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    Electronic component placement method
    3.
    发明授权
    Electronic component placement method 有权
    电子元件放置方法

    公开(公告)号：US07007377B2

    公开(公告)日：2006-03-07

    申请号：US10781787

    申请日：2004-02-20

    申请人： Kazuhiko Noda ,  Hitoshi Mukojima ,  Yasuhiro Narikiyo ,  Toshiro Hirakawa ,  Hiromi Kanaki ,  Akira Nishimura ,  Osamu Uchida ,  Takatoshi Ishikawa

    发明人： Kazuhiko Noda ,  Hitoshi Mukojima ,  Yasuhiro Narikiyo ,  Toshiro Hirakawa ,  Hiromi Kanaki ,  Akira Nishimura ,  Osamu Uchida ,  Takatoshi Ishikawa

    IPC分类号： H05K3/30

    CPC分类号： H05K13/0452 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178

    摘要： An electronic component placement machine and an electronic component placement method are disclosed. A takeout and transfer head, provided on rotary chip takeout and transfer mechanism, removes a chip from a feeder and flips it. A placement head receives the flipped chip and places it onto a board. An image of the chip at a pre-centering recognition position is captured during a takeout and transfer operation, during which the takeout and transfer head transfers the chip to the placement head at a receiving position, so as to recognize the position. Based on this positional recognition result, the chip and the placement head are positioned by controlling a placement head driving mechanism. Moreover, the takeout and transfer head is rotated to a position which does not hinder image capturing of the electronic component for placement positioning.

    摘要翻译： 公开了一种电子元件贴装机和电子部件配置方法。 旋转芯片取出和传送机构提供的取出和转印头，从进纸器中取出芯片并翻转。 放置头接收翻转的芯片并将其放置在板上。 在取出和传送操作期间捕获在预定心识别位置处的芯片的图像，在此期间，取出和转印头在接收位置将芯片传送到放置头，以便识别该位置。 基于该位置识别结果，通过控制放置头驱动机构来定位芯片和放置头。 此外，取出转印头旋转到不妨碍用于放置定位的电子部件的图像捕获的位置。

    Distributor type fuel injection pump
    4.
    发明授权
    Distributor type fuel injection pump 失效
    分配器型燃油喷射泵

    公开(公告)号：US4977882A

    公开(公告)日：1990-12-18

    申请号：US396984

    申请日：1989-08-22

    申请人： Hisashi Nakamura ,  Ken-ichi Kubo ,  Toshiro Hirakawa

    发明人： Hisashi Nakamura ,  Ken-ichi Kubo ,  Toshiro Hirakawa

    IPC分类号： F02D1/18 ,  F02M41/12

    CPC分类号： F02M41/128 ,  F02D1/183

    摘要： A fuel injection pump of the type wherein the fuel injection timing is controlled by a timer and a solenoid-operated timing control valve. The timer has a high-pressure chamber and a low-pressure chamber which are defined at both sides, respectively, of a timer piston. The high-pressure chamber communicates with a high-pressure groove formed in the timing control valve through a passage. The low-pressure chamber communicates with the suction side of a feed pump through a low-pressure passage and also communicates with a low-pressure hole formed in the timing control valve through a passage. The timer piston is not provided with a passage mechanism which provides communication between a pump chamber and the high-pressure chamber. The pump chamber communicates directly with the high-pressure groove in the timing control valve through a fixed orifice disposed in the wall of the pump housing and a passage leading to the orifice. This structure enables a reduction in the dead volume of the passage required to activate the timer piston.

