公开(公告)号：US20050132567A1

公开(公告)日：2005-06-23

申请号：US11033511

申请日：2005-01-12

申请人： Kazuhiko Noda ,  Hitoshi Mukojima ,  Yasuhiro Narikiyo ,  Toshiro Hirakawa ,  Hiromi Kanaki ,  Akira Nishimura ,  Osamu Uchida ,  Takatoshi Ishikawa

发明人： Kazuhiko Noda ,  Hitoshi Mukojima ,  Yasuhiro Narikiyo ,  Toshiro Hirakawa ,  Hiromi Kanaki ,  Akira Nishimura ,  Osamu Uchida ,  Takatoshi Ishikawa

IPC分类号： H05K13/04 ,  H05K13/08 ,  H05K3/30

CPC分类号： H05K13/0452 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178

摘要： An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.

摘要翻译： 公开了一种电子元件贴装机和电子部件配置方法。 旋转芯片取出和传送机构提供的取出和转印头，从进纸器中取出芯片并翻转。 放置头接收翻转的芯片并将其放置在板上。 在取出和传送操作期间捕获在预定心识别位置处的芯片的图像，在此期间，取出和转印头在接收位置将芯片传送到放置头，以便识别该位置。 基于该位置识别结果，通过控制放置头驱动机构来定位芯片和放置头。 此外，取出转印头旋转到不妨碍用于放置定位的电子部件的图像捕获的位置。

公开(公告)号：US07191511B2

公开(公告)日：2007-03-20

申请号：US11033511

申请日：2005-01-12

申请人： Kazuhiko Noda ,  Hitoshi Mukojima ,  Yasuhiro Narikiyo ,  Toshiro Hirakawa ,  Hiromi Kanaki ,  Akira Nishimura ,  Osamu Uchida ,  Takatoshi Ishikawa

发明人： Kazuhiko Noda ,  Hitoshi Mukojima ,  Yasuhiro Narikiyo ,  Toshiro Hirakawa ,  Hiromi Kanaki ,  Akira Nishimura ,  Osamu Uchida ,  Takatoshi Ishikawa

IPC分类号： B23P19/00

CPC分类号： H05K13/0452 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178

摘要： An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.

摘要翻译： 公开了一种电子元件贴装机和电子部件配置方法。 旋转芯片取出和传送机构提供的取出和转印头，从进纸器中取出芯片并翻转。 放置头接收翻转的芯片并将其放置在板上。 在取出和传送操作期间捕获在预定心识别位置处的芯片的图像，在此期间，取出和转印头在接收位置将芯片传送到放置头，以便识别该位置。 基于该位置识别结果，通过控制放置头驱动机构来定位芯片和放置头。 此外，取出转印头旋转到不妨碍用于放置定位的电子部件的图像捕获的位置。

公开(公告)号：US07007377B2

公开(公告)日：2006-03-07

申请号：US10781787

申请日：2004-02-20

申请人： Kazuhiko Noda ,  Hitoshi Mukojima ,  Yasuhiro Narikiyo ,  Toshiro Hirakawa ,  Hiromi Kanaki ,  Akira Nishimura ,  Osamu Uchida ,  Takatoshi Ishikawa

发明人： Kazuhiko Noda ,  Hitoshi Mukojima ,  Yasuhiro Narikiyo ,  Toshiro Hirakawa ,  Hiromi Kanaki ,  Akira Nishimura ,  Osamu Uchida ,  Takatoshi Ishikawa

IPC分类号： H05K3/30

CPC分类号： H05K13/0452 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178

摘要： An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.

摘要翻译： 公开了一种电子元件贴装机和电子部件配置方法。 旋转芯片取出和传送机构提供的取出和转印头，从进纸器中取出芯片并翻转。 放置头接收翻转的芯片并将其放置在板上。 在取出和传送操作期间捕获在预定心识别位置处的芯片的图像，在此期间，取出和转印头在接收位置将芯片传送到放置头，以便识别该位置。 基于该位置识别结果，通过控制放置头驱动机构来定位芯片和放置头。 此外，取出转印头旋转到不妨碍用于放置定位的电子部件的图像捕获的位置。

