公开(公告)号：US09435692B2

公开(公告)日：2016-09-06

申请号：US14173149

申请日：2014-02-05

Applicant: Lam Research Corporation

Inventor： Ole Waldmann ,  Eric A. Pape ,  Robert Griffith O'Neill ,  Francisco Martinez

IPC: G01K15/00 ,  G01J5/02 ,  H01L21/67 ,  H01L21/683

CPC classification number: G01J5/02 ,  G01J5/0007 ,  G01J5/025 ,  G01J5/10 ,  G01J2005/0048 ,  H01L21/67109 ,  H01L21/67248 ,  H01L21/6831

Abstract: A method for calculating power input to at least one thermal control element of an electrostatic chuck includes: setting the at least one thermal control element to a first predetermined power level; measuring a first temperature of the at least one thermal control element when the at least one thermal control element is powered at the first predetermined power level; setting the at least one thermal control element to a second predetermined power level; measuring a second temperature of the at least one thermal control element when the at least one thermal control element is powered at the second predetermined power level; calculating a difference between the first temperature and the second temperature; calculating a system response of the at least one thermal control element based on the difference; inverting the system response; and calibrating the at least one thermal control element based on the inverted system response.

Abstract translation: 一种用于计算静电卡盘的至少一个热控元件的功率输入的方法，包括：将所述至少一个热控制元件设置为第一预定功率水平; 当所述至少一个热控元件以所述第一预定功率水平供电时，测量所述至少一个热控元件的第一温度; 将所述至少一个热控制元件设置到第二预定功率水平; 当所述至少一个热控元件以所述第二预定功率电平供电时，测量所述至少一个热控元件的第二温度; 计算第一温度和第二温度之间的差; 基于所述差异来计算所述至少一个热控制元件的系统响应; 反转系统响应; 以及基于所述反向系统响应来校准所述至少一个热控制元件。

公开(公告)号：US09716022B2

公开(公告)日：2017-07-25

申请号：US14109020

申请日：2013-12-17

Applicant: Lam Research Corporation

Inventor： Ole Waldmann ,  Eric A. Pape ,  Carlos Leal-Verdugo ,  Keith William Gaff

IPC: G05D23/19 ,  G05B19/418 ,  H01L21/67

CPC classification number: G05B19/418 ,  H01L21/67103 ,  H01L21/67248

Abstract: A method of determining thermal stability of an upper surface of a substrate support assembly comprises recording time resolved pre-process temperature data of the substrate before performing a plasma processing process while powering an array of thermal control elements to achieve a desired spatial and temporal temperature of the upper surface. A substrate is processed while powering the array of thermal control elements to achieve a desired spatial and temporal temperature of the upper surface of the assembly, and time resolved post-process temperature data of the assembly is recorded after processing the substrate. The post-process temperature data is recorded while powering the thermal control elements to achieve a desired spatial and temporal temperature of the upper surface. The post-process temperature data is compared to the pre-process temperature data to determine whether the data is within a desired tolerance range.

公开(公告)号：US20170322546A1

公开(公告)日：2017-11-09

申请号：US15657858

申请日：2017-07-24

Applicant: LAM RESEARCH CORPORATION

Inventor： Ole Waldmann ,  Eric A. Pape ,  Carlos Leal-Verdugo ,  Keith William Gaff

IPC: G05B19/418 ,  H01L21/67

Abstract: A method of determining thermal stability of an upper surface of a substrate support assembly in a plasma processing apparatus includes: before processing of at least one substrate in the plasma processing apparatus and while powering an array of thermal control elements of the substrate support assembly to achieve a desired spatial and temporal temperature of the upper surface of the substrate support assembly, recording pre-process temperature data of the substrate support assembly; after the processing of the at least one substrate in the plasma processing apparatus and while powering the array of thermal control elements to achieve the desired spatial and temporal temperature of the upper surface of the substrate support assembly, recording post-process temperature data; comparing the post-process temperature data to the pre-process temperature data; and determining whether the post-process temperature data is within a predetermined tolerance range of the pre-process temperature data.

