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公开(公告)号:US20220344476A1
公开(公告)日:2022-10-27
申请号:US17849848
申请日:2022-06-27
IPC分类号: H01L29/205 , H01L33/00 , H01L33/32 , H01L27/12 , H01L27/06 , H01L23/00 , H01L21/8252 , H01L21/02 , H01L21/311 , H01L21/683 , H01L27/088 , H01L27/15 , H01L29/66 , H01L33/06 , H01S5/02 , H01S5/227 , H01S5/343
摘要: A method for manufacturing an optical device includes providing a carrier waver, provide a first substrate having a first surface region, and forming a first gallium and nitrogen containing epitaxial material overlying the first surface region. The first epitaxial material includes a first release material overlying the first substrate. The method also includes patterning the first epitaxial material to form a plurality of first dice arranged in an array; forming a first interface region overlying the first epitaxial material; bonding the first interface region of at least a fraction of the plurality of first dice to the carrier wafer to form bonded structures; releasing the bonded structures to transfer a first plurality of dice to the carrier wafer, the first plurality of dice transferred to the carrier wafer forming mesa regions on the carrier wafer; and forming an optical waveguide in each of the mesa regions, the optical waveguide configured as a cavity to form a laser diode of the electromagnetic radiation.