公开(公告)号：US08151451B2

公开(公告)日：2012-04-10

申请号：US12496850

申请日：2009-07-02

申请人： Kazuhiko Noda

发明人： Kazuhiko Noda

IPC分类号： H05K13/04

CPC分类号： H01L24/75 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

摘要： In a construction in which the intermediate stage 5 is interposed between the substrate positioning stage 4 and the electronic component supply stage 3; and in which it is possible to select either a mode of the bonding head 10A transferring to the substrate positioning stage 4 the electronic component P taken out of the electronic component supply stage 3 by the pickup head 6 and mounted on the intermediate stage 5 or a mode for transporting the electronic components, which has been taken directly out of the electronic component supply stage 3, to the substrate positioning stage 4 by means of the bonding head 10A, the pickup head moving mechanism 7 for moving the pickup head 6 is coupled in a suspended manner to the lower surface of the beam member 8b of the gantry 8 positioned at the end of the base 2, and a space S that allows entry of a portion of the electronic component supply stage 3 is assured at a position beneath the pickup head moving mechanism 7.

摘要翻译： 在中间台5插入在基板定位台4和电子部件供给台3之间的结构中， 并且其中可以选择将通过拾取头6从电子元件供应台3取出并安装在中间台5上的电子元件P转移到基板定位台4的接合头10A的模式，或者 用于将通过电子部件供应台3直接取出的电子部件通过接合头10A传送到基板定位台4的模式，用于使拾取头6移动的拾取头移动机构7联接在 位于基座2的端部的台架8的梁构件8b的下表面的悬挂方式以及允许电子元件供应台3的一部分进入的空间S被确保在拾取器下方的位置 头移动机构7。

公开(公告)号：US20100230331A1

公开(公告)日：2010-09-16

申请号：US12717318

申请日：2010-03-04

申请人： Mii Fukuda ,  Takashi Menju ,  Yasushi Yamamoto ,  Kazuyoshi Aoki ,  Ichiro Yamanashi ,  Tokusuke Hayami ,  Kazuhiko Noda

发明人： Mii Fukuda ,  Takashi Menju ,  Yasushi Yamamoto ,  Kazuyoshi Aoki ,  Ichiro Yamanashi ,  Tokusuke Hayami ,  Kazuhiko Noda

IPC分类号： C02F1/38 ,  C02F1/52 ,  C02F1/66

CPC分类号： C02F1/38 ,  C02F1/56 ,  C02F2209/06

摘要： An aggregating agent injector (13) injects into raw water an aggregating agent for aggregating solids in raw water, a first aggregation aid injector (16) injects into raw water with the aggregating agent injected therein an aggregation aid for hardening or consolidating flocs formed by the aggregating agent, and a centrifugal separator (18) has a flocculator portion for causing raw water with the aggregation aid injected therein to whirl therein to flocculate solids in raw water, and a solid collector portion for causing raw water to swirl at higher speeds than in the flocculator portion to separate flocs from raw water.

摘要翻译： 聚集剂注入器（13）向原水中注入用于聚集原水中的固体的聚集剂，第一聚集助剂注入器（16）注入原水中，聚集剂在其中注入聚集助剂，用于硬化或固结由 聚集剂和离心分离器（18）具有絮凝器部分，用于引入其中注入的聚集助剂的原水在其中旋转以絮凝原水中的固体，以及固体收集部分，其使原水以比在 絮凝器部分将絮凝物与原水分离。