公开(公告)号：US09779974B2

公开(公告)日：2017-10-03

申请号：US14860045

申请日：2015-09-21

Applicant: Lam Research Corporation

Inventor： Tao Zhang ,  Ole Waldmann ,  Eric A. Pape

IPC: H01L21/683 ,  H01L21/66 ,  H01L21/67 ,  G01K3/08 ,  G05D23/19

CPC classification number: H01L21/6831 ,  G05D23/1931 ,  H01L21/67109 ,  H01L21/67248 ,  H01L22/20

Abstract: A system for controlling a substrate temperature in a substrate processing system includes a substrate support device, a controller, a temperature sensor, and a thermal control element (TCE). The controller is configured to, during a first period, control the TCE to adjust the temperature of the substrate support device to a temperature value based on a temperature difference between the substrate temperature before the substrate is loaded onto the substrate support device and a desired temperature for the substrate support device. The temperature value is not equal to the desired temperature. The substrate is loaded onto the substrate support device after the first period begins and before the temperature of the substrate support device returns to the desired temperature. The controller is further configured to, during a second period following the first period, control the temperature of the substrate support device to the desired temperature for the substrate support device.

公开(公告)号：US10096506B2

公开(公告)日：2018-10-09

申请号：US15897669

申请日：2018-02-15

Applicant: LAM RESEARCH CORPORATION

Inventor： Tao Zhang ,  Ole Waldmann ,  Eric A. Pape

IPC: H01L21/00 ,  H01L21/683 ,  G05D23/19 ,  H01L21/67 ,  H01L21/66

Abstract: A temperature controller for a substrate processing system includes an interface configured to receive a processing temperature corresponding to a desired processing temperature of a substrate. The temperature controller includes a thermal control element controller configured to selectively control a thermal control element to adjust a temperature of a substrate support. The thermal control element controller is further configured to, prior to the substrate being loaded onto the substrate support, determine at least one of a temperature of the substrate support and a temperature of the substrate and, based on the processing temperature and the at least one of the temperature of the substrate support and the temperature of the substrate, control the thermal control element to adjust the temperature of the substrate support to a setpoint temperature that is different than the processing temperature.

公开(公告)号：US20160372355A1

公开(公告)日：2016-12-22

申请号：US14860045

申请日：2015-09-21

Applicant: Lam Research Corporation

Inventor： Tao Zhang ,  Ole Waldmann ,  Eric A. Pape

IPC: H01L21/683 ,  H01L21/66 ,  H01L21/67 ,  G01K3/08

CPC classification number: H01L21/6831 ,  G05D23/1931 ,  H01L21/67109 ,  H01L21/67248 ,  H01L22/20

Abstract: A system for controlling a substrate temperature in a substrate processing system includes a substrate support device, a controller, a temperature sensor, and a thermal control element (TCE). The controller is configured to, during a first period, control the TCE to adjust the temperature of the substrate support device to a temperature value based on a temperature difference between the substrate temperature before the substrate is loaded onto the substrate support device and a desired temperature for the substrate support device. The temperature value is not equal to the desired temperature. The substrate is loaded onto the substrate support device after the first period begins and before the temperature of the substrate support device returns to the desired temperature. The controller is further configured to, during a second period following the first period, control the temperature of the substrate support device to the desired temperature for the substrate support device.

Abstract translation: 用于控制基板处理系统中的基板温度的系统包括基板支撑装置，控制器，温度传感器和热控制元件（TCE）。 控制器被配置为在第一时段期间控制TCE以基于衬底被加载到衬底支撑装置之前的衬底温度和所需温度之间的温度差来调节衬底支撑装置的温度到温度值 用于基板支撑装置。 温度值不等于所需温度。 在第一周期开始之后并且在基板支撑装置的温度恢复到所需温度之前，将基板装载到基板支撑装置上。 控制器还被配置为在第一时段之后的第二时段期间，将衬底支撑装置的温度控制到衬底支撑装置的期望温度。

公开(公告)号：US20150364388A1

公开(公告)日：2015-12-17

申请号：US14307062

申请日：2014-06-17

Applicant: Lam Research Corporation

Inventor： Ole Waldmann ,  Eric A. Pape ,  Keith William Gaff ,  Harmeet Singh

IPC: H01L21/66

CPC classification number: H01L21/67109 ,  H01L21/67248 ,  H01L21/67288

Abstract: A method for auto-correction of at least one malfunctioning thermal control element among an array of thermal control elements that are independently controllable and located in a temperature control plate of a substrate support assembly which supports a semiconductor substrate during processing thereof, the method including: detecting, by a control unit including a processor, that at least one thermal control element of the array of thermal control elements is malfunctioning; deactivating, by the control unit, the at least one malfunctioning thermal control element; and modifying, by the control unit, a power level of at least one functioning thermal control element in the temperature control plate to minimize impact of the malfunctioning thermal control element on the desired temperature output at the location of the at least one malfunctioning thermal control element.

