K2201/10568 ,  H05K2201/10651 ,  H05K2201/10689 ,  H05K2201/10984 ,  H05K2203/1147 ,  H05K2203/304 ,  Y10T29/49121 ,  Y10T29/49222 ,  Y10T29/49224

Abstract: An electrical device includes an electrical component encased in encasement material with leads electrically coupled to the component and extending through the encasement material for attachment to an electrical circuit. The leads include an internal region plated with solder for attachment to the component, an external region plated with solder for electrically coupling the component to a circuit board, and an intermediate region between the internal and external regions which is devoid of solder and which is positioned to be in contact with the encasement material to define an unplated interface between the lead and the encasement material. Leads having a center region devoid of solder plating may be formed by providing a lead frame, with selectively plated and punched regions of the lead frame to form the internal and external lead portions, plating the internal and external lead portions with solder and thereafter punching the center unplatted region to provide a plurality of leads having a center unplatted region. Components are thereafter electrically coupled to the solder plated internal portions of the leads on the lead frame with the leads and attached electrical components encased in an encasement material so that the encasement material is in direct contact with the unplatted center region of the leads.

Abstract translation: 电气设备包括封装在封装材料中的电气部件，引线电耦合到部件并延伸穿过封装材料以附接到电路。 引线包括镀有用于附接到部件的焊料的内部区域，镀有用于将部件电耦合到电路板的焊料的外部区域，以及在内部和外部区域之间的中间区域，其中没有焊料并且被定位 与包装材料接触以限定铅和包装材料之间的未镀层界面。 具有不具有焊料镀层的中心区域的引线可以通过提供引线框架，引线框架的选择性镀覆和冲压区域形成内部和外部引线部分，用焊料电镀内部和外部引线部分，然后冲压 中心未平坦区域以提供具有中心未平坦区域的多个引线。 然后，元件电连接到引线框架上的引线的焊接镀层内部，引线和附接的电气部件封装在封装材料中，使得封装材料与引线的未平坦的中心区域直接接触。

公开(公告)号：US4914547A

公开(公告)日：1990-04-03

申请号：US190966

申请日：1988-05-06

Applicant: Joseph A. Toro ,  Thomas G. Johnson ,  Fred W. Olmsted

Inventor： Joseph A. Toro ,  Thomas G. Johnson ,  Fred W. Olmsted

IPC: H01G2/06 ,  H01G4/32 ,  H01G13/00

CPC classification number: H01G2/065 ,  H01G13/003 ,  H01G4/32 ,  Y10T29/435

Abstract: An epoxy-encased wound capacitor suitable for being surface mounted and wave soldered to electronic circuitry, e.g. circuit boards and process for making the epoxy-encased wound capacitor. The wound capacitor is formed from winding together lengths of two bilaminar ribbons. The capacitor is then cured by exposing it to ultrasonic energy according to a predefined ultrasonic profile while at substantially the same time, mechanically pressing the capacitor. Contacts are formed on the capacitor and wire leads attached. Subsequently, the capacitor is placed in a flexible, reusable plastic mold featuring lead guides for precisely spacing the leads of the capacitor. Bubble-free epoxy is poured in the molds and heat cured. The epoxy-encased capacitor, suitable for surface mounting and wave soldering, is then removed from the mold.

Abstract translation: 适用于表面安装和波焊焊接到电子电路的环氧树脂封装绕组电容器，例如。 电路板和制造环氧树脂包绕电容器的工艺。 卷绕电容器是通过将两个双层带的长度缠绕而形成的。 然后根据预定义的超声波轮廓将电容器暴露于超声波能量，同时在电机上机械地按压电容器来固化电容器。 触点形成在电容器和导线上。 随后，电容器被放置在一个灵活的，可重复使用的塑料模具中，其特征在于引线用于精确地间隔电容器的引线。 将无环氧树脂倒入模具中并加热固化。 然后将适用于表面安装和波峰焊的环氧树脂封装电容器从模具中取出。

公开(公告)号：US3967222A

公开(公告)日：1976-06-29

申请号：US581156

申请日：1975-05-27

Applicant: Joseph A. Toro

Inventor： Joseph A. Toro

IPC: H01G4/40 ,  H03H7/06

CPC classification number: H01G4/40

Abstract: A distributed resistance-capacitance component formed of windings of dielectric films having patterns of metallized layers formed thereon with margins shaped to provide a distributed resistance along the metallized layers and capacitance between the metallized layers on opposite sides of the dielectric films. Electrodes and leads are secured at opposite ends of the wound coil by metal spraying or schooping.

Abstract translation: 由电介质膜的绕组形成的分布式电阻电容元件，其具有在其上形成有金属化层的图案的金属化层的图案，其边缘被成形为沿着金属化层提供分布电阻，并且在介电膜的相对侧上的金属化层之间的电容。 电极和引线通过金属喷涂或冲击固定在缠绕线圈的相对端。