公开(公告)号：US20240312802A1

公开(公告)日：2024-09-19

申请号：US18447702

申请日：2023-08-10

Applicant: Kioxia Corporation

Inventor： Yosuke MARUYAMA ,  Takahiro KAWATA ,  Satoshi NAKAOKA

IPC: H01L21/67 ,  H01L21/311 ,  H01L21/687

CPC classification number: H01L21/67086 ,  H01L21/31111 ,  H01L21/68721 ,  H01L21/68764 ,  H01L21/68771

Abstract: A substrate processing apparatus includes: a processing tank configured to store a solution capable of processing a substrate; a supply configured to supply the solution to the processing tank; a holding member having an openable and closable support portion capable of sandwiching the substrate, the holding member configured to hold the substrate in the processing tank; a first drive mechanism configured to move the holding member in a first direction along a substrate surface; and a guide disposed between the support portion and the supply in the processing tank and configured to guide a rotational movement of the substrate in the first direction.

公开(公告)号：US20240087931A1

公开(公告)日：2024-03-14

申请号：US18457821

申请日：2023-08-29

Applicant: Kioxia Corporation

Inventor： Satoshi NAKAOKA ,  Hiroyasu IIMORI

IPC: H01L21/673 ,  H01L21/02 ,  H01L21/306

CPC classification number: H01L21/67386 ,  H01L21/02057 ,  H01L21/30604

Abstract: A wafer transfer carrier includes a container and a lid portion. The container accommodates a wafer and a liquid, and is movable in a state where the wafer is in contact with the liquid. The lid portion is capable of sealing an inside of the container.

公开(公告)号：US20250096011A1

公开(公告)日：2025-03-20

申请号：US18821893

申请日：2024-08-30

Applicant: Kioxia Corporation

Inventor： Takahiro KAWATA ,  Shinsuke KIMURA ,  Satoshi NAKAOKA ,  Satoru OHGATA

IPC: H01L21/67

Abstract: A semiconductor manufacturing apparatus includes a chamber, an opening/closing portion, and a pressure control circuit. The chamber includes first and second portions, both of which are capable of accommodating a wafer. The opening/closing portion is provided between the first portion and the second portion, and is movable to open and close a space between the first and second portions. The pressure control circuit is configured to control a pressure difference between the first portion and the second portion.

公开(公告)号：US20210296143A1

公开(公告)日：2021-09-23

申请号：US17119431

申请日：2020-12-11

Applicant: Kioxia Corporation

Inventor： Shinsuke MURAKI ,  Satoshi NAKAOKA

IPC: H01L21/67 ,  H01L21/66 ,  H01L21/311

Abstract: A semiconductor manufacturing apparatus according to the present embodiment includes a tank, a heater, a bubble supplier, a sensor and a controller. The tank stores a chemical solution for processing a substrate. The heater heats the chemical solution. The bubble supplier supplies bubbles to the chemical solution in the tank. The sensor detects at least one of a concentration of the chemical solution, a water concentration of the chemical solution, specific gravity of the chemical solution and a vapor concentration of a gas discharged from the tank. The controller controls the supply of bubbles by the bubble supplier based on a detection result of the sensor.

公开(公告)号：US20210280438A1

公开(公告)日：2021-09-09

申请号：US17119043

申请日：2020-12-11

Applicant: Kioxia Corporation

Inventor： Katsuhiro SATO ,  Hiroshi FUJITA ,  Yoshinori KITAMURA ,  Satoshi NAKAOKA ,  Tomohiko SUGITA

IPC: H01L21/67 ,  H01L21/306

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a container configured to contain a substrate, and a pipe configured to supply the container with liquid to treat the substrate. The apparatus further includes an ejector including a first passage where the liquid introduced from the pipe and the liquid introduced from the container are joined and pass through, and a first opening configured to eject the liquid that has passed through the first passage. Furthermore, the first passage has an area where a sectional area of the first passage becomes large as advancing downstream in the liquid.

公开(公告)号：US20230072887A1

公开(公告)日：2023-03-09

申请号：US17691209

申请日：2022-03-10

Applicant: Kioxia Corporation

Inventor： Fuyuma ITO ,  Hiroyasu IIMORI ,  Shinsuke MURAKI ,  Yuya AKEBOSHI ,  Yosuke MARUYAMA ,  Satoshi NAKAOKA

IPC: H01L21/66 ,  H01L21/67

Abstract: In one embodiment, a semiconductor manufacturing apparatus includes a processor configured to process a film provided on an end portion of a substrate. The apparatus further includes a detector configured to detect information relating to a shape of the end portion of the substrate. The apparatus further includes a controller configured to control the processing of the film by the processor, based on the information relating to the shape of the end portion of the substrate.

公开(公告)号：US20220068673A1

公开(公告)日：2022-03-03

申请号：US17198728

申请日：2021-03-11

Applicant: Kioxia Corporation

Inventor： Satoshi NAKAOKA ,  Yuji HASHIMOTO ,  Hiroshi FUJITA

IPC: H01L21/67 ,  H01L21/311

Abstract: A substrate treatment apparatus according to an embodiment includes: a tank configured to store a liquid chemical with which a plurality of substrates are treated; a piping having an ejection port that ejects the liquid chemical or bubbles into the tank; a plurality of rods that support the plurality of substrates in the tank; and a converter that is provided in the plurality of rods or the tank and that converts vibration applied to each substrate by the liquid chemical or the bubbles ejected from the piping into rotation in one direction around a center of the substrate as a rotational axis.