公开(公告)号：US6134397A

公开(公告)日：2000-10-17

申请号：US285725

申请日：1999-04-05

申请人： Hiromitsu Shimazaki ,  Akihiro Tsuru ,  Hironori Taguchi ,  Kazuhiko Noda

发明人： Hiromitsu Shimazaki ,  Akihiro Tsuru ,  Hironori Taguchi ,  Kazuhiko Noda

IPC分类号： G03G15/08 ,  G03G15/06

CPC分类号： G03G15/0808 ,  G03G2215/0634

摘要： A toner supply bias voltage that is a vibrating voltage comprising an a.c. voltage and a d.c. voltage is applied to a toner supply roller. The d.c. voltage of toner supply bias voltage is changed in dependence upon a variation in the value of developing bias voltage. The lowering in the density at the leading end part of an image, the lowering in the density at the trailing end part of an image, and the uneven developing can be eliminated by satisfying the relationships100.ltoreq..vertline.VB.vertline..ltoreq..vertline.VSR.vertline.,2(.vertline.VSR-VB.vertline.+50).ltoreq..vertline.VPP.vertline..ltoreq.2.vertline.VSR.vertline. andf.gtoreq.v/lare satisfied, where VB is a developing bias voltage (unit: Volt), VSR is a d.c. voltage of the toner supply bias voltage (unit: Volt), VPP is a peak-to-peak value of the a.c. voltage (unit: Volt), f is a frequency (unit: Hz), v is a relative speed at the contact position between the developing roller 5 and the toner supply roller 6 (unit: mm/sec), and l is a nip width between the developing roller 5 and the toner supply roller 6 (unit: mm).

摘要翻译： 作为振动电压的调色剂供给偏压，包括a.c. 电压和直流 电压被施加到调色剂供应辊。 直径 调色剂供给偏置电压的电压根据显影偏压的值的变化而改变。 图像的前端部的密度的降低，图像的后端部的密度的降低以及不均匀的显影可以通过满足关系式100而被消除。 VSR |，2（| VSR-VB | +50） / = v / l，其中VB是显影偏压（单位：伏特），VSR是直流电压。 调色剂供应偏置电压的电压（单位：伏特），VPP是a.c的峰 - 峰值。 电压（单位：伏特），f是频率（单位：Hz），v是显影辊5和调色剂供应辊6之间的接触位置处的相对速度（单位：mm / sec），l是辊隙 显影辊5和调色剂供给辊6之间的宽度（单位：mm）。

公开(公告)号：US5826138A

公开(公告)日：1998-10-20

申请号：US856251

申请日：1997-05-14

申请人： Akihiro Tsuru ,  Hiromitsu Shimazaki ,  Hironori Taguchi ,  Kazuhiko Noda

发明人： Akihiro Tsuru ,  Hiromitsu Shimazaki ,  Hironori Taguchi ,  Kazuhiko Noda

IPC分类号： G03G15/06 ,  G03G15/08

CPC分类号： G03G15/0808 ,  G03G2215/0614 ,  G03G2215/0869

摘要： A nonmagnetic single component developing device comprises a developing roller having an outer surface on which a layer of a nonmagnetic single component developer composed of nonmagnetic toner is formed, a toner supply roller arranged in rear of the developing roller and made into contact therewith, for agitating and supplying the toner, a toner regulating blade arranged above the developing roller and made into press-contact therewith, for regulating a volume of the toner. The toner supply roller is electroconductive, and is applied thereto with an a.c. voltage so as to prevent lowering of the density in the leading and trailing end parts of an image so as to obtain a uniform image characteristic.

摘要翻译： 非磁性单组分显影装置包括具有外表面的显影辊，在该外表面上形成由非磁性调色剂构成的非磁性单组分显影剂层，调色剂供应辊布置在显影辊的后部并与其接触，用于搅拌 以及供给调色剂，配置在显影辊上方并进行压接的调色剂调节片，用于调节调色剂的体积。 调色剂供应辊是导电的，并用一个交流电 电压，以防止图像的前端部和后端部的密度降低，从而获得均匀的图像特性。

公开(公告)号：US08220787B2

公开(公告)日：2012-07-17

申请号：US12557088

申请日：2009-09-10

申请人： Kazuhiko Noda

发明人： Kazuhiko Noda

IPC分类号： B25B11/00

CPC分类号： H01L21/67144 ,  H01L24/75 ,  H01L2224/80 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082

摘要： A part mounting apparatus of the invention comprises: a pickup head having a pickup tool for picking up a part; a pickup head supporting unit for supporting the pickup head; a pickup head supporting arm having one end portion where the pickup head is disposed and an other end portion rotatably mounted to the pickup head supporting unit; a pickup head inverting unit for vertically inverting the pickup head with respect to the pickup head supporting unit; and a pickup tool rotating unit for rotating the pickup tool about a rotational axis of the pickup tool, wherein the pickup tool rotating unit includes driving force generating unit and driving force transmitting unit for transmitting a driving force of the driving force generating unit as a rotational force of the pickup tool, and the driving force generating unit is disposed on the pickup head supporting unit.