    摘要翻译： 一种燃料喷射泵，其中燃料喷射正时由定时器和电磁操作的定时控制阀控制。 定时器具有分别限定在定时器活塞的两侧的高压室和低压室。 高压室通过通道与正时控制阀中形成的高压槽连通。 低压室通过低压通道与进料泵的吸入侧连通，并且还通过通道与定时控制阀中形成的低压孔连通。 定时器活塞没有设置有提供泵室和高压室之间的连通的通道机构。 泵室通过设置在泵壳体的壁中的固定孔和通向孔的通道直接与正时控制阀中的高压槽连通。 这种结构使得能够减少启动定时器活塞所需的通道的死体积。

    Distribution-type fuel injection pump
    5.
    发明授权
    Distribution-type fuel injection pump 失效
    配电式燃油喷射泵

    公开(公告)号：US5000668A

    公开(公告)日：1991-03-19

    申请号：US336334

    申请日：1989-04-11

    申请人： Hisashi Nakamura ,  Toshiro Hirakawa ,  Ken-ichi Kubo

    发明人： Hisashi Nakamura ,  Toshiro Hirakawa ,  Ken-ichi Kubo

    IPC分类号： F02M41/12 ,  F02M63/00

    CPC分类号： F02M41/121 ,  F02M41/125 ,  F02M41/128 ,  F02M63/0001

    摘要： In a distribution-type fuel injection pump, a fuel supply passageway, through which a feed pump and a fuel pressurizing chamber communicate with each other, is isolated from a cam chamber and bypasses the same. In order to simplify the construction, the fuel supply passageway is formed in a peripheral wall portion of a housing. On the other hand, a cam mechanism comprises a spring assembly including at least one spring, first and second annular spring seats and an engaging member. The first spring seat has an annular base section and an extension extending from a peripheral edge of the base section toward the second spring seat. The engaging member is fixedly mounted to a forward end of the extension. Prior to incorporation the spring assembly into a hollow body of the housing, the spring assembly is in a state in which the peripheral edge of the second spring seat is engaged with the engaging member under elastic force of the spring. After the spring assembly has been incorporated into the body through an opening at one end thereof, bolts are employed to fixedly mount the head to the body against the spring to close the opening of the body.

    摘要翻译： 在分配型燃料喷射泵中，进料泵和燃料加压室通过其彼此连通的燃料供给通道与凸轮室隔离并且绕过它。 为了简化结构，燃料供给通道形成在壳体的周壁部分中。 另一方面，凸轮机构包括弹簧组件，其包括至少一个弹簧，第一和第二环形弹簧座以及接合构件。 第一弹簧座具有环形基部和从基部的周缘向第二弹簧座延伸的延伸部。 接合构件固定地安装到延伸部的前端。 在将弹簧组件并入壳体的中空体之前，弹簧组件处于这样一种状态，在弹簧的弹力下第二弹簧座的周缘与接合构件接合。 在弹簧组件通过其一端的开口并入本体之后，使用螺栓将头部固定地安装到主体上以抵抗弹簧以关闭主体的开口。

    Electronic component mounting apparatus and electronic component mounting method
    6.
    发明授权
    Electronic component mounting apparatus and electronic component mounting method 失效

    公开(公告)号：US07033842B2

    公开(公告)日：2006-04-25

    申请号：US10394982

    申请日：2003-03-21

    申请人： Hiroshi Haji ,  Toshiro Hirakawa

    发明人： Hiroshi Haji ,  Toshiro Hirakawa

    IPC分类号： H01L21/60 ,  H01L21/67

    CPC分类号： H01L21/6715 ,  H01L21/67144 ,  H01L21/681 ,  H01L24/75 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

    摘要： The present invention provides an electronic component mounting apparatus, wherein a high speed operation can be provided by simplifying the structure of a mounting head and wherein the working efficiency can be improved by eliminating the use of the mounting head for a coating process. In the electronic component mounting apparatus, a flux is coated on chips supplied to an electronic component feeding unit while bump formation faces are directed upward. The chips are mounted on a substrate. A holding head receives the chips extracted from an adhesive sheet by a mounting head and is inverted relative to a stage on which a flux is spread. As a result, the bumps of the chips are covered with the flux and are flattened, and after the holding head is returned to the original stage, the chips on the stage are extracted and mounted on the substrate by the mounting head.