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公开(公告)号：US11177076B2
公开(公告)日：2021-11-16
申请号：US17023870
申请日：2020-09-17
Applicant: KEMET Electronics Corporation
Inventor： Ajaykumar Bunha , Antony P. Chacko , Qingping Chen , Yaru Shi , Philip M. Lessner
IPC: H01G9/00 , C09D5/24 , C09D165/00 , C09D4/06 , C09D125/18 , C09D7/65 , H01G9/15 , H01G9/025 , C08F12/30 , H01B1/12 , C08F212/14 , C09D133/14 , H01G9/028 , H01G9/042
Abstract: A capacitor comprising an anode foil; and a conductive polymer layer on the anode foil. The conductive polymer layer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and the polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns. The second particles have an average particle diameter of at least 1 nm to no more than 600 nm.
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公开(公告)号：US10770240B2
公开(公告)日：2020-09-08
申请号：US16038609
申请日：2018-07-18
Applicant: KEMET Electronics Corporation
Inventor： Victor Andoralov , Débora Sá , Alexandre Guerreiro Fonseca , Antony P. Chacko , Yaru Shi , Philip M. Lessner
IPC: H01G11/04 , H01G11/26 , H01G11/48 , H01G11/86 , H01G11/52 , H01G11/84 , H01G11/32 , H01G11/58 , H01G11/74
Abstract: An improved capacitor is described wherein the capacitor comprises a working element. The working element comprises a first dielectric and an anode conductive polymer layer on the first dielectric. The working element also comprises a cathode and a separator between the anode conductive polymer layer and the cathode wherein the separator comprises a separator conductive polymer layer wherein at least one of the anode conductive polymer layer or the separator conductive polymer layer is crosslinked. The working element also comprises a liquid electrolyte.
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公开(公告)号：US10147544B1
公开(公告)日：2018-12-04
申请号：US15601323
申请日：2017-05-22
Applicant: KEMET Electronics Corporation
Inventor： John Bultitude , Philip M. Lessner , Abhijit Gurav
Abstract: An improved multilayered ceramic capacitor is provided wherein the capacitor has improved heat dissipation properties. The capacitor comprises first internal electrodes and second internal electrodes wherein the first internal electrodes are parallel with, and of opposite polarity, to the second internal electrodes. Dielectric layers are between the first internal electrodes and second internal electrodes and a thermal dissipation channel is in at least one dielectric layer. A thermal transfer medium is in the thermal dissipation channel.
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公开(公告)号：US20180211790A1
公开(公告)日：2018-07-26
申请号：US15926391
申请日：2018-03-20
Applicant: KEMET Electronics Corporation
Inventor： Randolph S. Hahn , Jeffrey Poltorak , Brandon Summey , Antony P. Chacko , John T. Kinard , Philip M. Lessner
CPC classification number: H01G9/15 , H01G9/0036 , H01G9/0425 , H01G9/048
Abstract: An improved capacitor is provided wherein the improved capacitor has improved ESR. The capacitor has a fluted anode and an anode wire extending from the fluted anode. A dielectric is on the fluted anode. A conformal cathode is on the dielectric and a plated metal layer is on the carbon layer.
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公开(公告)号：US20150036263A1
公开(公告)日：2015-02-05
申请号：US14498514
申请日：2014-09-26
Applicant: Kemet Electronics Corporation
Inventor： R. Allen Hill , Philip M. Lessner , Reggie Phillips , Keith Brown , James B. Byrd
Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.
Abstract translation: 描述了具有改进的引线框架附件的电容器，其中改进的引线框架附件减轻了缺陷。 电容器包括具有交替极性的平行导电内部电极与导电内部电极之间的电介质。 第一铜底涂层与第一极性的导电内部电极电接触，并且第二铜底涂层与第二极性的导电内部电极电接触。 第一引线与第一铜底涂层电接触，在第一引线和第一铜底涂层之间具有第一焊料。 第二引线与第二铜底涂层电接触，在第二引线和第二铜底涂层之间具有第二焊料。
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Patent Agency Ranking
6.发明申请Linear-Hyperbranched Polymers as Performance Additives for Solid Electrolytic Capacitors 有权线性超支化聚合物作为固体电解电容器的性能添加剂公开(公告)号：US20140160632A1
公开(公告)日：2014-06-12
申请号：US14098664
申请日：2013-12-06
Applicant: Kemet Electronics Corporation
Inventor： Antony P. Chacko , Gopakumar Sivasankarapillai , Yaru Shi , Philip M. Lessner
CPC classification number: H01G9/0425 , C09D5/24 , C09D177/12 , H01B1/124 , H01G9/0029 , H01G9/028 , H01G9/15 , Y10T29/417
Abstract: Provided herein is an improved capacitor and a method for forming an improved capacitor. The method includes providing an anode and forming a dielectric on the anode. A linear-hyperbranched polymer is formed and a conductive polymer dispersion is prepared comprising at least one conducting polymer, one polyanion and the linear-hyperbranched polymer. A layer of the conductive polymer dispersion if formed wherein said dielectric is between the anode and the layer.