Abstract translation: 一种用于自动校正热控制元件阵列中的至少一个故障热控元件的方法，所述热控制元件阵列可独立控制并位于在其处理期间支撑半导体衬底的衬底支撑组件的温度控制板中，所述方法包括： 通过包括处理器的控制单元检测所述热控元件阵列中的至少一个热控元件是故障的; 由所述控制单元使所述至少一个故障热控制元件停用; 以及通过所述控制单元修改所述温度控制板中的至少一个功能性热控制元件的功率水平，以使所述故障热控制元件对所述至少一个故障热控制元件的位置处的所需温度输出的影响最小化 。

公开(公告)号：US10437236B2

公开(公告)日：2019-10-08

申请号：US15657858

申请日：2017-07-24

Applicant: LAM RESEARCH CORPORATION

Inventor： Ole Waldmann ,  Eric A. Pape ,  Carlos Leal-Verdugo ,  Keith William Gaff

IPC: G05B19/418 ,  H01L21/67

Abstract: A method of determining thermal stability of an upper surface of a substrate support assembly in a plasma processing apparatus includes: before processing of at least one substrate in the plasma processing apparatus and while powering an array of thermal control elements of the substrate support assembly to achieve a desired spatial and temporal temperature of the upper surface of the substrate support assembly, recording pre-process temperature data of the substrate support assembly; after the processing of the at least one substrate in the plasma processing apparatus and while powering the array of thermal control elements to achieve the desired spatial and temporal temperature of the upper surface of the substrate support assembly, recording post-process temperature data; comparing the post-process temperature data to the pre-process temperature data; and determining whether the post-process temperature data is within a predetermined tolerance range of the pre-process temperature data.

公开(公告)号：US09922855B2

公开(公告)日：2018-03-20

申请号：US15692002

申请日：2017-08-31

Applicant: LAM RESEARCH CORPORATION

Inventor： Tao Zhang ,  Ole Waldmann ,  Eric A. Pape

IPC: H01L21/00 ,  H01L21/683 ,  H01L21/66 ,  H01L21/67 ,  G05D23/19

CPC classification number: H01L21/6831 ,  G05D23/1931 ,  H01L21/67109 ,  H01L21/67248 ,  H01L22/20

Abstract: A method for controlling a substrate temperature in a substrate processing system includes determining a temperature difference between the substrate temperature before the substrate is loaded onto a substrate support device and a desired temperature for the substrate support device and, during a first period, controlling a thermal control element to adjust the temperature of the substrate support device to a temperature value based on the temperature difference. The temperature value is not equal to the desired temperature for the substrate support device. The method further includes loading the substrate onto the substrate support device after the first period begins and before the temperature of the substrate support device returns to the desired temperature and, during a second period that follows the first period, controlling the temperature of the substrate support device to the desired temperature for the substrate support device.

公开(公告)号：US09543171B2

公开(公告)日：2017-01-10

申请号：US14307062

申请日：2014-06-17

Applicant: Lam Research Corporation

Inventor： Ole Waldmann ,  Eric A. Pape ,  Keith William Gaff ,  Harmeet Singh

IPC: H01L21/00 ,  H01L21/67

CPC classification number: H01L21/67109 ,  H01L21/67248 ,  H01L21/67288

Abstract: A method for auto-correction of at least one malfunctioning thermal control element among an array of thermal control elements that are independently controllable and located in a temperature control plate of a substrate support assembly which supports a semiconductor substrate during processing thereof, the method including: detecting, by a control unit including a processor, that at least one thermal control element of the array of thermal control elements is malfunctioning; deactivating, by the control unit, the at least one malfunctioning thermal control element; and modifying, by the control unit, a power level of at least one functioning thermal control element in the temperature control plate to minimize impact of the malfunctioning thermal control element on the desired temperature output at the location of the at least one malfunctioning thermal control element.

Abstract translation: 一种用于自动校正热控制元件阵列中的至少一个故障热控元件的方法，所述热控制元件阵列可独立控制并位于在其处理期间支撑半导体衬底的衬底支撑组件的温度控制板中，所述方法包括： 通过包括处理器的控制单元检测所述热控元件阵列中的至少一个热控元件是故障的; 由所述控制单元使所述至少一个故障热控制元件停用; 以及通过所述控制单元修改所述温度控制板中的至少一个功能性热控制元件的功率水平，以使所述故障热控制元件对所述至少一个故障热控制元件的位置处的期望温度输出的影响最小化 。