专利检索 ap:("Kevin LEE" OR "Ruchir SARASWAT" OR "Uwe ZILLMANN" OR "Nicholas COWLEY") AND inv:"Kevin J. LEE" 第 1 页

1.

发明申请
METHOD AND APPARATUS FOR FORMING BACKSIDE DIE PLANAR DEVICES AND SAW FILTER 审中-公开

公开(公告)号：US20170141058A1

公开(公告)日：2017-05-18

申请号：US15323521

申请日：2014-08-07

申请人： Kevin LEE , Ruchir SARASWAT , Uwe ZILLMANN , Nicholas COWLEY

发明人： Kevin J. LEE , Ruchir SARASWAT , Uwe ZILLMANN , Nicholas P. COWLEY , Richard J. GOLDMAN

IPC分类号： H01L23/00 , H01F27/28 , G06F1/16 , H01L23/64 , H01L23/522 , H03H9/64 , H03H7/42

CPC分类号： H01L24/09 , G06F1/16 , H01F27/2804 , H01L23/481 , H01L23/5226 , H01L23/5227 , H01L23/525 , H01L23/645 , H01L23/66 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/17 , H01L2223/6616 , H01L2223/6661 , H01L2223/6677 , H01L2224/0233 , H01L2224/02372 , H01L2224/02375 , H01L2224/02379 , H01L2224/0401 , H01L2224/05548 , H01L2224/16146 , H01L2224/16225 , H01L2224/17181 , H03H7/42 , H03H9/64

摘要： Described is an apparatus which comprises: a backside of a first die having a redistribution layer (RDL); and one or more passive planar devices disposed on the backside, the one or more passive planar devices formed in the RDL.