公开(公告)号：US11874207B2

公开(公告)日：2024-01-16

申请号：US17424521

申请日：2020-01-23

Applicant: LEICA MICROSYSTEMS CMS GMBH

Inventor： Florian Hoffmann ,  Falk Schlaudraff

IPC: G01N1/28 ,  G02B19/00

CPC classification number: G01N1/2813 ,  G01N1/286 ,  G02B19/0047 ,  G01N2001/284 ,  G01N2001/2886

Abstract: A method for laser microdissection includes: processing a microscopic examination object by a laser beam using tuples of coordinate values which respectively indicate positions of target points on the examination object at least in a first spatial direction and a second spatial direction orthogonal to the first spatial direction, positions of at least three reference points being ascertained beforehand in each case in the first and second spatial directions and also in a third spatial direction orthogonal to the first and second spatial directions; defining a reference plane based on the positions of the reference points; and determining, for the target points, further coordinate values indicating an expected position of the target points on the examination object in the third spatial direction in each case, as determined further coordinate values, the determining of the further coordinate values being performed depending on the defined reference plane.

公开(公告)号：US20220276136A1

公开(公告)日：2022-09-01

申请号：US17667580

申请日：2022-02-09

Applicant: LEICA MICROSYSTEMS CMS GMBH

Inventor： Falk Schlaudraff ,  Florian Hoffmann ,  Christoph Greb

IPC: G01N1/28 ,  G06N20/00

Abstract: A method for obtaining dissectates from a microscopic sample using a laser microdissection system having a laser unit includes: a) at least partially circumcising and releasing from the sample dissectate regions of the sample as the dissectates using laser pulses provided by the laser unit; b) transferring the dissectates, by being released from the sample, along dissectate trajectories into receptacles of a dissectate collection unit; and c) positioning the receptacles of a dissectate collection unit using a positioning unit to collect the dissectates. The positioning of the receptacles of the dissectate collection unit using the positioning unit is automatically performed based on estimates of the dissectate trajectories, the estimates of the dissectate trajectories being obtained in a learning mode, the learning mode including obtaining dissectates by repeatedly performing at least steps a) and b). Parameters of the dissectate trajectories are determined for a plurality of dissectates.

公开(公告)号：US20140098214A1

公开(公告)日：2014-04-10

申请号：US14049241

申请日：2013-10-09

Applicant: Leica Microsystems CMS GmbH

Inventor： Falk Schlaudraff ,  Florian Hoffmann

IPC: G01N33/483

CPC classification number: G01N33/483 ,  G01N1/2813 ,  G01N2001/282 ,  G01N2001/2886

Abstract: A method for laser microdissection of a laser microdissection region of a prepared specimen includes driving a holder for the specimen into a holding position using a control device. First and second digital images are captured that depict a same portion of the prepared specimen, with the first image depicting the portion under at least one first microscopic examination method and the second image depicting the portion under at least a second microscopic examination method. A live overlay image is generated of the portion of the prepared image in a live mode. The live overlay is presented on a display area with the images overlaid onto one another. A marking is generated and captured on the live overlay image so as to define the laser microdissection region.

Abstract translation: 用于制备样品的激光显微切割区域的激光显微切割的方法包括使用控制装置将样品的保持器驱动到保持位置。 捕获第一和第二数字图像，其描绘所制备的样本的相同部分，其中第一图像在至少一个第一显微镜检查方法下描绘该部分，而第二图像在至少第二显微镜检查方法下描绘该部分。 在实时模式中，制作的图像的部分生成实时叠加图像。 实时叠加显示在显示区域上，图像叠加在一起。 在活动叠加图像上生成并捕获标记，以便定义激光显微切割区域。

公开(公告)号：US12038357B2

公开(公告)日：2024-07-16

申请号：US17667580

申请日：2022-02-09

Applicant: LEICA MICROSYSTEMS CMS GMBH

Inventor： Falk Schlaudraff ,  Florian Hoffmann ,  Christoph Greb

IPC: G01N1/04 ,  G01N1/28 ,  G06N20/00 ,  G02B21/06 ,  G02B21/26

CPC classification number: G01N1/286 ,  G06N20/00 ,  G01N2001/045 ,  G01N2001/2886 ,  G02B21/06 ,  G02B21/26

Abstract: A method for obtaining dissectates from a microscopic sample using a laser microdissection system having a laser unit includes: a) at least partially circumcising and releasing from the sample dissectate regions of the sample as the dissectates using laser pulses provided by the laser unit; b) transferring the dissectates, by being released from the sample, along dissectate trajectories into receptacles of a dissectate collection unit; and c) positioning the receptacles of a dissectate collection unit using a positioning unit to collect the dissectates. The positioning of the receptacles of the dissectate collection unit using the positioning unit is automatically performed based on estimates of the dissectate trajectories, the estimates of the dissectate trajectories being obtained in a learning mode, the learning mode including obtaining dissectates by repeatedly performing at least steps a) and b). Parameters of the dissectate trajectories are determined for a plurality of dissectates.

公开(公告)号：US09804144B2

公开(公告)日：2017-10-31

申请号：US14049241

申请日：2013-10-09

Applicant: Leica Microsystems CMS GmbH

Inventor： Falk Schlaudraff ,  Florian Hoffmann

IPC: G01N33/483 ,  G01N1/28

CPC classification number: G01N33/483 ,  G01N1/2813 ,  G01N2001/282 ,  G01N2001/2886

Abstract: A method for laser microdissection of a laser microdissection region of a prepared specimen includes driving a holder for the specimen into a holding position using a control device. First and second digital images are captured that depict a same portion of the prepared specimen, with the first image depicting the portion under at least one first microscopic examination method and the second image depicting the portion under at least a second microscopic examination method. A live overlay image is generated of the portion of the prepared image in a live mode. The live overlay is presented on a display area with the images overlaid onto one another. A marking is generated and captured on the live overlay image so as to define the laser microdissection region.

公开(公告)号：US20160210498A1

公开(公告)日：2016-07-21

申请号：US14599659

申请日：2015-01-19

Applicant: Leica Microsystems CMS GmbH

Inventor： Falk Schlaudraff ,  Andrew Lee ,  Florian Hoffmann

IPC: G06K9/00 ,  G02B21/36 ,  G02B21/06

CPC classification number: G06K9/00127 ,  G01N1/286 ,  G01N2001/2886 ,  G02B21/06 ,  G02B21/32 ,  G02B21/365

Abstract: A method for laser microdissection includes detecting at least a portion of an object to be dissected in an image-producing manner in a laser microdissection system and generating a first digital object image. A first processing specification is defined based on the first digital object image. In a first processing step, the object is processed using a laser beam of the laser microdissection system in accordance with the first processing specification. At least a portion of the object is detected in an image-producing manner and a second digital object image is generated. A second processing specification is defined during execution of the first processing step based on the second digital object image. In a second processing step, the object is processed using the laser beam of the laser microdissection system in accordance with the second processing specification.

Abstract translation: 一种用于激光显微切割的方法包括在激光显微切割系统中以图像产生的方式检测要解剖的物体的至少一部分，并产生第一数字对象图像。 基于第一数字对象图像来定义第一处理规范。 在第一处理步骤中，使用根据第一处理规范的激光显微切割系统的激光束对物体进行处理。 以图像生成方式检测对象的至少一部分，并且生成第二数字对象图像。 基于第二数字对象图像在第一处理步骤的执行期间定义第二处理规范。 在第二处理步骤中，使用根据第二处理规范的激光显微切割系统的激光束对物体进行处理。