Abstract translation: 本文提供了改进的电容器和形成改进的电容器的方法。 该方法包括提供阳极并在阳极上形成电介质。 形成线型超支化聚合物并制备包含至少一种导电聚合物，一个聚阴离子和线性超支化聚合物的导电聚合物分散体。 如果形成导电聚合物分散体的一层，其中所述电介质位于阳极和层之间。
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公开(公告)号：US20190115159A1
公开(公告)日：2019-04-18
申请号：US16165649
申请日：2018-10-19
Applicant: KEMET Electronics Corporation
Inventor： Ajaykumar Bunha , Antony P. Chacko , Qingping Chen , Yaru Shi , Philip M. Lessner
IPC: H01G9/042 , C09D125/18 , C09D4/06 , C09D7/65 , C09D5/24 , C09D165/00
Abstract: An improved capacitor is provided wherein the capacitor comprises a conductive polymer layer. The conductive polymer comprises first particles comprising conductive polymer and polyanion and second particles comprising the conductive polymer and said polyanion wherein the first particles have an average particle diameter of at least 1 micron to no more than 10 microns and the second particles have an average particle diameter of at least 1 nm to no more than 600 nm.
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公开(公告)号：US10199175B2
公开(公告)日：2019-02-05
申请号：US15090692
申请日：2016-04-05
Applicant: KEMET Electronics Corporation
Inventor： Liancai Ning , Qingping Chen , Philip M. Lessner
Abstract: A method for manufacturing a solid electrolytic capacitor and an improved capacitor formed thereby is described. The method includes forming a dielectric on an anode at a formation voltage; forming a conductive polymer layer on the dielectric; and reforming the dielectric in a reformation electrolyte at a reformation voltage wherein the reformation electrolyte comprises a thermal degradation inhibitor.
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公开(公告)号：US09799449B2
公开(公告)日：2017-10-24
申请号：US14498514
申请日：2014-09-26
Applicant: Kemet Electronics Corporation
Inventor： R. Allen Hill , Philip M. Lessner , Reggie Phillips , Keith Brown , James B. Byrd
Abstract: A capacitor with improved lead frame attachment is described wherein the improved lead frame attachment mitigates defects. The capacitor comprises parallel conductive internal electrodes of alternating polarity with a dielectric between the conductive internal electrodes. A first copper undercoat is in electrical contact with the conductive internal electrodes of a first polarity and a second copper undercoat is in electrical contact with conductive internal electrodes of a second polarity. A first lead is in electrical contact with the first copper undercoat with a first solder between the first lead and the first copper undercoat. A second lead is in electrical contact with the second copper undercoat with a second solder between the second lead and the second copper undercoat.
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10.发明申请Method of Producing Solid Electrolytic Capacitor and Capacitor Made Thereby 审中-公开由此制造固体电解电容器和电容器的方法公开(公告)号：US20160300665A1
公开(公告)日：2016-10-13
申请号：US15090692
申请日：2016-04-05
Applicant: KEMET Electronics Corporation
Inventor： Liancai Ning , Qingping Chen , Philip M. Lessner
CPC classification number: H01G9/028 , H01G9/0032 , H01G9/0425 , H01G9/045 , H01G9/0525 , H01G9/07 , H01G9/15
Abstract: A method for manufacturing a solid electrolytic capacitor and an improved capacitor formed thereby is described. The method includes forming a dielectric on an anode at a formation voltage; forming a conductive polymer layer on the dielectric; and reforming the dielectric in a reformation electrolyte at a reformation voltage wherein the reformation electrolyte comprises a thermal degradation inhibitor.
Abstract translation: 描述了由此形成的固体电解电容器和改进的电容器的制造方法。 该方法包括在阳极上以形成电压形成电介质; 在电介质上形成导电聚合物层; 以及在重整电压下重整电解质中的电介质重整，其中所述改性电解质包含热降解抑制剂。
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