摘要翻译： 本发明的部件安装装置包括：拾取头，其具有拾取部件的拾取工具; 用于支撑拾取头的拾取头支撑单元; 拾取头支撑臂，其具有设置拾取头的一个端部和可旋转地安装到拾取头支撑单元的另一端部; 拾取头反转单元，用于相对于拾取头支撑单元垂直地反转拾取头; 以及拾取工具旋转单元，用于围绕拾取工具的旋转轴线旋转拾取工具，其中拾取工具旋转单元包括驱动力产生单元和驱动力传递单元，用于将驱动力产生单元的驱动力传递为旋转 拾取工具的力和驱动力产生单元设置在拾取头支撑单元上。

公开(公告)号：US20110162189A1

公开(公告)日：2011-07-07

申请号：US13119816

申请日：2009-09-14

申请人： Kazuhiko Noda

发明人： Kazuhiko Noda

IPC分类号： B23P11/00 ,  B23P19/00

CPC分类号： H01L21/67144 ,  Y10T29/49826 ,  Y10T29/53

摘要： Provided is a component mounting device and a component mounting method in which three stages, i.e. a component supply stage, a component intermediate stage and a component mounting stage are disposed properly to achieve efficient movement of a pickup head and a mounting head to thereby improve production efficiency.The component mounting device includes: a pickup head 5 which picks up a chip 4 from a wafer sheet holder 2; a chip intermediate table 6 on which the picked-up chip 4 is temporarily placed; a mounting head 7 which receives the chip 4 temporarily placed on the chip intermediate table 6; and a board support table 9 on which the chip 4 received by the mounting head 7 is mounted on a board 8; wherein: the chip intermediate table 6 is disposed at a height between the wafer sheet holder 2 and the board support table 9 to keep the balance between moving times of the pickup head 5 and the mounting head 7.

摘要翻译： 提供了一种部件安装装置和部件安装方法，其中三个部分，即部件供应台，部件中间台和部件安装台被正确设置以实现拾取头和安装头的有效移动，从而提高生产 效率。 部件安装装置包括：拾取头5，其从晶片片保持器2拾取芯片4; 放置拾取芯片4的芯片中间台6; 接收临时放置在芯片中间台6上的芯片4的安装头7; 以及安装头7所接收的芯片4安装在板8上的板支撑台9; 其中：芯片中间台6设置在晶片片保持器2和板支撑台9之间的高度处，以保持拾取头5和安装头7的移动时间之间的平衡。

公开(公告)号：US20100122455A1

公开(公告)日：2010-05-20

申请号：US12617058

申请日：2009-11-12

申请人： Kazuhiko Noda

发明人： Kazuhiko Noda

IPC分类号： H05K3/30 ,  H05K13/04

CPC分类号： H01L21/67144 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53178

摘要： A component mounting apparatus 1 for mounting a semiconductor chip 6a picked from a component feeding stage 3 to a substrate 7 is configured so as to have a second head 12 for subjecting the substrate 7 or the semiconductor chip 6a loaded on the substrate 7 by a first head 11 to predetermined operation in addition to having the first head 11 equipped with a loading unit 19 that loads the semiconductor chip 6a on the substrate 7. The second head 12 is configured in such a way that the second head 12 can selectively be equipped with, in addition to a coating unit 20 for squiring paste for component bonding purpose from a coating nozzle, a work unit having at least one of a paste transfer function for transferring paste by means of a transfer tool, to thus supply paste to the substrate and a heating-press function for pressing the component loaded on the substrate against the substrate while heating the component.

摘要翻译： 用于将从元件供给台3拾取的半导体芯片6a安装到基板7的部件安装装置1被构造成具有第二头部12，用于对装载在基板7上的基板7或半导体芯片6a进行第一 头11到预定的操作，除了具有装载单元19的第一头11，该装载单元19将半导体芯片6a加载到基板7上。第二头12被配置成使得第二头12可以选择性地配备 除了用于从涂料喷嘴挤出用于部件粘合的糊料的涂布单元20之外，还具有用于通过转印工具转印浆料的糊状转移功能中的至少一种的工作单元，从而将浆料供应到基材和 加热按压功能，用于在加热部件的同时将负载在基板上的部件压靠在基板上。