公开(公告)号：US10566381B2

公开(公告)日：2020-02-18

申请号：US16154949

申请日：2018-10-09

Applicant: LG Display Co., Ltd.

Inventor： YongSeok Kwak ,  Kiyong Yang ,  JinSu Moon ,  MyungWon Seo

IPC: H01L27/15 ,  H01L25/18 ,  H01L33/50 ,  H01L33/00 ,  H01L33/44 ,  G09G3/3225 ,  H01L27/12 ,  G09G3/32 ,  H01L25/075

Abstract: A light-emitting diode (LED) chip and a display device having the same are provided. A green LED is regrown on a blue LED to produce blue and green light, and a red phosphor is disposed on the blue or green LED to produce red light. Red light, green light, and blue light are to be produced using a single LED chip. The single LED chip forms three subpixels therein so as to facilitate a transfer process of the LED chip to a display panel. The LED chip is configured based on the blue, green, and blue LEDs so as to facilitate the fabrication and driving of the LED chip.

公开(公告)号：US10234617B2

公开(公告)日：2019-03-19

申请号：US15336298

申请日：2016-10-27

Applicant: LG DISPLAY CO., LTD.

Inventor： ChangYul Moon ,  YoungHun Jeong ,  Kiyong Yang ,  Sehyun Park

IPC: F21V8/00

Abstract: Discussed is a glass light guide plate that is used in a back light unit of a display device. Some features of the glass light guide plate for the back light unit can be improved by optimizing a relationship between a direction of a bubble inside the glass light guide plate and a light source, the sizes of the bubble and a light guide pattern, and so on, and by optimizing an arrangement density of light guide patterns in each region, a kind of light guide pattern ink (IR-curable ink), a curing condition, a refractive index, and so on to be suitable for the material of the glass light guide plate.

公开(公告)号：US11094861B2

公开(公告)日：2021-08-17

申请号：US16550735

申请日：2019-08-26

Applicant: LG Display Co., Ltd.

Inventor： Kiyong Yang ,  MinJae Kang ,  YongSeok Kwak ,  Myungsoo Han ,  JaeMin Sim

IPC: H01L33/60 ,  H01L27/15 ,  H01L27/12 ,  H01L33/50

Abstract: Provided is a display device. The display device includes a substrate having a sub-pixel area. In some examples, the substrate may have or define a plurality of sub-pixel areas. A light-emitting diode (LED) and a thin-film transistor for driving the LED are disposed in the sub-pixel area. An extended light path layer is disposed on the substrate and is configured to surround the sub-pixel area. Accordingly, it is possible so as to improve the luminous efficiency of the display device.

公开(公告)号：US10429566B2

公开(公告)日：2019-10-01

申请号：US15846693

申请日：2017-12-19

Applicant: LG Display Co., Ltd.

Inventor： MinJae Kang ,  Jaeyong Choi ,  MyungWon Seo ,  Kiyong Yang ,  SeungJun Lee

IPC: F21V8/00 ,  G02F1/1333 ,  G02F1/1335

Abstract: Disclosed are a light source module, a backlight unit including the same, and an LCD device including the same, which prevent image quality and reliability from being degraded. The light source module includes a plurality of light sources mounted on a printed circuit board (PCB), an optical member provided on the PCB to surround the plurality of light sources, and a conductive member coupled to the optical member. The conductive member includes a protrusion grounding the conductive member.

公开(公告)号：US11569409B2

公开(公告)日：2023-01-31

申请号：US16954438

申请日：2018-09-20

Applicant: LG Display Co., Ltd.

Inventor： Seungjun Lee ,  Myungsoo Han ,  Kiyong Yang

IPC: H01L33/00 ,  H01L25/075 ,  H01L21/67

Abstract: Embodiments of the present disclosure relate to a transfer head assembly and an LED transfer apparatus, and more particularly, to a transfer head assembly and an LED transfer apparatus in which a plurality of pickup units picks up LEDs, which are adhered to the upper surfaces of the LEDs, and transfers the LEDs to a display substrate. According to the embodiments of the present disclosure, a large number of LEDs located on a wafer substrate or a carrier substrate can be transferred in bulk to a display substrate. Thus, it is possible to rapidly perform the transfer process of the LEDs.

公开(公告)号：US20210083142A1

公开(公告)日：2021-03-18

申请号：US16954438

申请日：2018-09-20

Applicant: LG Display Co., Ltd.

Inventor： Seungjun Lee ,  Myungsoo Han ,  Kiyong Yang

IPC: H01L33/00 ,  H01L25/075

Abstract: Embodiments of the present disclosure relate to a transfer head assembly and an LED transfer apparatus, and more particularly, to a transfer head assembly and an LED transfer apparatus in which a plurality of pickup units picks up LEDs, which are adhered to the upper surfaces of the LEDs, and transfers the LEDs to a display substrate. According to the embodiments of the present disclosure, a large number of LEDs located on a wafer substrate or a carrier substrate can be transferred in bulk to a display substrate. Thus, it is possible to rapidly perform the transfer process of the LEDs.

公开(公告)号：US10606122B2

公开(公告)日：2020-03-31

申请号：US15835166

申请日：2017-12-07

Applicant: LG Display Co., Ltd.

Inventor： MyungWon Seo ,  Jaeyong Choi ,  Kiyong Yang ,  MinJae Kang ,  SeungJun Lee

IPC: G02F1/1335 ,  F21V8/00 ,  G02F1/1343

Abstract: Disclosed are a light source module, a backlight unit including the same, and a liquid crystal display device including the same, which prevent image quality and reliability from being degraded. The light source module includes a printed circuit board (PCB), a plurality of light sources mounted on the PCB, an optical member provided on the PCB to surround the plurality of light sources, an antistatic cover supported to the optical member to cover the plurality of light sources, and a ground member grounding the antistatic cover.