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公开(公告)号:US20170107374A1
公开(公告)日:2017-04-20
申请号:US15395382
申请日:2016-12-30
Applicant: Kaneka Corporation
Inventor: Tatsuro Harumashi , Yu Itano , Kiyoshi Miyafuji
CPC classification number: C08L71/02 , C08G65/336 , C08L33/04 , C08L33/12 , C09K3/10 , C08L43/04 , C08L33/06
Abstract: A curable composition iaciudes a polyoxyalkylene-based polymer (A); and a (meth)acrylate-based polymer (B), wherein the polyoxyalkylene-based polyer (A) has more than 1.0 reactive silicon group on average per one terminal portion, and the (meth)acrylate-based polymer (B) has more than or equal to 1.0 reactive silicon group on average per one molecule, wherein the (meth)acrylate-based polymer (B) is represented by the formula (1): —SiRX2 (1) wherein R is a hydrocarbon group having 1-20 carbon atoms or a hydrocarbon group having 1-20 carbon atoms substituted with a hetero atom-containing group or a halogen atom, and X is a hydroxyl group or a hydrolyzable group.
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公开(公告)号:US20180346770A1
公开(公告)日:2018-12-06
申请号:US16058109
申请日:2018-08-08
Applicant: KANEKA CORPORATION
Inventor: Yu Itano , Wendy Smits
IPC: C09J11/06 , C09J171/02 , C09J143/04
CPC classification number: C08K5/3415 , B27N3/06 , C09J11/06 , C09J133/06 , C09J171/02 , C09J183/12 , C09J201/10 , C08L71/02 , C08L33/06 , C08L101/10
Abstract: A curable composition includes an organic polymer (A) containing a reactive silicon group, and a cyclic N-hydroamide compound (B) having a cyclic structure. The cyclic structure of the cyclic N-hydroamide compound (B) has 6 or less ring-constituting atoms and a carboxamide bond.
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公开(公告)号:US10077375B2
公开(公告)日:2018-09-18
申请号:US14894977
申请日:2014-05-29
Applicant: Kaneka Corporation
Inventor: Kiyoshi Miyafuji , Yu Itano , Katsuyu Wakabayashi
IPC: C09D133/10 , C09D133/08 , C09D133/06 , C09D171/02 , C09D201/10 , C08L71/02 , C08L101/10 , C08F220/18 , C08L33/06 , C09D143/04 , C09K3/10 , C08G65/336
CPC classification number: C09D133/10 , C08F220/18 , C08G65/336 , C08L33/06 , C08L71/02 , C08L101/10 , C08L2205/05 , C09D133/06 , C09D133/08 , C09D143/04 , C09D171/02 , C09D201/10 , C09K3/1006 , C08F2220/1825 , C08F2220/1858 , C08F2230/085 , C08F2220/1891 , C08F220/14 , C08L33/04
Abstract: A curable composition includes organic polymer (A) having more than one reactive silicon group on average per molecule, represented by formula (1): —SiR1aX3-a (1), wherein R1 is a substituted or unsubstituted hydrocarbon group having 1-20 carbon atoms, each X is independently a hydroxy group or a hydrolyzable group, and a is 0 or 1, and (meth)acrylate-based polymer (B) having a reactive silicon group represented by formula (2): —SiX3 (2), wherein each X is as defined for the formula (1), polymer (B) has a reactive silicon group equivalent of not less than 0.30 mmol/g, and wherein a monomer (b1) is free of a reactive silicon group, a glass transition temperature of its homopolymer is not more than 80° C., and is contained as monomer(s) constituting polymer (B) in a proportion of not less than 40 wt % per 100 wt % of total monomer.
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公开(公告)号:US20170009113A1
公开(公告)日:2017-01-12
申请号:US15113693
申请日:2015-01-20
Applicant: Kaneka Corporation
Inventor: Yu Itano , Wendy Smits
IPC: C09J133/12 , C09J171/02 , C09J11/04 , C08K3/34
CPC classification number: C09J133/12 , C08K3/34 , C08K3/346 , C08K9/06 , C08L101/10 , C09J11/04 , C09J171/02 , C09J201/10
Abstract: A curable composition includes an organic polymer containing a reactive silicon group (A), and a bound substance of kaolinite and quartz (B) at a proportion of 30-200 parts by weight relative to 100 parts by weight of the organic polymer containing a reactive silicon group (A).
Abstract translation: 可固化组合物包含相对于100重量份含有反应性硅基团(A)的有机聚合物,含有活性硅基团(A)的有机聚合物和高岭土和石英(B)的结合物质的比例为30-200重量份 硅基(A)。
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公开(公告)号:US10150895B2
公开(公告)日:2018-12-11
申请号:US15113693
申请日:2015-01-20
Applicant: Kaneka Corporation
Inventor: Yu Itano , Wendy Smits
IPC: C09J133/12 , C09J11/04 , C09J201/10 , C09J171/02 , C08K9/06 , C08K3/34 , C08L101/10
Abstract: A curable composition includes an organic polymer containing a reactive silicon group (A), and a bound substance of kaolinite and quartz (B) at a proportion of 30-200 parts by weight relative to 100 parts by weight of the organic polymer containing a reactive silicon group (A).
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公开(公告)号:US20160137872A1
公开(公告)日:2016-05-19
申请号:US14894977
申请日:2014-05-29
Applicant: KANEKA CORPORATION
Inventor: Kiyoshi Miyafuji , Yu Itano , Katsuyu Wakabayashi
IPC: C09D133/10 , C09D133/08
CPC classification number: C09D133/10 , C08F220/18 , C08G65/336 , C08L33/06 , C08L71/02 , C08L2205/05 , C09D133/06 , C09D133/08 , C09D143/04 , C09D171/02 , C09K3/1006 , C08F2220/1825 , C08F2220/1858 , C08F2230/085 , C08F2220/1891 , C08F220/14 , C08L33/04
Abstract: Provided is a curable composition having low viscosity and good workability before curing, and affording a cured product having high strength. The above-mentioned problem can be solved by using a curable composition containing organic polymer (A) having a reactive silicon group and (meth)acrylate-based polymer (B) having a trifunctional reactive silicon group, and having a reactive silicon group equivalent of not less than 0.30 mmol/g, wherein monomer (b1) having a glass transition temperature of a homopolymer of not more than 80° C. is contained as a monomer constituting polymer (B) in a proportion of not less than 40 wt % per 100 wt % of the total monomer unit.
Abstract translation: 本发明提供固化前粘度低,加工性好的固化性组合物,提供强度高的固化物。 上述问题可以通过使用含有具有反应性硅基团的有机聚合物(A)和具有三官能反应性硅基的(甲基)丙烯酸酯类聚合物(B),并且具有反应性硅基当量的可固化组合物 不低于0.30mmol / g,其中包含均聚物不超过80℃的玻璃化转变温度的单体(b1)作为构成聚合物(B)的单体,其比例不小于40重量% 100重量%的总单体单元。
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