Method and apparatus for longest prefix matching based on a trie
    1.
    发明授权
    Method and apparatus for longest prefix matching based on a trie 有权
    基于特里的最长前缀匹配的方法和装置

    公开(公告)号:US07539153B1

    公开(公告)日:2009-05-26

    申请号:US12241513

    申请日:2008-09-30

    IPC分类号: G01R31/08

    CPC分类号: H04L45/00 H04L45/7457

    摘要: The present invention discloses a method and apparatus for longest prefix matching. The method includes (A) reading a current-level trie node (TNODE) in the trie, (B) determining whether an offset field of the TNODE indicates that a matched prefix exists in an upper level node and, if so, adding the offset field of the TNODE to a pointer that points to a leaf array in the upper level node, updating a current best match pointer with the computation result and executing block (C), otherwise, executing block (C), (C) determining whether the TNODE has a child node according to a child bitmap, when it is determined that a branch flag of the TNODE matches a corresponding bit of a search keyword, and (D) when it is determined that the TNODE has no child node, reading the internal bitmap of the TNODE, computing a longest matched prefix in the TNODE according to the internal bitmap and a pointer that points to a leaf array in the TNODE, updating the current best match pointer with the computation result, and computing an address of a leaf node (LNODE) associated with the current best match pointer.

    摘要翻译: 本发明公开了一种用于最长前缀匹配的方法和装置。 该方法包括:(A)读取该特技中的当前级别的特里节点(TNODE),(B)确定TNODE的偏移字段是否表示在上层节点中存在匹配的前缀,如果是, 将TNODE的字段指向指向上级节点中的叶阵列的指针,用计算结果和执行块(C)更新当前最佳匹配指针,否则执行块(C),(C)确定是否 当确定TNODE的分支标志与搜索关键字的相应位匹配时,TNODE具有根据子位图的子节点,以及(D)当确定TNODE没有子节点时,读取内部 TNODE的位图,根据内部位图计算TNODE中最长的匹配前缀,以及指向TNODE中的叶阵列的指针,使用计算结果更新当前最佳匹配指针,并计算叶节点的地址 (LNODE) nt最佳匹配指针。

    Heat-Sealing Cover Film For Packaging Electronic Components
    3.
    发明申请
    Heat-Sealing Cover Film For Packaging Electronic Components 审中-公开
    用于包装电子元件的热封封膜

    公开(公告)号:US20140170414A1

    公开(公告)日:2014-06-19

    申请号:US14235831

    申请日:2011-09-01

    IPC分类号: C09J7/02 B32B33/00 B32B27/08

    摘要: A cover film for heat-sealing to a carrier tape for carrying electronic components is described herein. The cover film comprises a polyester base layer, a first antistatic layer disposed on a first surface of the base layer, an intermediate bi-layer structure comprising a first intermediate layer and a second intermediate layer, the first intermediate layer disposed on a second surface of the base layer opposite the first antistatic layer, the second intermediate layer disposed on the first intermediate layer opposite the base layer, a second antistatic layer disposed on the second intermediate layer opposite the first intermediate layer, and a heat-sealing layer disposed on the second antistatic layer. In an exemplary aspect, the first intermediate layer comprises polyethylene and the second intermediate layer comprises a poly(vinyl acetate) copolymer and a polystyrene-butadiene) copolymer. In another exemplary aspect, the second antistatic layer comprises carbon nanotubes in a polyacrylate binder.

    摘要翻译: 本文描述了一种用于热封到用于承载电子部件的载带的覆盖膜。 覆盖膜包括聚酯基层,设置在基层的第一表面上的第一抗静电层,包括第一中间层和第二中间层的中间双层结构,第一中间层设置在第二表面的第二表面上 所述基底层与所述第一抗静电层相对,所述第二中间层设置在与所述基底层相对的所述第一中间层上,所述第二抗静电层设置在与所述第一中间层相对的所述第二中间层上, 抗静电层。 在示例性方面,第一中间层包括聚乙烯,第二中间层包含聚(乙酸乙烯酯)共聚物和聚苯乙烯 - 丁二烯共聚物。 在另一示例性方面,第二抗静电层包含聚丙烯酸酯粘合剂中的碳纳米管。